EP3C5E144C7N - Cyclone III FPGA, 5K LE, 144-LQFP | Intel / Altera
Référence : EP3C5E144C7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $21.95 | $21,95 |
| 10 | $19.75 | $197,50 |
| 100 | $17.56 | $1 756,00 |
| 500 | $15.36 | $7 680,00 |
| 1 000 | $13.17 | $13 170,00 |
EP3C5E144C7N Présentation
A Cyclone III FPGA is a programmable logic device that combines lookup-table (LUT)-based logic fabric with embedded memory blocks (M9K), embedded multipliers (18x18), and Phase-Locked Loops (PLLs) on a single die. In the broader taxonomy, the EP3C5E144C7N belongs to the SRAM-based programmable logic family, sitting alongside Cyclone IV (next-generation low-power FPGA), Cyclone V (28 nm successor), and MAX series CPLDs. The device is non-volatile-of-configuration: bitstreams are loaded from external flash or JTAG into on-chip SRAM configuration cells, enabling unlimited re-programmability for prototyping, NPI, and field-upgradable end products.
Key features include 5,136 logic elements organized into 290 logic array blocks (LABs), 46 embedded M9K memory blocks (414 Kbits), 46 embedded 18x18 multipliers, and up to 4 PLLs with 4 dedicated clock outputs. The device supports configuration schemes including Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG, and includes Cyclone III architectural primitives such as high-speed LVDS I/O, on-chip termination (OCT), and the Altera remote update IP for in-field bitstream swapping. The 144-pin EQFP package provides a thermal resistance of approximately 22 C/W with a properly soldered exposed pad.
The Cyclone III architecture targets cost-sensitive high-volume applications where the previous-generation Cyclone II could not deliver sufficient logic density, DSP bandwidth, or low static power. The 65 nm process enables typical static power in the milliamp range while retaining deterministic timing closure at 200+ MHz for common logic functions and 250 MHz for DSP blocks. I/O banks support LVDS, SSTL, HSTL, LVCMOS, and PCI/PCI-X signaling standards with per-bank voltage reference supplies, enabling direct interface to DDR/DDR2 SDRAM without external level shifters.
Typical applications include industrial motor control and PLC logic, video surveillance and image-processing front ends, portable medical instrumentation, low-cost software-defined radio (SDR) baseband, and consumer audio/video processing. The combination of low static power, moderate logic capacity, and a small footprint package makes the EP3C5E144C7N a strong fit for space-constrained, cost-driven designs that still need hardware-accelerated DSP or parallel sensor aggregation.
When designing with this device, allocate at least an 8-layer PCB stack-up with continuous GND planes for signal integrity on LVDS pairs, and use the Quartus II / Quartus Prime design suite (13.0 or later recommended for final bitstream) with the Cyclone III device library installed. Decoupling must include 0.1 uF and 10 uF capacitors placed within 5 mm of every VCCIO/VCCINT ball pair, and the exposed thermal pad must be soldered to a 1 sq. inch copper pour to keep junction temperature within the C7 commercial rating.
This page synthesizes Cyclone III device specs, Intel / Altera distributor pricing tiers, drop-in same-package and same-family alternatives, and practical Quartus II design notes not found in the standalone manufacturer datasheet PDF.
