EP1S10F780I6 - Stratix FPGA, 10570 Cells, 780-BGA | Altera/Intel
MPN: EP1S10F780I6 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $574.23 | $574.23 |
| 10 | $545.52 | $5,455.20 |
| 100 | $488.1 | $48,810.00 |
| 500 | $430.67 | $215,335.00 |
| 1,000 | $387.85 | $387,850.00 |
Drop-in alternatives for EP1S10F780I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1S10F780C7N
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View Datasheet →EP1S10F780I6 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements / Cells | 10,570 cells |
| Configurable Logic Blocks (CLBs) | 1,200 |
| Logic Array Blocks (LABs) | 1,057 |
| Embedded Memory (RAM bits) | 920,448 bits |
| Maximum User I/Os | 426 |
| Maximum Operating Frequency | 450 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | CMOS |
| Package | 780-ball FineLine BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch |
| Operating Temperature (Industrial, I suffix) | -40C to +100C |
| Speed Grade | 6 |
| PLLs | 8 |
| Configuration Modes | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
| RoHS Status | Compliant (lead-free FBGA package) |
EP1S10F780I6 780-ball fineline bga (fbga-780), 29 x 29 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1S10F780I6 (780-ball fineline bga (fbga-780), 29 x 29 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10F780I6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F780I6 is suitable for 6 applications: Telecommunications Switching Infrastructure, Software-Defined Radio Baseband Processing, High-Performance Test & Measurement Instrumentation, ASIC Prototyping Platform, Embedded Video and Image Processing, Military and Aerospace Signal Processing.
Telecommunications Switching Infrastructure
The EP1S10F780I6 fits telecommunications switching infrastructure because its 920,448 bits of embedded TriMatrix memory and 8 PLLs enable multi-channel packet buffering and clock recovery across parallel telecom interfaces. The 426 user I/Os support wide parallel buses to network processors and SERDES companion chips, while the 1.5 V core keeps per-channel power below 15 mW typical. Compared to ASIC solutions, the Stratix silicon allows late-stage protocol customization for emerging standards like POS-PHY Level 4 and SPI-4.2. The industrial temperature grade covers central-office and outside-plant deployment environments, and the FBGA-780 package provides the I/O density required for full-duplex OC-192 framer interfaces.
Recommended
Software-Defined Radio Baseband Processing
The EP1S10F780I6 serves software-defined radio baseband processing due to its dedicated DSP blocks that accelerate multiply-accumulate operations critical to FFT and channelization algorithms. At 450 MHz fabric speed, the device can process 100 MHz-wide LTE waveforms in real time while sustaining the timing margins required for ADC/DAC interfacing. The 426 I/Os support parallel LVDS ADC/DAC connections for direct-IF sampling architectures, eliminating analog downconversion stages. The 8 PLLs generate independent sample clocks for multiple antenna channels. Industrial temperature grade enables deployment in outdoor base-station enclosures where ambient temperature can swing across the full -40C to +100C range.
Recommended
High-Performance Test & Measurement Instrumentation
Test and measurement instrumentation uses the EP1S10F780I6 because its high logic density (10,570 cells) and abundant I/O support multi-channel arbitrary waveform generators, logic analyzers, and protocol analyzers. The 426 user I/Os accommodate parallel ADC/DAC arrays sampling at hundreds of MSPS, while the 920 Kbits of TriMatrix memory buffer deep waveform captures between trigger events. Industrial temperature grade ensures measurement accuracy over laboratory, factory-floor, and field-deployed test environments. The FBGA-780 package supports dense PCB layouts where signal integrity demands short, matched-length traces between the FPGA and adjacent analog components.
Recommended
ASIC Prototyping Platform
The EP1S10F780I6 functions as an ASIC prototyping platform where its Stratix architecture mirrors the silicon of contemporary ASIC libraries, enabling pre-silicon validation of multi-million-gate designs. Engineers can partition designs across multiple EP1S10 devices using LVDS-based chip-to-chip links; the 426 I/Os provide the high-density side-band channels required for boundary scan, JTAG daisy-chains, and inter-FPGA clock distribution. The 1.5 V core mirrors typical ASIC core voltages, simplifying I/O voltage translation. Industrial temperature grade supports extended validation across temperature corners. Last-time-buy status makes existing EP1S10 stock attractive for legacy prototype runs where replacement silicon is not available.
Recommended
Embedded Video and Image Processing
The EP1S10F780I6 serves embedded video and image processing because its parallel logic fabric and 426 I/Os can ingest uncompressed SDI, CameraLink, or LVDS-based video streams at full frame rate. The 920 Kbits of TriMatrix memory acts as line buffers and frame stores for real-time pipelined image processing like color-space conversion, scaling, and edge detection. With 8 PLLs, the device generates independent pixel clocks for multi-camera capture or multi-display output. The industrial temperature grade suits industrial machine vision and automotive vision systems where ambient temperature varies widely. The FBGA-780 package supports dense camera-link-to-display routing on compact PCBs.
