EP1S40F780I6N - Stratix FPGA 41,250 LEs, 615 I/O, 780-FBGA | Intel
MPN: EP1S40F780I6N ✗ Cuối đờiEP1S40F780I6N Tóm tắt
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose digital logic function is defined after manufacturing via a configuration bitstream stored in SRAM. FPGAs occupy a unique position in the compute hierarchy between general-purpose CPUs/GPUs and fixed-function ASICs, offering hardware-level parallelism, deterministic latency, and in-system reprogrammability. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors, and are commonly used for prototyping, low-volume production, and applications requiring custom datapaths that benefit from hardware acceleration.
Key features include 12 embedded DSP blocks for fixed- and floating-point arithmetic, support for up to 12 PLLs for flexible clock synthesis, and high-speed LVDS I/O capable of multi-gigabit operation. The device also integrates dedicated high-speed transceiver resources and hardware multipliers that accelerate DSP pipelines without consuming general logic.
The architecture combines 4-input look-up tables (LUTs) per logic element, embedded memory blocks of M512, M4K, and M-RAM sizes, and a structured routing fabric. The 3,423,744 total RAM bits are distributed across TriMatrix memory blocks that can be configured as single- or dual-port RAM, ROM, or FIFO. This combination is ideal for digital signal processing, data path acceleration, and protocol bridging where deterministic throughput and reconfiguration matter more than absolute unit cost.
Typical applications include high-performance digital signal processing (radar, beamforming, software-defined radio), telecom line-card interface bridging, industrial machine-vision and motion control, ASIC prototyping, and high-speed serial protocol aggregation. The wide DSP and memory bandwidth make it particularly suitable for data-intensive parallel workloads.
When designing with the EP1S40F780I6N, ensure a clean 1.5 V core rail with low-impedance decoupling and proper sequencing relative to the I/O banks. The 780-FBGA package requires a multi-layer PCB with microvia technology; signal-integrity simulation of high-speed LVDS pairs is recommended before tape-out.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix family, and PCB layout considerations not collected in the manufacturer datasheet, giving procurement and engineering teams a single decision-ready reference.
Bộ thay thế dễ dàng lắp đặt cho EP1S40F780I6N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1S40F780I6N (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, DSP Blocks, Series, Speed Grade.
EP1S40F780C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S40F780C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S40F780C6N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP1S40F780I6
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S30F780I6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S40F780I6N Tỷ lệ tối đa & tính chất điện
| Series | Stratix |
| Logic Elements | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| Total RAM Bits | 3,423,744 |
| User I/O Pins | 615 |
| Core Voltage (VCCINT) | 1.425 V to 1.575 V |
| DSP Blocks | 12 |
| Embedded Multipliers | Yes (per DSP block) |
| Configuration Method | SRAM-based, volatile |
| Hộp | 780-FBGA (29 x 29 mm, 1.0 mm pitch) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | -40C to +100C (industrial) |
| Cấp MSL | 3 |
| Lead Free | Yes |
| Process Node | 150 nm CMOS |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân EP1S40F780I6N 780-fbga (29 x 29 mm, 1.0 mm pitch)
Cấu hình chân cho EP1S40F780I6N (780-fbga (29 x 29 mm, 1.0 mm pitch) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1S40F780I6N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1S40F780I6N phù hợp cho 6 Áp dụngs: Software-Defined Radio (SDR) Baseband, Telecom Line-Card Protocol Bridging, Industrial Machine Vision and Motion Control, ASIC Prototyping and Emulation, Radar Signal Processing, High-Speed Serial Protocol Aggregation.
Software-Defined Radio (SDR) Baseband
The EP1S40F780I6N fits SDR baseband processing because its 41,250 logic elements and 12 DSP blocks deliver the multiply-accumulate throughput required for channelization, FFTs, and digital up/down conversion. The 3,423,744 bits of TriMatrix memory buffer IQ samples and FFT coefficients close to the DSP fabric, avoiding external memory round-trips. The 615 user I/Os aggregate multiple LVDS data paths and external ADC/DAC interfaces; the 780-FBGA package's 1.0 mm pitch is compatible with the multi-layer PCB stackup used in telecom line cards. Placed as the central reconfigurable fabric between front-end ADCs and a host processor, it provides the deterministic latency and parallel datapath that CPUs cannot.
Được đề xuất
Telecom Line-Card Protocol Bridging
The EP1S40F780I6N bridges telecom protocols such as POS-PHY, SPI-4.2, and custom SERDES backplanes because its 615 user I/O pins expose dozens of high-speed LVDS lanes needed for parallel telecom interfaces. The 1.5 V core is tolerant of the noise-coupled environment in central-office line cards when paired with proper decoupling, and the industrial -40C to +100C range covers outside-plant cabinets. The 12 DSP blocks accelerate framing and FEC tasks while the TriMatrix memory buffers packet bursts. Placed between a network processor and the PHY, the device replaces multiple fixed-function bridge chips and adapts to evolving line-card standards.