Alternatives de remplacement direct pour EP3C5E144C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C5E144C7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Family, Total Memory Bits.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C5E144C8N
✅ Remplacement direct✓ En stock
$22.1 / unité
Voir la fiche technique →EP3C5E144I7N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EP3C10E144C7N
✅ Remplacement direct✓ En stock
$45.2 / unité
Voir la fiche technique →EP4CE5E144C7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3C16Q240C8N
✅ Remplacement direct✓ En stock
$30.9 / unité
Voir la fiche technique →EP3C25E144C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3C40E144C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3C5E144C7N Valeurs maximales et caractéristiques électriques
| Device Family | Cyclone III |
| Logic Elements (LE) | 5,136 |
| Logic Array Blocks (LAB) | 290 |
| Total Memory Bits | 423,936 |
| Embedded M9K Memory Blocks | 46 |
| Embedded 18x18 Multipliers | 46 |
| PLLs | 4 |
| User I/Os | 94 |
| Speed Grade | C7 (7 ns delay) |
| Process Technology | TSMC 65 nm low-power |
| Boîtier | 144-LQFP Exposed Pad (EQFP-144), 22x22 mm, 0.5 mm pitch |
| Température de jonction en fonctionnement | 0C to +85C |
| Configuration Modes | AS, PS, FPP, JTAG |
| I/O Standards | LVDS, SSTL, HSTL, LVCMOS, PCI/PCI-X |
| Statut RoHS | Compliant |
Configuration des broches de EP3C5E144C7N
| Broche 1 | I/O — User I/O (Bank 1) |
| Broche 2 | I/O — User I/O (Bank 1) |
| Broche 3 | I/O — User I/O (Bank 1) |
| Broche 4 | I/O — User I/O (Bank 1) |
| Broche 5 | I/O — User I/O (Bank 1) |
| Broche 6 | VCCIO1 — I/O Bank 1 voltage supply |
| Broche 7 | I/O — User I/O (Bank 1) |
| Broche 8 | I/O — User I/O (Bank 1) |
| Broche 9 | I/O — User I/O (Bank 1) |
| Broche 10 | GND — Ground |
| Broche 11 | I/O — User I/O (Bank 1) |
| Broche 12 | I/O — User I/O (Bank 1) |
| Broche 13 | I/O — User I/O (Bank 1) |
| Broche 14 | I/O — User I/O (Bank 1) |
| Broche 15 | I/O — User I/O (Bank 1) |
| Broche 16 | VCCIO1 — I/O Bank 1 voltage supply |
| Broche 17 | I/O — User I/O (Bank 1) |
| Broche 18 | I/O — User I/O (Bank 1) |
| Broche 19 | I/O — User I/O (Bank 1) |
| Broche 20 | I/O — User I/O (Bank 1) |
| Broche 21 | I/O — User I/O (Bank 1) |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O (Bank 1) |
| Broche 24 | I/O — User I/O (Bank 1) |
| Broche 25 | I/O — User I/O (Bank 1) |
| Broche 26 | I/O — User I/O (Bank 1) |
| Broche 27 | I/O — User I/O (Bank 1) |
| Broche 28 | VCCIO1 — I/O Bank 1 voltage supply |
| Broche 29 | I/O — User I/O (Bank 1) |
| Broche 30 | I/O — User I/O (Bank 1) |
| Broche 31 | I/O — User I/O (Bank 1) |
| Broche 32 | I/O — User I/O (Bank 1) |
| Broche 33 | I/O — User I/O (Bank 1) |
| Broche 34 | GND — Ground |
| Broche 35 | I/O — User I/O (Bank 1) |
| Broche 36 | I/O — User I/O (Bank 1) |
| Broche 37 | VCCINT — Core voltage supply (1.2 V) |
| Broche 38 | I/O — User I/O (Bank 2) |
| Broche 39 | I/O — User I/O (Bank 2) |
| Broche 40 | I/O — User I/O (Bank 2) |
| Broche 41 | I/O — User I/O (Bank 2) |
| Broche 42 | I/O — User I/O (Bank 2) |
| Broche 43 | VCCIO2 — I/O Bank 2 voltage supply |
| Broche 44 | I/O — User I/O (Bank 2) |
| Broche 45 | I/O — User I/O (Bank 2) |
| Broche 46 | I/O — User I/O (Bank 2) |
| Broche 47 | I/O — User I/O (Bank 2) |
| Broche 48 | I/O — User I/O (Bank 2) |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O (Bank 2) |
| Broche 51 | I/O — User I/O (Bank 2) |
| Broche 52 | I/O — User I/O (Bank 2) |
| Broche 53 | I/O — User I/O (Bank 2) |
| Broche 54 | I/O — User I/O (Bank 2) |
| Broche 55 | VCCIO2 — I/O Bank 2 voltage supply |
| Broche 56 | I/O — User I/O (Bank 2) |
| Broche 57 | I/O — User I/O (Bank 2) |
| Broche 58 | I/O — User I/O (Bank 2) |
| Broche 59 | I/O — User I/O (Bank 2) |
| Broche 60 | I/O — User I/O (Bank 2) |