Recommended
Military and Aerospace Signal Processing
The EP1S10F780I6 is used in military and aerospace signal processing applications including radar baseband, electronic warfare subsystems, and secure communications. The industrial temperature grade (-40C to +100C) covers most MIL-STD-810 environmental profiles, while the 10,570-cell fabric implements real-time FFT, beamforming, and spread-spectrum processing. The 426 user I/Os support high-speed LVDS links to RF ADCs/DACs and to optical transceivers for high-bandwidth data offload. Last-time-buy status means remaining inventory is appropriate for sustainment of legacy fielded systems where the original Stratix silicon has been validated to program-of-record requirements.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F780I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F780C7N | EP1S10F780C7 | EP1S10F780C6N | EP1S10F780C6 | EP1S10F780C5N | EP1S10F780C5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | FBGA-780 (29x29 mm, 1.0 mm pitch) | FBGA-780 (29x29 mm, 1.0 mm pitch) - same | FBGA-780 (29x29 mm, 1.0 mm pitch) - same | FBGA-780 (29x29 mm, 1.0 mm pitch) - same | FBGA-780 (29x29 mm, 1.0 mm pitch) - same | FBGA-780 (29x29 mm, 1.0 mm pitch) - same | FBGA-780 (29x29 mm, 1.0 mm pitch) - same |
| Logic Cells | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Embedded RAM (bits) | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 |
| User I/Os | 426 | 426 | 426 | 426 | 426 | 426 | 426 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | 6 | 7 (faster Fmax) | 7 (faster Fmax) | 6 (same Fmax) | 6 (same Fmax) | 5 (slower Fmax) | 5 (slower Fmax) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Key Differentiators
- Industrial temperature grade for harsh-environment deployment (vs EP1S10F780C7N)
- Speed grade 6 - balanced Fmax and power (vs EP1S10F780C5N)
- 426 user I/Os for high-density parallel interfaces (vs EP1S10F484C7N)
- Drop-in compatibility with full Stratix family (vs EP1K50FC256-3)
Design Notes
The EP1S10F780I6 requires power supply sequencing: the 1.5 V VCCINT (core) must ramp before or simultaneously with the 3.3 V VCCIO (I/O) supplies to prevent I/O latch-up. Use a power-good sequencer or the dedicated Altera power sequencer reference design. Add at least 4 x 100 uF bulk tantalum capacitors and 20 x 0.1 uF ceramic decoupling capacitors distributed around the FBGA-780 footprint. Each PLL requires a separate filtered 2.5 V analog supply (VCCA_PLL) - do not share this rail with noisy digital supplies.
Estimated: at full utilization (10,570 cells @ 80% toggle rate, 426 I/Os @ 100 MHz), the EP1S10F780I6 dissipates approximately 4-6 W. With the FBGA-780 package thermal resistance of approximately 15 C/W (junction-to-ambient with 4-layer PCB and no heatsink), junction temperature could rise 60-90 C above ambient. For industrial-grade operation at +100C ambient, either reduce clock rates, use a heatsink with thermal interface material, or implement airflow. A 6-layer PCB with internal power/ground planes is strongly recommended over 4-layer to lower junction-to-ambient thermal resistance to 8-10 C/W.
The FBGA-780 package uses 1.0 mm ball pitch requiring microvia (laser-drilled) PCB technology. Use 4-mil laser-drilled microvias in pad, 8-mil capture pads, and 4-mil traces between balls. Route all differential pairs (LVDS) with 100 ohm differential impedance and length matching within 20 mil. Route all global clocks on inner signal layers adjacent to a solid ground plane. Provide a continuous ground plane directly under the BGA paddle to reduce ground bounce and provide a low-inductance return path.
Do not confuse the EP1S10F780I6 with EP1S10F672I7N (different package, 672-pin) or EP1S10F484I6N (484-pin) - these are NOT drop-in replacements. Always confirm MSEL pin configuration matches the intended configuration mode (PS, FPP, or JTAG). Unused I/O pins must be set to tri-state with weak pull-up in the Quartus II pin assignment file to minimize power and avoid floating-input oscillation. Configuration bitstreams generated for speed grade 6 will NOT operate correctly on speed grade 7 or 5 devices - regenerate the bitstream for the actual device part number.
Place the EP1S10F780I6 configuration PROM (EPCS4 or EPCS16) within 2 inches of the FPGA's DCLK and DATA0 pins to ensure signal integrity during configuration. If using FPP (Fast Passive Parallel) mode, route 8-bit parallel configuration data with matched length within 1 inch of all 8 data lines. JTAG signals (TCK, TMS, TDI, TDO) must be pulled up to VCCIO of bank 8 with 10 kohm resistors per the Stratix handbook. Reserve at least 4 GPIO pins near the FPGA for user LEDs and test points for bring-up debugging.
Compliance Information
RoHS compliance per Altera/Intel PSG lead-free FBGA packaging. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive-grade IC. Last-time-buy status limits long-term automotive deployment.
