EP1S40F780C8N - Stratix FPGA 41,250 LEs 780-BGA | Intel / Altera
MPN: EP1S40F780C8N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 25 | $155 | $3,875.00 |
| 100 | $142 | $14,200.00 |
| 250 | $130 | $32,500.00 |
Drop-in alternatives for EP1S40F780C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S40F780C7N
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View Datasheet →EP1S40F780C8
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View Datasheet →EP1S40F780C6
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View Datasheet →EP1S40F780C7
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View Datasheet →EP1S30F780C8N
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View Datasheet →EP2S40F780C5N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S40F780C8N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Series | EP1S |
| Logic Elements | 41,250 |
| Embedded Memory | 3,423,744 bits |
| Embedded Multipliers | 615 (18-bit x 18-bit) |
| Package | 780-ball FCBGA (FineLine BGA), 29 mm x 29 mm, 1 mm pitch |
| Logic Family | CMOS |
| Supply Voltage (Core) | 1.5 V |
| Speed Grade | C8 (commercial) |
| Operating Temperature | 0 °C to +85 °C |
| I/O Standard Support | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X |
| Maximum LVDS Data Rate | 840 Mbps |
| PLL Blocks | Up to 12 |
| Memory Type | TriMatrix (MRAM, M512, M4K blocks) |
| External Memory Interface | DDR, DDR-II, QDR, SDRAM |
| Configuration Method | Passive serial, Fast passive parallel, JTAG |
| Design Software | Quartus II |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP1S40F780C8N Pin Configuration
| Pin A1 | IO — General purpose I/O bank (refer to datasheet bank table) |
| Pin A2 | IO — General purpose I/O bank (refer to datasheet bank table) |
| Pin A3 | IO — General purpose I/O bank (refer to datasheet bank table) |
| Pin A4 | VCCIO — I/O supply voltage (bank-specific, refer to datasheet) |
| Pin A5 | GND — Ground |
| Pin A6 | VCCINT — Core 1.5 V supply |
| Pin A7 | IO — General purpose I/O bank (refer to datasheet bank table) |
| Pin A8 | IO — General purpose I/O bank (refer to datasheet bank table) |
| Pin A9 | IO — General purpose I/O bank (refer to datasheet bank table) |
| Pin A10 | IO — General purpose I/O bank (refer to datasheet bank table) |
| Pin B1 | IO — General purpose I/O bank (refer to datasheet bank table) |
| Pin B2 | IO — General purpose I/O bank (refer to datasheet bank table) |
| Pin B3 | GND — Ground |
| Pin B4 | VCCINT — Core 1.5 V supply |
| Pin B5 | VCCIO — I/O supply voltage (bank-specific) |
| Pin B6 | IO — General purpose I/O bank (refer to datasheet bank table) |
| Pin B7 | GND — Ground |
| Pin B8 | IO — General purpose I/O bank (refer to datasheet bank table) |
| Pin B9 | VCCINT — Core 1.5 V supply |
| Pin B10 | IO — General purpose I/O bank (refer to datasheet bank table) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S40F780C8N is suitable for 7 applications: ASIC Prototyping and Emulation, Telecom Baseband Processing, High-Speed Data Acquisition Systems, Video and Image Processing Pipelines, DSP Coprocessor for Embedded Systems, Industrial Control and Motor Drive, Radar and Signal Intelligence.
ASIC Prototyping and Emulation
The EP1S40F780C8N's 41,250 logic elements and 615 embedded multipliers make it well suited to ASIC prototyping where multiple million-gate designs must be emulated on FPGA fabric before tape-out. The TriMatrix memory totaling 3,423,744 bits provides on-chip storage for emulating register files and FIFOs, while 12 PLLs handle multi-clock ASIC domains. Designers typically partition the ASIC across multiple Stratix devices using known-good FPGA prototyping flows.
Recommended
Telecom Baseband Processing
Telecom baseband designs require high DSP throughput and parallel datapaths. The EP1S40F780C8N delivers 615 18x18-bit multipliers, enabling multi-channel QAM, OFDM, or turbo-decoder implementations. The C8 speed grade supports clock rates sufficient for 3G/early-4G baseband sample rates, while LVDS I/O up to 840 Mbps interfaces cleanly with high-speed ADCs and DACs in radio cards.
