Intel

EP1S20F672I5N - 18,460 Logic Elements Stratix FPGA, 672-FBGA | Intel

MPN: EP1S20F672I5N ⚠ Lần mua cuối

1.5 V Vdss 672-ball FBGA (FineLine BGA) Package 500 MHz (internal logic) Speed 1,638,400 bits (1.6 Mbit) Memory

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EP1S20F672I5N Tóm tắt

The Intel EP1S20F672I5N is a member of the original Stratix FPGA family, built on a 1.5 V, 130 nm CMOS process and offering 18,460 logic elements (LEs) in a 672-ball FineLine BGA package (speed grade -5, industrial temperature range). It integrates up to 1.6 Mbit of embedded TriMatrix memory, a structured ASIC-like routing fabric, and dedicated DSP blocks for high-performance signal processing, all on a single programmable die.

A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined after manufacturing by a user-supplied configuration bitstream. FPGAs sit above microcontrollers and application-specific standard products (ASSPs) in the programmable-logic hierarchy, providing hardware-level parallelism, deterministic timing, and the ability to re-spin functionality in firmware rather than silicon. The Stratix family, launched by Altera in 2002 (now Intel PSG after the 2015 acquisition), was the first to embed TriMatrix RAM blocks, dedicated DSP multipliers, and high-speed LVDS transceivers, and it established the architectural template later refined in Stratix II, III, and IV.

Key features of the EP1S20F672I5N include 18,460 LEs, 1.6 Mbit of embedded RAM, embedded DSP blocks (variable-width multipliers), a flexible I/O structure supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards, and an internal clock network with PLL support. The 672-pin FBGA package uses a 1.0 mm ball pitch suitable for high-density multi-layer PCBs, and the -5 speed grade designates a slower but cost-optimized timing bin targeting industrial temperature operation from -40 C to +100 C ambient.

Architecturally, the device uses 4-input look-up tables (LUT4) grouped into Logic Array Blocks (LABs), routed by the MultiTrack interconnect. TriMatrix memory provides three block RAM sizes (M512, M4K, M-RAM) optimized for FIFO, ROM, and dual-port buffer patterns. The DSP blocks accelerate multiply-accumulate operations in filters, FFTs, and video pipelines without consuming general-purpose logic.

Typical applications include high-speed digital signal processing, telecommunications line cards, industrial motor control, video and image processing pipelines, ASIC prototyping, and test & measurement instrumentation. The industrial temperature grade makes it suitable for factory-floor equipment, base-station controllers, and other harsh-environment embedded systems.

When designing with this device, use the Quartus II design software (version 13.0 SP1 is the final release supporting Stratix I) for synthesis, place-and-route, and timing closure. Plan for multi-layer PCB stack-up because 672-ball BGA requires at least 6 layers with microvia or via-in-pad technology; signal integrity must be verified for LVDS and DDR interfaces.

This page synthesizes distributor availability, drop-in same-package alternatives drawn from the Stratix I family, and practical design notes not found on a single manufacturer datasheet.

Bộ thay thế dễ dàng lắp đặt cho EP1S20F672I5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1S20F672I5N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Operating Temperature, Family, PLLs.

EP1S20F672C6

Altera

Package: 672-ball FineLine BGA

Speed Grade: C6

Operating Temperature: 0°C to +85°C (Commercial)

So sánh với EP1S20F672I5N →

EP1S20F672C6N

Intel

Package: 672-BBGA (FineLine BGA) 35 x 35 mm

Speed Grade: -6

Operating Temperature: 0 C to 85 C (commercial)

So sánh với EP1S20F672I5N →

EP1S20F672C7

Intel

Package: 672-ball FineLine BGA (35 x 35 mm, 1.27 mm pitch)

Speed Grade: C7

Operating Temperature: 0C to 85C (commercial)

So sánh với EP1S20F672I5N →

EP1S20F672C7N

Intel

Package: 672-FBGA (FineLine BGA)

