EP1S40F1508C6NGA - Stratix FPGA, 41250 LEs, 1508-BGA | Intel
MPN: EP1S40F1508C6NGA ✗ Cuối đờiEP1S40F1508C6NGA Tóm tắt
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader programmable-logic taxonomy between CPLDs (smaller, non-volatile glue logic) and ASICs (mask-programmed custom silicon), offering hardware-reconfigurable parallelism for compute-intensive workloads. The Stratix family is the high-performance, SRAM-based flagship of Altera (now Intel PSG) and uses the proprietary Quartus Prime toolchain for synthesis, place-and-route, and bitstream generation.
Key features of the EP1S40F1508C6NGA include 41,250 LEs, 3,423,744 embedded RAM bits, 822 user I/O, and 12 embedded DSP blocks for high-throughput multiply-accumulate operations. The "C6" speed grade targets commercial timing with a -40 °C to +85 °C ambient operating range, while the "N" suffix denotes lead-free / Pb-free assembly. The "GA" package suffix indicates a 1508-ball FineLine BGA with the specific die/pinout revision.
The architecture pairs the LE fabric with TriMatrix on-chip memory (three RAM block sizes per quadrant) and dedicated full-duplex high-speed LVDS I/O capable of DDR SDRAM interfaces. The device supports multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVPECL, LVDS, and PCI/PCI-X, and includes up to 12 PLLs for clock synthesis and skew management. Stratix was the first Altera family with embedded DSP blocks containing hardware multipliers, making it well-suited to baseband signal processing.
Typical applications include telecom baseband processing, software-defined radio, high-speed digital test equipment, military/aerospace signal processing, medical imaging, and high-end ASIC prototyping. The combination of 822 I/O and 12.5 Gbps-class LVDS channels also suits parallel high-speed data acquisition back-ends.
Design consideration: the FCBGA-1508 substrate requires a multi-layer PCB with microvia stack-ups and matched-length routing on critical clocks; PCB designers must follow Intel/Altera's Stratix pin-out guidelines and reference Quartus II / Quartus Prime floorplan files for IO bank assignment, and must respect the supported I/O standards per bank.
This page synthesizes distributor pricing, FPGA family alternatives, and design notes not found on a single manufacturer datasheet page.
Bộ thay thế dễ dàng lắp đặt cho EP1S40F1508C6NGA — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1S40F1508C6NGA (cùng hình factor và footprint) — khác nhau ở Process Technology, Operating Temperature, Package, Total RAM Bits, Logic Elements.
EP1S40F1020C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S30F780C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S25F1020C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S25F780C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S30F1020C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S25F672C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S40F1508C6NGA Tỷ lệ tối đa & tính chất điện
| Family | Stratix |
| Logic Elements | 41,250 |
| Total RAM Bits | 3,423,744 |
| Number of I/O | 822 |
| Number of LABs/CLBs | 4125 |
| DSP Blocks | 12 |
| Package Type | 1508-BGA, FCBGA |
| Package Pin Count | 1508 |
| Nhiệt độ hoạt động | 0 °C to 85 °C (commercial) |
| Speed Grade | C6 |
| Voltage - Supply | 1.5 V core (per Stratix family default) |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Lead-free (N suffix) |
| Process Technology | 0.13 µm CMOS, SRAM-based |
Hướng dẫn cấu hình chân EP1S40F1508C6NGA 1508
Cấu hình chân cho EP1S40F1508C6NGA (1508 gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1S40F1508C6NGA.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1S40F1508C6NGA phù hợp cho 6 Áp dụngs: Telecom Baseband Processing, Software Defined Radio (SDR), ASIC Prototyping and Emulation, High-Speed Data Acquisition, Industrial Imaging and Video Processing, Aerospace and Defense Signal Processing.
Telecom Baseband Processing
The EP1S40F1508C6NGA fits telecom baseband processing because its 41,250 logic elements and 12 dedicated DSP blocks deliver up to 2.7 GMACS of multiply-accumulate throughput, which is the datapath resource required for forward-error-correction (Turbo, Viterbi, Reed-Solomon) and channel-equalization engines. The 822 user I/O through the 1508-BGA also provide enough LVDS pairs for parallel CPRI/OBSAI framer interfaces to a baseband ASIC or DSP cluster, while multiple on-chip PLLs generate the precise clock trees that CPRI line-rate clocks (1.2288 / 3.072 / 4.9152 / 6.144 GHz and dividers) demand. Engineers typically place the EP1S40F1508C6NGA between the RF framer and the network processor, where its TriMatrix RAM buffers symbol streams between PHY and upper-layer stacks.
Được đề xuất
Software Defined Radio (SDR)
Software-defined-radio baseband cards benefit from the EP1S40F1508C6NGA because its 3,423,744 bits of TriMatrix on-chip RAM and 12 DSP blocks can implement wide-bandwidth digital down-conversion, FFT cores, and channelizer filter banks at IF sample rates above 100 MSPS. The 822 LVDS-capable I/O support direct interfacing to dual-channel 14/16-bit ADC front-ends such as the AD9680 family without external logic, and the Stratix PLL block enables low-jitter clock multiplication from a single-board reference oscillator. Compared with a GPU-based SDR approach, the EP1S40F1508C6NGA offers deterministic latency required for protocol timing in tactical and commercial SDR platforms.
Được đề xuất
ASIC Prototyping and Emulation
The EP1S40F1508C6NGA is widely deployed as a building block in multi-FPGA ASIC prototyping platforms because its 822 I/O through the 1508-BGA deliver enough high-speed differential channels to bridge neighbour FPGAs in a partitioned ASIC prototype at hundreds of MHz. Designers can partition an ASIC RTL design across multiple EP1S40F1508C6NGA devices and prototype at near-ASIC speeds using TDM-based pin multiplexing and time-stationary partitioning. The 12 embedded DSP blocks and 3.4 Mbit of block RAM together accommodate modest processor cores and on-chip trace buffers for hardware-assisted debug workflows before the ASIC tape-out.