Recommended
High-Speed Data Acquisition Systems
High-speed DAQ systems rely on FPGAs to capture multi-GSps ADC streams and perform real-time channelization. The EP1S40F780C8N's LVDS I/O at 840 Mbps pairs naturally with interleaved ADC front ends, while 3.4 Mbits of embedded memory buffers ADC samples between trigger events. The C8 grade provides sufficient timing margin for 200-300 MHz internal datapaths typical in digital oscilloscopes and radar receivers.
Recommended
Video and Image Processing Pipelines
Real-time HD video processing (e.g., 1080p60) requires hundreds of DSP operations per pixel and frame buffers large enough to hold multiple full frames. The EP1S40F780C8N's 615 multipliers and 3.4 Mbits of memory support full HD video pipelines including deinterlacing, scaling, and color-space conversion. The 780-ball BGA exposes enough LVDS pairs to drive dual-channel DVI/HDMI output directly.
Recommended
DSP Coprocessor for Embedded Systems
Used as a DSP coprocessor alongside a host CPU, the EP1S40F780C8N offloads compute-intensive kernels (FFT, FIR, correlation) for medical imaging, software-defined radio, or scientific instruments. The 615 multipliers provide 30+ GMACs of 18-bit throughput, and 12 PLLs handle multiple sample-rate domains. The PCI/PCI-X I/O support enables direct interface to PowerPC or x86 host processors in legacy embedded platforms.
Recommended
Industrial Control and Motor Drive
Industrial servo drives and motion controllers demand deterministic multi-axis control loops running at tens of kHz. The EP1S40F780C8N implements encoder interfaces, PID controllers, and fieldbus protocols (EtherCAT, Profibus) in hardware, while the 615 multipliers accelerate FOC (field-oriented control) math. The C8 commercial temperature grade (0 °C to +85 °C) suits factory-floor enclosures; industrial-grade I8 variants serve wider ranges.
Recommended
Radar and Signal Intelligence
Phased-array radar and SIGINT systems require massive parallel DSP for beamforming and pulse compression. The EP1S40F780C8N's high multiplier count and 3.4 Mbit memory support hundreds of channels of matched-filter processing, while LVDS I/O streams digitized antenna signals into the fabric at 840 Mbps. The C8 grade provides timing margin for 200+ MHz beamformer clocks typical in S-band radar front ends.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F780C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F780C7N | EP1S40F780C8 | EP1S30F780C8N | EP2S40F780C5N |
|---|---|---|---|---|---|
| Package | 780-ball FCBGA (29x29 mm) | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 33,880 (-18%) | 40,940 (Stratix II) |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 | 3,423,744 | 2,233,344 (-35%) | 3,375,168 (Stratix II) |
| Embedded Multipliers | 615 | 615 | 615 | 384 (-38%) | 384 (Stratix II architecture) |
| Speed Grade | C8 | C7 (faster) | C8 (same) | C8 (same) | C5 (faster) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Active (legacy) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2 V |
Key Differentiators
- Slowest speed grade of the EP1S40 family offers lowest cost and lowest power (vs EP1S40F780C7N)
- Highest logic density in the original Stratix family (vs EP1S30F780C8N)
- Original Stratix architecture with mature Quartus II tool support (vs EP2S40F780C5N (Stratix II))
Design Notes
The EP1S40F780C8N at full utilization can dissipate 5-10 W depending on clock rate and toggle activity. Estimated: at 50% toggle activity and 250 MHz core clock, expect ~7 W. The 780-ball FCBGA exposes a thermal pad array that requires a PCB thermal pad with at least 4 thermal vias for heat transfer to inner copper planes. Designers should follow the Stratix Board Design Guidelines for thermal pad land pattern.
The 780-ball FCBGA at 1 mm pitch requires a multi-layer PCB with 6-8 layers, microvia or laser-drilled stacked vias for breakout, and controlled-impedance routing for LVDS pairs. Signal integrity analysis using HyperLynx or similar tools is recommended for LVDS at 840 Mbps. Decoupling: place 0.1 uF X7R ceramic capacitors within 100 mil of every VCCIO/VCCINT pin pair, with bulk 100 uF tantalum or polymer caps near the FPGA.
Do not assume Stratix and Stratix II pinouts are identical even in the same 780-ball package: bank assignments, power pin counts, and configuration pin locations differ between EP1S and EP2S families. Always re-run pin assignment and verify against the target device's pinout file before committing to a board respin. Also note that the C8 speed grade may fail timing closure in designs that just meet timing on C6 silicon; budget additional slack or move to C7/C6.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For industrial temperature range, choose the EP1S40F780I8N variant.