Speed Grade: C7 (-7)

Operating Temperature: 0°C to +85°C (commercial)

So sánh với EP1S20F672I5N →

EP1S20F672I7N

Intel

Package: 672-BBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch)

Operating Temperature: 0 C to 85 C (Industrial)

So sánh với EP1S20F672I5N →

EP1S20F672C7N

✅ Drop-In

Intel

📦 672-ball FBGA (FineLine BGA)

Stratix (first generation) · Stratix · 18,460 · 18,460 · 2,132 · 1,669,248 bits (426 Kbit total) · 56 (dedicated 18x18 multipliers) · 586

Liên hệ để biết giá

Xem tài liệu →

EP1S20F672C7

✅ Drop-In

Intel

📦 672-ball FBGA (FineLine BGA)

Stratix · Altera Stratix FPGA · 18,460 · 1,669,248 · 426 · 672-ball FineLine BGA (35 x 35 mm, 1.27 mm pitch) · CMOS, SRAM-based

Liên hệ để biết giá

Xem tài liệu →

EP1S20F672C6N

✅ Drop-In

Intel

📦 672-ball FBGA (FineLine BGA)

Stratix · 18,460 · 1,669,248 · 426 · 672-BBGA (FineLine BGA) 35 x 35 mm · 1.27 mm · 1.5 V · CMOS

Liên hệ để biết giá

Xem tài liệu →

EP1S20F672C6

✅ Drop-In

Altera

📦 672-ball FBGA (FineLine BGA)

Altera (now Intel) · Stratix · Stratix (first generation) · 0.13 µm CMOS · 18,460 · 1,846 · 1,669,248 · 426

Liên hệ để biết giá

Xem tài liệu →

EP1S20F672I6N

✅ Drop-In ⚠️ Thông số chưa được xác minh

📦 672-ball FBGA (FineLine BGA)

Same 672-ball FBGA and Stratix I die, industrial temperature, speed grade -6 (faster than -5), N suffix tape-and-reel

📋 Tham chiếu thay thế (không có trong danh mục)

EP1S20F672I7N

✅ Drop-In ⚠️ Thông số chưa được xác minh

Intel

📦 672-ball FBGA (FineLine BGA)

Stratix · 18,460 · 1,846 · 426 · 1,669,248 · 1,669,248 · 8 · 130 nm CMOS

Liên hệ để biết giá

Xem tài liệu →

EP1S20F672I5N Tỷ lệ tối đa & tính chất điện

Family	Stratix
Logic Elements	18,460
Process Technology	130 nm CMOS
Core Voltage	1.5 V
Embedded Memory (TriMatrix)	1,638,400 bits (1.6 Mbit)
Maximum Operating Frequency	500 MHz (internal logic)
DSP Blocks	Yes (variable-width multipliers)
PLLs	Yes (on-chip)
Hộp	672-ball FBGA (FineLine BGA)
Ball Pitch	1.0 mm
Speed Grade	-5 (industrial)
Operating Temperature (Industrial)	-40 C to +100 C ambient
Kiểu lắp đặt	Surface Mount (BGA)
Cấp MSL	3 (per JEDEC J-STD-020)
Trạng thái RoHS	Compliant (lead-free FBGA)

Hướng dẫn cấu hình chân EP1S20F672I5N 672-ball fbga (fineline bga)

Cấu hình chân cho EP1S20F672I5N (672-ball fbga (fineline bga) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.

Bảng cấu hình chân 672-ball fbga (fineline bga) cho EP1S20F672I5N

Không có dữ liệu chân cụ thể sẵn có cho EP1S20F672I5N.

Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.

Ứng dụng tiêu biểu

EP1S20F672I5N phù hợp cho 6 Áp dụngs: Telecommunications Line Card Processing, ASIC Prototyping and Emulation, Industrial Motor Control and Drives, Video and Image Processing Pipelines, Test and Measurement Instrumentation, Aerospace and Defense Signal Processing.