| Broche 61 | GND — Ground |
| Broche 62 | I/O — User I/O (Bank 2) |
| Broche 63 | I/O — User I/O (Bank 2) |
| Broche 64 | I/O — User I/O (Bank 2) |
| Broche 65 | I/O — User I/O (Bank 2) |
| Broche 66 | I/O — User I/O (Bank 2) |
| Broche 67 | VCCIO2 — I/O Bank 2 voltage supply |
| Broche 68 | I/O — User I/O (Bank 2) |
| Broche 69 | I/O — User I/O (Bank 2) |
| Broche 70 | VCCINT — Core voltage supply (1.2 V) |
| Broche 71 | I/O — User I/O (Bank 3) |
| Broche 72 | I/O — User I/O (Bank 3) |
| Broche 73 | I/O — User I/O (Bank 3) |
| Broche 74 | I/O — User I/O (Bank 3) |
| Broche 75 | I/O — User I/O (Bank 3) |
| Broche 76 | VCCIO3 — I/O Bank 3 voltage supply |
| Broche 77 | I/O — User I/O (Bank 3) |
| Broche 78 | I/O — User I/O (Bank 3) |
| Broche 79 | I/O — User I/O (Bank 3) |
| Broche 80 | I/O — User I/O (Bank 3) |
| Broche 81 | I/O — User I/O (Bank 3) |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — User I/O (Bank 3) |
| Broche 84 | I/O — User I/O (Bank 3) |
| Broche 85 | I/O — User I/O (Bank 3) |
| Broche 86 | I/O — User I/O (Bank 3) |
| Broche 87 | I/O — User I/O (Bank 3) |
| Broche 88 | VCCIO3 — I/O Bank 3 voltage supply |
| Broche 89 | I/O — User I/O (Bank 3) |
| Broche 90 | I/O — User I/O (Bank 3) |
| Broche 91 | I/O — User I/O (Bank 3) |
| Broche 92 | I/O — User I/O (Bank 3) |
| Broche 93 | I/O — User I/O (Bank 3) |
| Broche 94 | GND — Ground |
| Broche 95 | I/O — User I/O (Bank 3) |
| Broche 96 | I/O — User I/O (Bank 3) |
| Broche 97 | I/O — User I/O (Bank 3) |
| Broche 98 | I/O — User I/O (Bank 3) |
| Broche 99 | I/O — User I/O (Bank 3) |
| Broche 100 | VCCIO3 — I/O Bank 3 voltage supply |
| Broche 101 | I/O — User I/O (Bank 3) |
| Broche 102 | I/O — User I/O (Bank 3) |
| Broche 103 | VCCINT — Core voltage supply (1.2 V) |
| Broche 104 | I/O — User I/O (Bank 4) |
| Broche 105 | I/O — User I/O (Bank 4) |
| Broche 106 | I/O — User I/O (Bank 4) |
| Broche 107 | I/O — User I/O (Bank 4) |
| Broche 108 | I/O — User I/O (Bank 4) |
| Broche 109 | VCCIO4 — I/O Bank 4 voltage supply |
| Broche 110 | I/O — User I/O (Bank 4) |
| Broche 111 | I/O — User I/O (Bank 4) |
| Broche 112 | I/O — User I/O (Bank 4) |
| Broche 113 | I/O — User I/O (Bank 4) |
| Broche 114 | I/O — User I/O (Bank 4) |
| Broche 115 | GND — Ground |
| Broche 116 | I/O — User I/O (Bank 4) |
| Broche 117 | I/O — User I/O (Bank 4) |
| Broche 118 | I/O — User I/O (Bank 4) |
| Broche 119 | I/O — User I/O (Bank 4) |
| Broche 120 | I/O — User I/O (Bank 4) |
| Broche 121 | VCCIO4 — I/O Bank 4 voltage supply |
| Broche 122 | I/O — User I/O (Bank 4) |
| Broche 123 | I/O — User I/O (Bank 4) |
| Broche 124 | I/O — User I/O (Bank 4) |
| Broche 125 | I/O — User I/O (Bank 4) |
| Broche 126 | I/O — User I/O (Bank 4) |
| Broche 127 | GND — Ground |
| Broche 128 | I/O — User I/O (Bank 4) |
| Broche 129 | I/O — User I/O (Bank 4) |
| Broche 130 | I/O — User I/O (Bank 4) |
| Broche 131 | I/O — User I/O (Bank 4) |
| Broche 132 | I/O — User I/O (Bank 4) |
| Broche 133 | VCCIO4 — I/O Bank 4 voltage supply |
| Broche 134 | I/O — User I/O (Bank 4) |
| Broche 135 | I/O — User I/O (Bank 4) |
| Broche 136 | VCCINT — Core voltage supply (1.2 V) |
| Broche 137 | TCK — JTAG test clock |
| Broche 138 | TMS — JTAG test mode select |
| Broche 139 | TDO — JTAG test data out |
| Broche 140 | TDI — JTAG test data in |
| Broche 141 | nCONFIG — Configuration control |
| Broche 142 | nSTATUS — Configuration status |
| Broche 143 | MSEL0 — Configuration mode select 0 |
| Broche 144 | MSEL1 — Configuration mode select 1 |
Applications typiques
EP3C5E144C7N convient pour 6 applications: Industrial Motor Control and PLC Logic, Video Surveillance and Image Processing Front End, Portable Medical Instrumentation, Low-Cost Software-Defined Radio (SDR) Baseband, Consumer Audio/Video Processing, Industrial Networking and Protocol Bridging.
