EP1SGX25FF1020C5 - Stratix GX FPGA 25.6K LE 607 I/O FBGA-1020
MPN： EP1SGX25FF1020C5 ✗ 停產EP1SGX25FF1020C5 概覽
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be redefined after manufacture, sitting in the hierarchy programmable logic device (PLD) -> FPGA -> high-density programmable logic. Stratix GX extends the Stratix architecture by embedding 3.125 Gbps multi-gigabit transceivers alongside the general-purpose fabric, allowing designers to consolidate parallel bus logic and serial link PHYs onto one silicon die. Compared with ASICs, FPGAs offer faster time-to-market and lower NRE; compared with CPLDs they deliver far higher logic capacity and DSP throughput.
Key features of the EP1SGX25FF1020C5 include 1.69 Mbits of embedded RAM (TriMatrix memory), 6 embedded PLLs, 607 user I/Os, dedicated DDR SDRAM interfaces with quarter-rate support, and up to 20 multi-gigabit transceivers (MGT) depending on package variant. The 1 mm pitch 33 x 33 mm FC-FBGA-1020 package exposes the maximum user I/O count in the Stratix GX family at this density tier.
Architecturally the device integrates Look-Up Table (LUT)-based logic cells with carry chains for arithmetic, hardware multiplier blocks optimized for DSP, and source-synchronous circuitry for DDR memory controllers. The Quartus II design suite (now Quartus Prime) provides synthesis, place-and-route, and timing closure for the entire Stratix GX device family, including SignalTap II logic analyzer, SOPC Builder, and DSP Builder tool flows. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), fast passive parallel (FPP), and JTAG modes through dedicated configuration pins.
Typical applications include 10 Gbps network interface cards, SONET/SDH framer/mapper equipment, SD/HD-SDI video routing and processing, high-speed serial backplanes, protocol bridging (SPI 4.2, SGMII, XAUI), and DSP co-processing cards. Embedded multipliers and TriMatrix memory make the device particularly well-suited to Reed-Solomon and FEC implementations commonly found in OTN/SONET designs.
When designing, verify that the FBGA-1020 land pattern, 1 mm ball pitch, and 33 x 33 mm PCB footprint are accommodated in your board stack-up with controlled-impedance layers for MGT signals. Use Quartus PowerPlay early power estimation tools to size decoupling and thermal relief before place-and-route; in production, use SignalTap II to validate multi-gigabit link margin. Consult the Stratix GX Device Family Data Sheet (Section I) for transceiver channel count, PLL configuration, and JTAG boundary-scan details specific to this part.
This page synthesizes Stratix GX device specs, distributor pricing from authorized channels, same-package alternatives from the EP1SGX25 family, and engineering notes that go beyond the manufacturer datasheet's electrical tables.
直接替換替代品，適用於 EP1SGX25FF1020C5 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX25FF1020C5 （相同外形與佔位） — 差異在於 Package Type, Speed Grade, RoHS Status, Operating Temperature, Package.
EP1SGX25FF1020C4
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C5
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25FF1020C5 最大額定值與電氣特性
| Family | Stratix GX |
| Series | Stratix |
| Logic Elements | 25,660 |
| LABs/CLBs | 2,566 |
| Total Memory Bits | 1,694,720 bits (1.69 Mbit) |
| Number of I/O | 607 |
| Supply Voltage (Core) | 1.5 V |
| Embedded PLLs | 6 |
| Logic Family | CMOS |
| Process Technology | 130 nm |
| 工作溫度 | 0 C to 85 C (commercial) |
| Speed Grade | C5 |
| Package Type | FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| 安裝類型 | Surface Mount |
| Lead Free | Yes |
| RoHS 狀態 | Compliant |
| Configuration Modes | PS, PPS, FPP, JTAG |
| Design Tool | Quartus II / Quartus Prime |
EP1SGX25FF1020C5 fc-fbga-1020 (33 x 33 mm, 1 mm pitch) 腳位配置指南
EP1SGX25FF1020C5（fc-fbga-1020 (33 x 33 mm, 1 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX25FF1020C5.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX25FF1020C5 適用於 6 應用s: 10 Gbps Network Interface Cards, SONET/SDH Framer and Mapper Equipment, SD/HD-SDI Video Routing and Processing, High-Speed Serial Backplane Bridging, DSP Co-Processing Cards, Industrial Protocol Bridge Gateways.
10 Gbps Network Interface Cards
The EP1SGX25FF1020C5 is well-suited to 10 Gbps network interface cards because its 20 embedded multi-gigabit transceivers (MGTs) up to 3.125 Gbps can be aggregated as XAUI or 10G-KR links via soft PCS logic. The 25,660 logic elements and 1.69 Mbit TriMatrix memory provide headroom for an inline packet processor plus classifier and policing tables, while 607 user I/O pins accept external DDR SDRAM and PCI-X buses. Quartus II IP cores deliver turnkey XAUI, SPI 4.2, and SGMII interfaces. Compared with discrete PHY plus CPLD designs, the integrated transceiver approach reduces BOM cost and PCB area.
推薦
SONET/SDH Framer and Mapper Equipment
Telecom framer and mapper designs benefit from the EP1SGX25FF1020C5 because its hardware multipliers and TriMatrix memory deliver real-time Reed-Solomon and FEC processing at OC-192/STM-64 line rates. The 20 MGTs aggregate STS-1 tributaries at 51.84 Mbps into a 2.488 Gbps optical payload, eliminating external PHY chips. The 607 I/O pins accept backplane SERDES, TDM buses, and management Ethernet. Quartus II SOPC Builder provides OTN and SONET/SDH soft cores so designers can integrate framer, mapper, and overhead processor onto one silicon die, reducing board complexity and BOM.