Được đề xuất
Industrial Machine Vision and Motion Control
The EP1S40F780I6N suits machine-vision pipelines and multi-axis motion controllers because the 41,250 logic elements can host several Camera Link or CoaXPress channelizers in parallel, and the 12 DSP blocks accelerate image convolution, edge detection, and PID loops. The 3,423,744 RAM bits frame-buffer multiple image lines without external SRAM, while the 615 I/Os aggregate parallel pixel buses, encoder inputs, and PWM outputs to motor drivers. Industrial -40C to +100C operation tolerates factory-floor temperatures. Placed at the heart of a vision controller, the FPGA ingests raw pixel data and outputs processed results with deterministic microsecond latency.
Được đề xuất
ASIC Prototyping and Emulation
The EP1S40F780I6N is widely used as an ASIC prototype vehicle because the Stratix logic architecture maps cleanly from RTL targeting ASIC libraries, and the abundant TriMatrix memory models large register files or scratchpad RAMs. With 41,250 LEs and 615 I/Os, it can host a significant fraction of a modern SoC for bring-up, firmware development, and pre-silicon software validation. The SRAM-based volatile configuration supports rapid design iteration. Placed on a multi-FPGA prototyping board, the device provides cycle-accurate execution for design teams validating pre-tapeout silicon.
Được đề xuất
Radar Signal Processing
The EP1S40F780I6N serves radar pulse-compression, MTI, and beamforming cores because the 12 DSP blocks deliver the multiply-accumulate throughput for matched filters, FFTs, and adaptive beamforming weights. The 3,423,744 RAM bits stage range-Doppler maps and adaptive weights on-chip, eliminating external memory accesses in the critical loop. The industrial temperature range supports ground-based radar enclosures. Placed between the RF front-end and the radar display processor, the FPGA compresses pulse data and forms beams in real time.
Được đề xuất
High-Speed Serial Protocol Aggregation
The EP1S40F780I6N aggregates multiple lower-speed serial links (UART, SPI, I2C, custom LVDS) because its 615 I/O pins and abundant logic can implement dozens of soft serial controllers plus a high-speed uplink. The TriMatrix memory buffers packet bursts and the 12 DSP blocks handle CRC, encryption, and compression offload. The 780-FBGA package supports the controlled-impedance stackup required for clean LVDS. Placed as a protocol-aggregation gateway, the FPGA offloads the host CPU and consolidates disparate industrial buses into a single high-speed uplink.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1S40F780I6N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1S40F780C8N | EP1S40F780C7N | EP1S40F780C6N | EP1S40F780I6 | EP1S30F780I6N |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm, 1.0 mm pitch) | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 33,880 (-18%) |
| User I/O Pins | 615 | 615 | 615 | 615 | 615 | 615 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 6 | 8 (faster) | 7 | 6 | 6 | 6 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Same-package speed-grade upgrade path (vsEP1S40F780C8N)
- Industrial temperature range (vsEP1S40F780C6N)
- Full 41,250-LE capacity at industrial temp (vsEP1S30F780I6N)
Ghi chú thiết kế
Estimated: routing the 780-FBGA at 1.0 mm pitch requires at minimum a 4-layer PCB with HDI microvias (laser-drilled, ~0.1 mm via diameter) and 0.5 oz copper on outer layers. Use via-in-pad or staggered microvia fan-outs to escape the inner ball rows. Maintain a continuous reference plane on layer 2 and layer N-1 for controlled-impedance LVDS traces (typically 100 ohm differential). For full device utilization at >250 MHz, target 8-10 layer stackup with dedicated power planes.
Estimated: VCCINT at 1.5 V can draw 1.5-3 A during configuration burst and high-utilization operation; budget a DC-DC converter rated for at least 5 A peak with low output ripple (<30 mVpp). Each VCCIO bank draws additional current scaled to the number of switching outputs; place 0.1 uF + 10 uF ceramic decoupling within 100 mil of every supply pin. A power-sequencer or rail-sequencing IC is required so that VCCINT comes up before VCCIO to avoid I/O latch-up during FPGA configuration.
High-speed LVDS and clock traces must be length-matched within 20 mil for clocks and 50 mil for data to avoid bit-error skew. Per Stratix handbook, use IBIS models to simulate worst-case reflections on multi-load buses. Series-damping resistors on lightly-loaded outputs dampen ringing; place them within 200 mil of the driver. For source-synchronous interfaces, route clock and data on the same layer with matched impedance and minimal vias.
Do not assume the EP1S40F780I6N is in production - the Stratix family was discontinued by Intel/Altera in the late 2000s. Plan a migration path to Cyclone IV/V or Arria II/10 GX families for new designs. When sourcing from independent distributors, validate date code, lot traceability, and authenticity (X-ray, decapsulation) before placing volume orders, as counterfeit Stratix parts have been observed in the open market.
Thông tin tuân thủ
RoHS and lead-free per Stratix device datasheet 'LEAD FREE' marking. No AEC-Q100 automotive qualification - original Stratix family was not designed for automotive reliability. Halogen-free status not explicitly stated in verified data - marked unknown.