Industrial Motor Control and PLC Logic
The EP3C5E144C7N's 5,136 logic elements and 46 embedded 18x18 multipliers fit single-axis to dual-axis motor control loops including field-oriented control (FOC), trapezoidal commutation, and PID compensation. The 94 user I/Os support encoder inputs (QEP), Hall sensor feedback, PWM outputs to gate drivers, and isolated communication interfaces (RS-485, CAN, Modbus). The C7 speed grade closes 200 MHz logic timing, sufficient for 50 kHz current loop rates. Compared to DSP-only solutions, the FPGA enables parallel sampling of multiple ADC channels synchronized to PWM edges, eliminating the sequential bottleneck of a single-core DSP.
Recommandé
Video Surveillance and Image Processing Front End
The EP3C5E144C7N's 46 M9K memory blocks (414 Kbits total) and LVDS I/O support enable direct interface to CMOS image sensors at up to 1080p60 resolution using LVDS or sub-LVDS signaling. The 5,136 logic elements implement real-time pipelines for demosaicing, color correction, edge detection, and H.264 baseline encoding pre-processing. The 4 PLLs generate the precise pixel clocks required by MIPI CSI-2 or parallel LVDS sensor interfaces. The 65 nm low-power process keeps total FPGA power below 1.5W at full utilization, enabling fanless surveillance camera designs.
Recommandé
Portable Medical Instrumentation
The EP3C5E144C7N's low static power (typically under 100 mW at idle) and small 22x22 mm EQFP-144 package make it suitable for battery-powered medical devices such as pulse oximeters, ECG monitors, and portable ultrasound front ends. The 5,136 logic elements implement digital filtering, FFT analysis, and adaptive baseline removal on multi-channel ADC streams. The 46 embedded 18x18 multipliers accelerate biquad filter chains and wavelet transforms. On-chip PLLs generate the clock trees needed for simultaneous-sampling ADC interfaces at 1-10 MSPS, while the 94 user I/Os connect to TFT displays, touch panels, and isolated serial ports.
Recommandé
Low-Cost Software-Defined Radio (SDR) Baseband
The EP3C5E144C7N's 46 embedded 18x18 multipliers and 423 Kbits of block RAM enable low-cost SDR baseband implementations for narrowband protocols such as LoRa, Sigfox, NB-IoT, and IEEE 802.15.4 (Zigbee/Thread). The 4 PLLs generate the quadrature sample-rate clocks needed for digital downconversion and channelization. The LVDS I/O pairs interface directly to high-speed ADCs and DACs at 50-100 MSPS. Compared to a microcontroller + DSP solution, the FPGA's parallel processing enables simultaneous demodulation of multiple channels and real-time FEC decoding without timing jitter.
Recommandé
Consumer Audio/Video Processing
The EP3C5E144C7N's logic density and embedded multipliers fit consumer audio processors for HDMI upscaling, audio format conversion (Dolby Digital, DTS), and HDMI CEC bridging. The 94 user I/Os support HDMI, S/PDIF, I2S, and LVDS display interfaces simultaneously. The C7 speed grade enables 1080p60 video processing with line buffers in M9K memory. Cyclone III's low static power keeps enclosure temperatures within consumer product safety limits, while the exposed pad package simplifies thermal management in slim AV receiver chassis.