🌐

Telecommunications Line Card Processing

The EP1S20F672I5N fits telecommunications line cards because it delivers 18,460 LEs of programmable logic with embedded TriMatrix memory and DSP blocks on a 130 nm process, all packaged in a 672-ball FBGA that supports multi-lane LVDS I/O for backplane interconnect. The DSP blocks accelerate FEC (forward error correction), echo cancellation, and channel equalization functions that previously required ASSP silicon. Designers map multi-channel processing onto parallel logic structures, achieving deterministic latency far below that of a CPU-based approach. At 500 MHz internal operation the device can sustain OC-48 (2.5 Gbps) aggregate throughput when LVDS pairs are aggregated.

Được đề xuất

🖥️

ASIC Prototyping and Emulation

The EP1S20F672I5N is widely used for ASIC prototyping because its 18,460 LEs combined with 1.6 Mbit of TriMatrix memory can host sub-blocks of larger ASIC designs mapped via synthesis. Quartus II supports rapid place-and-route iteration, and the FPGA can be linked through a Multi-FPGA partitioner to scale to multi-million-gate ASIC prototypes. Its industrial temperature rating lets the same prototype board move between development labs and field trials without re-qualifying thermal margins. The 672-ball FBGA exposes abundant user I/O, allowing designers to break out ASIC pins to external logic analyzers and oscilloscopes for real-time debug.

Được đề xuất

EP1S10F780C7N · Intel EPC8QC100 · Altera

🏭

Industrial Motor Control and Drives

The EP1S20F672I5N suits industrial motor control because its industrial temperature rating (-40 C to +100 C) survives factory-floor environments and the 18,460 LEs run encoder decoding, current-loop control, and space-vector PWM generation in parallel hardware. DSP blocks accelerate Park/Clark transforms and sensorless estimators, while the PLL-rich clock network synchronizes PWM to back-EMF sampling. The 672-ball FBGA exposes sufficient I/O to drive multiple power stages and feedback channels. Migration to newer Cyclone III/IV devices is recommended for new designs, but the Stratix I remains a long-life choice for installed equipment platforms.

Được đề xuất

EP1S20F672I6N (Drop-in speed-grade -6 upgrade for tighter control loops) EP2S30F672I4 · Intel

📺

Video and Image Processing Pipelines

The EP1S20F672I5N is a strong fit for video processing pipelines because its DSP blocks accelerate FIR filters, color-space conversion, and discrete-cosine transform stages that form the core of video codec implementations. The 1.6 Mbit embedded memory acts as line buffers for HD resolution streams, and the 672-ball FBGA exposes LVDS pairs for camera sensor and display panel interconnects. Engineers implement ITU-R BT.656, BT.1120, or HDMI bridge logic in parallel fabric with deterministic timing. Industrial temperature rating allows the design to live in outdoor digital signage and surveillance enclosures.

Được đề xuất

EP1S20F672C6N · Intel EP1S10F672C7N · Altera

🔧

Test and Measurement Instrumentation

The EP1S20F672I5N is ideal for test and measurement instruments because the parallel fabric drives real-time waveform capture, trigger logic, and DSP-based signal analysis at speeds unattainable by microcontrollers. 18,460 LEs implement complex triggering state machines and on-the-fly FFT/Goertzel analysis, while TriMatrix memory stores sample buffers. The industrial temperature grade allows portable instruments to operate from -40 C in field work, and the FBGA package provides ample LVDS for parallel ADC/DAC interfaces. Replacement parts for legacy instruments are critical, and Stratix I remains in long-term supply via last-time-buy channels.