Được đề xuất
High-Speed Data Acquisition
The EP1S40F1508C6NGA suits high-speed data-acquisition back-ends because its 822 I/O include sufficient LVDS pairs to interface to 8- or 16-channel simultaneous-sampling ADC arrays at 200+ MSPS, while the 3.4 Mbit TriMatrix RAM provides per-channel sample buffering between the ADC data-stream and the PCIe/DDR transfer engine. Engineers implement FIR/CIC decimation filters in DSP blocks to reduce the data-rate before DMA transfer, and the Stratix PLL block generates the low-jitter ADC sampling clock from an onboard crystal. Typical end-equipment includes oscilloscope acquisition ASICs, medical imaging front-ends, and radar digitiser cards.
Được đề xuất
Industrial Imaging and Video Processing
The EP1S40F1508C6NGA serves industrial imaging applications because its parallel LE fabric can process multiple Camera-Link or CoaXPress streams simultaneously, while 822 I/O and on-chip TriMatrix RAM deliver the buffering required for line-scan and area-scan machine-vision pipelines. The 12 DSP blocks accelerate 2D FIR filters, color-space conversion, and Bayer demosaicing, and the Stratix LVDS transceivers accept the high-speed serialiser-deserialiser outputs of modern CMOS image sensors at hundreds of MHz. Industrial cameras and inspection systems benefit from the deterministic-latency fabric compared with GPU approaches, particularly when integration with real-time PLC control is required.
Được đề xuất
Aerospace and Defense Signal Processing
The EP1S40F1508C6NGA (C6 commercial speed grade) has historically been deployed in aerospace and defense signal-processing systems because of its high LE/DSP density and its lead-free 1508-BGA assembly suitable for avionics and ground-based radar applications. The 822 I/O drive multiple synchronous LVDS links to ADC/DAC sub-arrays, while the 12 DSP blocks implement pulse-compression, MTI filtering, and digital beam-forming kernels that dominate radar and electronic-warfare compute budgets. Although the C6 commercial temperature grade limits deployment to controlled environments, the same Stratix EP1S40 die is also offered in industrial speed grades for wider environmental envelopes.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1S40F1508C6NGA — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1S40F1020C6N | EP1S30F780C6N | EP1S25F1020C6N | EP1S25F780C6N | EP1S30F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-BGA, FCBGA | 1020-BGA, FCBGA | 780-BGA, FCBGA | 1020-BGA, FCBGA | 780-BGA, FCBGA | 1020-BGA, FCBGA |
| Logic Elements | 41,250 | 41,250 | 32,470 | 25,660 | 25,660 | 32,470 |
| Embedded RAM (bits) | 3,423,744 | 3,423,744 | 2,215,104 | 1,944,576 | 1,944,576 | 2,215,104 |
| DSP Blocks | 12 | 12 | 10 | 10 | 10 | 10 |
| Speed Grade | C6 (commercial) | C6 | C6 | C6 | C6 | C6 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Highest logic density in the Stratix EP1S40 family tier (vsEP1S30F780C6N)
- Maximum TriMatrix RAM density in the EP1S40 line (vsEP1S25F1020C6N)
- Highest user I/O count in the EP1S40 family (vsEP1S40F1020C6N)
- 12 dedicated DSP blocks for high-MACPU throughput (vsEP1S25F780C6N)
Ghi chú thiết kế
The 1508-ball FCBGA package of the EP1S40F1508C6NGA mandates an HDI PCB stack-up with microvias (typically 0.1 mm laser-drilled) or via-in-pad construction; the 1.0 mm ball pitch cannot be reliably breakout-routed with conventional through-hole vias. Top-layer ground pour directly under the BGA keeps the return-path inductance below 100 pH, and 0.1 µF plus 0.01 µF X7R decoupling capacitors must be placed within 100 mils of every VCCIO/VCCINT ball per the Stratix Device Handbook. For LVDS pairs targeting >500 Mbps, use 100 Ω differential stripline geometry with length-matching within ±10 mil across bytes.
Estimated: at maximum LE utilization (~80%) with the C6 commercial speed grade and 1.5 V VCCINT, the EP1S40F1508C6NGA draws roughly 1.5–2.5 W of core power plus I/O power that scales with toggle rate. The 1508-BGA exposes a thermal pad through the inner-row balls, so a continuous top-layer ground pour plus 4–6 thermal vias directly under the die region is essential to keep junction temperature below 100 °C. Without adequate thermal relief, the commercial 0 °C–85 °C ambient specification can be violated inside a sealed enclosure, particularly in fanless industrial designs.
Configuration mode pins MSEL[2:0] must be tied to defined logic levels (never floating) per the configuration scheme; floating MSEL pins are a common boot-failure root cause on Stratix EP1S40 boards. JTAG pins TCK, TMS, TDI, and TRST must follow the IEEE 1149.1 recommended termination, and nCONFIG must be tied to VCCIO through a 4.7 kΩ pull-up if left unused. Do not leave configuration-data pins DCLK floating in passive-serial mode — they need to be pulled to known states via the EPCS/EPC device. Also note that the EP1S40 does not support 1.2 V VCCINT; using the wrong core voltage permanently damages the die.
Thông tin tuân thủ
Lead-free ball finish confirmed by trailing 'N' suffix per Altera/Intel ordering code convention. Halogen-free status and conflict-minerals compliance not stated in provided data — set to 'unknown' per data authenticity rules.