Recommandé
Industrial Networking and Protocol Bridging
The EP3C5E144C7N's 94 user I/Os and 5,136 logic elements support multi-protocol industrial gateway designs bridging EtherCAT, PROFINET, EtherNet/IP, and Modbus TCP on a single device. The M9K memory blocks implement packet buffers and protocol state machines, while the LVDS I/O pairs enable MII/RGMII PHY interfacing at 1 Gbps. The C7 speed grade closes 200 MHz logic timing sufficient for line-rate protocol processing. Compared to discrete microcontrollers, the FPGA enables hardware-accelerated CRC, checksum, and protocol state management without CPU bottlenecks.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C5E144C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C5E144C8N | EP3C5E144I7N | EP3C10E144C7N | EP4CE5E144C7N | EP3C16Q240C8N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 5,136 | 5,136 | 5,136 | 10,320 | 5,136 | 15,408 |
| Speed Grade | C7 (7 ns) | C8 (8 ns) | I7 (7 ns, industrial temp) | C7 (7 ns) | C7 (7 ns) | C8 (8 ns) |
| Operating Junction Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/Os | 94 | 94 | 94 | 94 | 94 | 94 |
| Embedded Memory (Kbits) | 414 | 414 | 414 | 414 | 270 | 504 |
| 18x18 Multipliers | 46 | 46 | 46 | 46 | 25 | 56 |
| Bitstream Compatibility | Cyclone III baseline | Compatible (same family) | Compatible (same family) | Compatible (same family) | Not compatible (Cyclone IV E) | Compatible (same family) |
Principaux différenciateurs
- Lowest-density Cyclone III in 144-EQFP with full feature set (vs EPM570GT100C3N (MAX II CPLD))
- Pin-compatible logic upgrade within same family (vs EP3C5E144C8N (C8 speed grade))
- Industrial temperature variant available in same package (vs EP3C5E144I7N (industrial temp))
Notes de conception
The EP3C5E144C7N requires separate VCCINT (1.2 V core) and VCCIO (1.5V/1.8V/2.5V/3.3V I/O bank) rails. Per the Cyclone III device datasheet, VCCINT tolerance is +/-5% and each VCCIO bank can be independently configured. Place 0.1 uF and 10 uF decoupling capacitors within 5 mm of every VCCINT/VCCIO pin pair. A ferrite bead or pi-filter on each rail is recommended for designs with high-speed LVDS or external SDRAM interfaces.
Estimated: At full utilization (5,136 LE, 46 multipliers, 250 MHz logic), the EP3C5E144C7N dissipates approximately 0.8-1.2 W. The exposed thermal pad must be soldered to a continuous ground copper pour of at least 1 square inch to maintain the C7 commercial 85C junction temperature. Without the exposed pad soldered, junction temperature can exceed 100C at moderate utilization, triggering thermal slowdown. Use 4-thermal-via array (0.3 mm drill) on the exposed pad for optimal heat transfer.
Allocate at least an 8-layer PCB stack-up with continuous GND planes for signal integrity on LVDS pairs. Per the Cyclone III device handbook, LVDS traces must be 100 ohm differential with intra-pair skew under 5 ps. Route configuration signals (TCK/TMS/TDO/TDI/nCONFIG/nSTATUS) away from high-speed switching nodes. Place the configuration flash (EPCS4/EPCS16) within 25 mm of the FPGA's active serial pins for reliable AS configuration.
Pin assignments should be planned using the Quartus II / Quartus Prime Pin Planner before PCB layout. Group high-speed I/O (LVDS, DDR/DDR2) in adjacent banks to minimize routing congestion. Per the Cyclone III device handbook, each I/O bank has dedicated VREF pins for SSTL/HSTL reference voltages - place VREF bypass capacitors (0.1 uF + 10 uF) within 3 mm of each VREF pin. Avoid routing clock signals across I/O bank boundaries to prevent skew issues.
Do not leave MSEL0/MSEL1 pins floating - they must be tied to VCCINT or GND to select the configuration mode (AS/PS/FPP/JTAG). Per the Cyclone III device handbook, floating MSEL pins cause configuration failures. The nCONFIG pin must be pulled to VCCINT through a 10 kohm resistor. Cyclone III bitstreams are NOT compatible with Cyclone IV or Cyclone V - recompile in Quartus Prime when migrating to newer families.
Informations de conformité
RoHS compliant per Intel / Altera product page. Lead-free (Pb-free) reflow compatible. Not AEC-Q100 qualified - Cyclone III is not an automotive-grade family. For automotive applications, consider Cyclone IV E or Cyclone V with AEC-Q100 documentation.