Được đề xuất

EP1S20F672I7N · Intel EPC16UC88 · Altera

✈️

Aerospace and Defense Signal Processing

The EP1S20F672I5N has historically served aerospace and defense applications where deterministic latency and high logic density in an industrial-temperature BGA are mandatory. The 18,460 LEs implement radar pulse compression, beamforming weights, and digital IF stages in parallel fabric, while TriMatrix memory acts as a fast scratchpad for FFT stages. Its 1.5 V core and proven 130 nm process technology have flown in numerous deployed systems over two decades. New programs should consider radiation-hardened Microsemi/PolarFire or newer Intel Stratix V/V10 parts, but legacy systems rely on Stratix I for the rest of their lifecycle.

Được đề xuất

EP1S20F672I6N (Speed-grade -6 industrial variant for timing margin) EP2S60F672I4 · Intel

Tóm tắt các sản phẩm được đề xuất

What is the EP1S20F672I5N?

The EP1S20F672I5N is an Intel (formerly Altera) Stratix FPGA with 18,460 logic elements, 1.6 Mbit of embedded TriMatrix memory, and DSP blocks, built on a 130 nm, 1.5 V CMOS process. It is packaged in a 672-ball FineLine BGA and rated for industrial temperature operation from -40 C to +100 C ambient, as listed by distributor Jotrin Electronics.

How much logic does the EP1S20F672I5N contain?

The EP1S20F672I5N contains 18,460 logic elements (LEs) organized into Logic Array Blocks (LABs) using 4-input look-up tables. This makes it the mid-density member of the original Stratix family, suitable for moderate-complexity DSP, glue logic, and ASIC prototyping workloads.

What is the operating voltage of the EP1S20F672I5N?

The EP1S20F672I5N uses a 1.5 V core supply. The I/O banks are independently powered and can be configured for 1.5 V, 1.8 V, 2.5 V, or 3.3 V standards using separate VCCIO rails, as documented in the Stratix device handbook. Decoupling must follow the multi-rail sequence required by Quartus II power-on ordering.

Where can I buy the EP1S20F672I5N?

The EP1S20F672I5N is sold through authorized distributors Jotrin Electronics, AmpHeo, VEKEMO, Vyrian, and DigiPart as of 2026-09-07. Because Intel has moved the Stratix I family to last-time-buy status, stock is limited and lead times vary - request a quote from each source and compare RoHS paperwork before placing production orders.

What is the price of the EP1S20F672I5N?

Distributor pricing for the EP1S20F672I5N starts at approximately USD 285 per unit at quantity 1 as of 2026-09-07, with volume pricing down to USD 188.90 at 1000 pieces. Final pricing depends on stock availability, country of shipment, and currency conversion; the part is no longer in full production so spot-market premiums apply.

Is the EP1S20F672I5N in stock today?

Stock for the EP1S20F672I5N is constrained and varies daily because Intel has classified the original Stratix family as last-time-buy. Jotrin Electronics and Vyrian list inventory but quantities are limited; long-term designs should migrate to Stratix II (EP2S) or Cyclone III (EP3C) families, both still in active production.

What is the lead time for the EP1S20F672I5N?

Lead time for the EP1S20F672I5N is not guaranteed because the part is on last-time-buy status. Distributors typically quote 8-12 weeks when factory stock is available and 4-6 weeks for limited broker inventory as of 2026-09-07. Confirm each quote in writing with a RoHS/REACH compliance certificate.

What is the difference between EP1S20F672I5N and EP1S20F672C7N?

Both parts share the same 18,460-LE Stratix I die, the same 672-ball FBGA package, and identical pinout, but the I5N variant is speed grade -5 (industrial temperature, slowest timing bin) while the C7N variant is speed grade -7 commercial (fastest timing bin). Drop-in replacement is possible only when the timing closure of the design tolerates the slower -5 bin.

Can EP1S20F672C7N replace EP1S20F672I5N directly?

Yes, the EP1S20F672C7N is a drop-in replacement for the EP1S20F672I5N at the PCB level because both use the 672-ball FBGA with identical pinout and the same Stratix I die. However, the I5N is rated for industrial temperature (-40 C to +100 C) while the C7N is rated for commercial (0 C to +85 C), so verify that the deployment environment stays within the commercial window before substituting.