推薦
SD/HD-SDI Video Routing and Processing
Broadcast video routers and processing cards use the EP1SGX25FF1020C5 because the 607 user I/O pins accept dozens of SDI inputs while the 25,660 logic elements implement de-embedders, audio mixers, and on-screen display generators in a single device. The 130 nm CMOS core provides deterministic latency for audio/video synchronization, and TriMatrix memory buffers HD frames without external SRAM. Quartus II provides SMPTE 259M/292M/424M PHY IP and built-in SDI test pattern generators. Compared with ASIC-based routers, the FPGA approach allows rapid support for new formats like 1080p50/60 and 3G-SDI.
推薦
High-Speed Serial Backplane Bridging
ATCA and MicroTCA backplanes route 3.125 Gbps serial links across multiple cards, and the EP1SGX25FF1020C5 provides up to 20 MGT channels with built-in 8b/10b encoding and clock-data recovery, eliminating external SERDES chips. The 25,660 logic elements implement a custom protocol layer such as Serial RapidIO, PCI Express Gen1, or proprietary fabric bridging. The 1020-ball FBGA exposes all MGT channels plus 607 user I/O for mezzanine cards, while 6 PLLs provide the multiple clock domains needed for asymmetric uplink/downlink configurations.
推薦
DSP Co-Processing Cards
DSP co-processing accelerator cards use the EP1SGX25FF1020C5 because its embedded 18x18 multipliers deliver peak DSP throughput of 2.0 GMACs while the 1.69 Mbit TriMatrix memory provides double-buffered coefficient storage. PCI-X or SPI 4.2 host interfaces consume only a fraction of the 25,660 logic elements, leaving room for custom filter kernels. The 130 nm process provides deterministic DSP latency required for radar, sonar, and software-defined radio front-ends. Quartus II DSP Builder integrates with MATLAB/Simulink for floating-to-fixed point conversion and rapid kernel iteration.
推薦
Industrial Protocol Bridge Gateways
Industrial gateway designs convert between PROFINET, EtherCAT, Modbus TCP, and CANopen protocols using the EP1SGX25FF1020C5 because its 607 user I/O pins accept multiple industrial field buses simultaneously and its 25,660 logic elements implement full protocol stacks without external CPUs. The 1.5V commercial temperature range (0 C to 85 C) covers most factory-floor cabinets, while industrial-grade parts like EP1SGX25FF1020I5N extend coverage to -40 C to 100 C. Quartus II Nios II soft-core integration allows custom deterministic scheduling for EtherCAT distributed clocks.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX25FF1020C5 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX25FF1020C4 | EP1SGX25DF1020C5 | EP1SGX25DF1020C5N | EP1SGX25DF1020C6 | EP1SGX25DF1020C7 |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | FC-FBGA-1020 (33x33 mm) | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed Grade | C5 | C4 (slower) | C5 (same) | C5 (same) | C6 (faster) | C7 (fastest) |
| Die Revision | FF | FF (same) | DF (newer) | DF (newer) | DF (newer) | DF (newer) |
| User I/O | 607 | 607 | 607 | 607 | 607 | 607 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Lead-Free Terminal Finish | Yes | Yes | Yes | Yes (N suffix) | Yes | Yes |
主要差異化特點
- C5 speed grade balances performance and yield (對比EP1SGX25DF1020C6)
- FF die revision is broadly available in franchised channel inventory (對比EP1SGX25DF1020C5N)
- 20 embedded MGTs eliminate external SERDES (對比EP1S40F1020C6)
設計說明
The FC-FBGA-1020 package uses 1.0 mm ball pitch on a 33 x 33 mm body, which demands a high-density PCB stack-up with microvia or stacked-via technology. Per Altera Stratix GX Hardware Reference guidance, route all MGT (multi-gigabit transceiver) pairs on the top signal layer with continuous ground reference planes underneath, and keep MGT reference clock traces length-matched to within 100 mils. Allow at least four PCB layers dedicated to VCCINT core power with low-inductance decoupling (220 uF bulk + 0.1 uF + 0.01 uF ceramic per rail per Quartus II pin planning output).
Estimated: at full fabric utilization (25,660 LEs @ 75% toggle rate, 20 active MGTs @ 3.125 Gbps), the EP1SGX25FF1020C5 dissipates approximately 9-12 W. Without a heatsink or forced airflow, junction temperature can exceed 100 C in enclosed chassis. Stratix GX thermal management guidance recommends a minimum 200 LFM airflow, thermal vias under the central BGA ball array, and copper coin or heat-spreader bonded to the package top side. Always validate with the Quartus II PowerPlay early power estimator before committing to a mechanical design.
Three frequent pitfalls when designing with EP1SGX25FF1020C5: (1) connecting JTAG TRST directly to GND instead of a proper reset circuit - this can mask boundary-scan failures; (2) using the same reference clock for MGT and general fabric PLLs without proper isolation, causing jitter injection into the MGTs; (3) failing to decouple VCC_PLL1-VCC_PLL6 independently per Altera Stratix GX Hardware Reference - each PLL has its own analog supply pin that must be filtered with a ferrite bead and 0.1 uF + 10 uF bypass network. Always generate pin assignments through Quartus II Pin Planner to avoid these errors.
合規資訊
RoHS compliant per Altera/Intel product family documentation (lead-free BGA balls). Not AEC-Q100 qualified - commercial temperature range only. REACH compliance assumed from manufacturer disclosure but not separately documented in web data.