Where do I download the EP1S20F672I5N datasheet?

The official EP1S20F672I5N datasheet is hosted at intel.com under the Stratix device handbook. Direct datasheet PDFs can also be requested through Jotrin Electronics product page (jotrin.com/product/parts/EP1S20F672I5N) and Vyrian (vyrian.com/p/altera/ep1s20f672i5). Always cross-check the document revision against the silicon stepping on your hardware.

Where can I find the EP1S20F672I5N pinout diagram?

The pinout for the EP1S20F672I5N is provided in the Stratix I device handbook chapter covering the 672-pin FineLine BGA package. Vyrian lists the package code as BGA with 672 ball terminals, and the same pinout table applies to all speed grades and temperature variants sharing the F672 suffix.

What software is required to program the EP1S20F672I5N?

The EP1S20F672I5N is supported by Quartus II design software version 13.0 SP1, which is the final release that targets the original Stratix family. Programming is performed through a JTAG download cable (USB-Blaster or ByteBlaster II) using SRAM Object Files (.sof) or JIC format for persistent storage via an EPC configuration device.

What is the difference between EP1S20F672I5N and EP1S10F672I7N?

The EP1S20F672I5N has 18,460 LEs in a 672-ball FBGA at speed grade -5, while the EP1S10F672I7N has roughly 10,570 LEs in the same 672-ball FBGA at speed grade -7. Pinout is NOT compatible because the smaller-density device leaves some banks unconnected - the EP1S20 design cannot be moved to an EP1S10 footprint without PCB rework.

Is there an equivalent Altera FPGA from another brand?

There is no direct cross-brand drop-in replacement for the EP1S20F672I5N because the 672-ball Stratix I FBGA pinout is Altera/Intel-proprietary. Cross-brand options such as Xilinx Virtex-II or Lattice ECP2 require PCB re-layout, new power sequencing, and re-validation of timing closure. Plan a board spin or a migration to a newer Intel FPGA family when EOL supply tightens.

What are the key specifications of EP1S20F672I5N that engineers should know?

The EP1S20F672I5N delivers 18,460 LEs, 1.6 Mbit embedded TriMatrix memory, DSP blocks with variable-width multipliers, PLL-based clock management, and 672-ball FBGA packaging at 1.0 mm pitch, all running on a 1.5 V core with industrial temperature support. It operates up to 500 MHz internally and supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards.

Can EP1S20F672I5N drive DDR memory interfaces?

The EP1S20F672I5N supports external DDR SDRAM through its dedicated DQS phase-shift circuitry and SSTL I/O standards, but designers must use Quartus II DDR timing analysis to confirm margins. Note that the part uses 1.5 V core voltage and supports 1.8 V/2.5 V/3.3 V VCCIO, so DDR (2.5 V) and DDR2 (1.8 V) interfaces are feasible with the appropriate bank configuration.

Dữ liệu tham khảo kỹ thuật cho EP1S20F672I5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the EP1S20F672I5N when your design requires industrial-temperature operation (-40C to +100C) and the timing closure is achievable at the -5 speed grade - typical for telecom line cards, industrial motor control, ASIC prototyping, and test & measurement where the 18,460 LEs and 1.6 Mbit TriMatrix memory provide sufficient capacity. Upgrade to EP1S20F672I6N or EP1S20F672I7N if Quartus II timing analysis reports negative slack at -5. Select EP1S20F672C7N or C6N only for commercial-temperature products (0C to +85C) where you need a faster speed bin. For new designs, prefer the Cyclone III/IV or Stratix V families because Stratix I is in last-time-buy; the EP1S20F672 family remains in service for legacy systems and long-life programs where re-qualification cost outweighs silicon savings.

So sánh với các sản phẩm thay thế

Tham số	Sản phẩm này	EP1S20F672C7N	EP1S20F672C7	EP1S20F672C6N	EP1S20F672C6	EP1S20F672I6N	EP1S20F672I7N
Brand	Intel	Intel	Intel	Intel	Intel	Intel	Intel
Package	672-ball FBGA (FineLine BGA)	672-ball FBGA - same	672-ball FBGA - same	672-ball FBGA - same	672-ball FBGA - same	672-ball FBGA - same	672-ball FBGA - same
Logic Elements	18,460	18,460	18,460	18,460	18,460	18,460	18,460
Speed Grade	-5	-7 (fastest)	-7 (fastest)	-6	-6	-6	-7 (fastest industrial)
Operating Temperature	Industrial -40C to +100C	Commercial 0C to +85C	Commercial 0C to +85C	Commercial 0C to +85C	Commercial 0C to +85C	Industrial -40C to +100C	Industrial -40C to +100C
Core Voltage	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
Embedded Memory	1.6 Mbit TriMatrix	1.6 Mbit TriMatrix	1.6 Mbit TriMatrix	1.6 Mbit TriMatrix	1.6 Mbit TriMatrix	1.6 Mbit TriMatrix	1.6 Mbit TriMatrix
Lifecycle Status	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy
Packaging Carrier	Tray (N suffix = tape & reel)	Tape & Reel	Tray	Tape & Reel	Tray	Tape & Reel	Tape & Reel

Bảo phân biệt quan trọng

Industrial temperature rating at speed grade -5 (vsEP1S20F672C7N)
Drop-in compatible with all 672-ball Stratix I variants (vsEP1S20F672C6)
Slowest speed grade offers cost advantage in non-timing-critical designs (vsEP1S20F672I7N)

Ghi chú thiết kế

Estimated: at 100% LE utilization running at 300 MHz with toggling I/O, the EP1S20F672I5N dissipates roughly 2.5 W. The 672-ball FBGA's theta_JA is approximately 18 C/W with a 1-oz 4-layer JEDEC test board, so junction temperature rises about 45 C above ambient. Designers must keep ambient below +55 C to stay within the +100 C industrial ceiling, or attach a heatsink spreader through the central ball grid for high-thermal-load designs.

The 672-ball FBGA uses 1.0 mm pitch - plan a 6-layer stack-up with 0.5 oz copper on outer layers and 1 oz on inner planes. Use 0.2 mm laser-drilled microvias or via-in-pad technology with copper-filled plating because dog-bone fan-out exceeds escape routability for 0.15 mm trace/space rules. Provide continuous GND and PWR planes under the BGA to minimize inductance for the multi-rail decoupling network (VCCINT, VCCIO banks, VCC_PLL, VCC_CLK).

LVDS pairs and DDR interfaces require matched-length routing within 50 ps skew per byte group. Use 100-ohm differential impedance for LVDS with broadside-coupled stripline routing on inner layers; SSTL I/O for DDR requires 50-ohm single-ended impedance plus external VTT termination. Always reference the Stratix I device handbook Pin Connection Guidelines because some balls are reserved (no-connect) and others are power/ground depending on configuration scheme.

Do not confuse speed grade -5 with temperature grade I: I5 = industrial temperature, speed grade -5. The C7/C6 variants are commercial-temperature. Substituting I5N with C7N drops the operating temperature range from -40C/+100C to 0C/+85C, which may fail field deployments. Also confirm Quartus II version compatibility - versions older than 13.0 SP1 may not support the latest Stratix I errata fixes.

Thông tin tuân thủ

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Không chì

Yes

Không halogen

Unknown

Khoáng vật xung đột

Compliant

RoHS compliant per FBGA lead-free termination; reach compliant per Intel product declarations; AEC-Q100 not applicable for industrial-grade FPGAs (this part is industrial, not automotive qualified).

Dữ liệu được xác minh vào: 2026-09-07 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Nguồn: Distributor, Distributor, Distributor, Distributor, Distributor, Manufacturer Product Page

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