Intel

EP4CE115F23C8N - Cyclone IV E FPGA 114K LE 484-BGA | Intel

MPN: EP4CE115F23C8N ✓ Hoạt động

1.2 V Vdss 484-ball FineLine BGA (F23) Package C8 Speed 3,981,312 bits (3.8 Mbit) Memory

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EP4CE115F23C8N Tóm tắt

The Intel EP4CE115F23C8N is a Cyclone IV E Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA package, delivering 114,480 logic elements, 280 user I/Os, and 3,981,312 bits of embedded memory (approximately 3.8 Mbits) on a low-power 60 nm process. It is the largest density option in the Cyclone IV E family, designed for cost-sensitive, high-volume applications that still require substantial logic capacity.

A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O cells can be programmed by the customer after manufacture. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), alongside simpler CPLDs, and above fixed-function ASICs in design flexibility. The Cyclone IV E family targets the mid-density segment, balancing cost, power, and performance for industrial, consumer, and communications designs.

Key features of the EP4CE115F23C8N include 114,480 logic elements arranged in an architecture of adaptive logic modules (ALMs), 432 embedded 18x18 multipliers for DSP-style signal processing, 280 general-purpose I/Os supporting LVDS, LVCMOS, SSTL, and other single-ended and differential standards, and dedicated embedded memory blocks totaling 3.8 Mbits. The device supports up to four general-purpose PLLs for clock management and serialization.

The Cyclone IV E architecture uses a 60 nm low-power process with a 1.2 V core supply, achieving substantially lower static and dynamic power than the previous Cyclone III generation. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes using industry-standard SRAM-based programming cells. The 484-BGA FineLine BGA package offers a 1.0 mm ball pitch, suitable for multilayer PCBs in mid-to-high-complexity designs.

Typical applications for the EP4CE115F23C8N include industrial motor control and machine vision, video processing and display bridges, telecom line cards, automotive driver-assistance pre-processing, and embedded control in test and measurement equipment. The combination of high logic density, embedded multipliers, and rich I/O makes it well-suited for designs that previously required larger or more expensive FPGAs.

When designing with this device, plan power decoupling around each PLL region and use the Quartus II / Quartus Prime toolchain for synthesis, place-and-route, and timing closure. Verify signal-integrity on high-speed LVDS pairs and confirm ball-pattern compatibility against any proposed migration part before PCB respin.

This page synthesizes distributor pricing, package information, drop-in alternatives, and design considerations not found in a single manufacturer datasheet, helping engineers evaluate the EP4CE115F23C8N for new designs or as a replacement candidate in legacy projects.

Bộ thay thế dễ dàng lắp đặt cho EP4CE115F23C8N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP4CE115F23C8N (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Embedded 18x18 Multipliers, Configuration Modes, Family.

EP4CE115F23I7N

Intel

Package: 484-FBGA (F23) 23x23 mm, 1.0 mm pitch

Process Technology: 60 nm low-power CMOS (TSMC)

Family: EP4CE115 (F23 package)

So sánh với EP4CE115F23C8N →

EP4CE115F23I8LN

Intel

Package: 484-FBGA (23x23 mm, 1.0 mm pitch)

Process Technology: 60 nm

Embedded 18x18 Multipliers: 66

So sánh với EP4CE115F23C8N →

EP4CE15F23C8N

Intel

Package: 484-BGA (FineLine BGA, F23, 23x23 mm, 1.0 mm pitch)

Process Technology: 60 nm low-leakage CMOS

Configuration Modes: AS / PS / JTAG / FPP

So sánh với EP4CE115F23C8N →

EP4CE40U19A7N

Intel

Package: 484-ball FBGA (U19)

Process Technology: 60 nm low-power CMOS

Configuration Modes: JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP)

So sánh với EP4CE115F23C8N →

EP4CE55F23C8

Altera

Package: 484-ball FineLine BGA (FBGA)

Embedded 18x18 Multipliers: 154

Family: Cyclone IV E (EP4CE55)

So sánh với EP4CE115F23C8N →

EP4CE75F23C6

Intel

Package: 484-FBGA (F23), 23x23 mm, 1.0 mm pitch

Process Technology: 60 nm

Family: Cyclone IV E (EP4CE75)

So sánh với EP4CE115F23C8N →

EP4CE75F23C6N

Intel

Process Technology: 60 nm

Family: Cyclone IV E

So sánh với EP4CE115F23C8N →

EP4CE75F23C7

Intel

Package: 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch

Process Technology: 60 nm low power (TSMC)

Embedded 18x18 Multipliers: 244

So sánh với EP4CE115F23C8N →

EP4CE75F23C7N

Intel

Package: 484-BGA (FBGA-484)

Process Technology: 60 nm low-power CMOS

Embedded 18x18 Multipliers: 266

So sánh với EP4CE115F23C8N →

EP4CE75F23C8

Intel

Package: 484-FBGA (23 x 23 mm, 1.0 mm pitch)

Process Technology: 60 nm low-power CMOS

Embedded 18x18 Multipliers: 274

So sánh với EP4CE115F23C8N →

EP4CE75F23C8N

Intel

Package: 484-BGA (FBGA-484)

Process Technology: 60 nm low-power CMOS

Embedded 18x18 Multipliers: 274

So sánh với EP4CE115F23C8N →

EP4CE75F23I7

Intel

Process Technology: 60 nm low-power

Embedded 18x18 Multipliers: 274

Configuration Modes: AS, PS, FPP, JTAG

So sánh với EP4CE115F23C8N →

EP4CE115F23C7N

✅ Drop-In

📦 484-ball FineLine BGA (F23)

same 484-BGA F23 ball map, faster C7 speed grade vs C8 (~10-15% Fmax improvement)

📋 Tham chiếu thay thế (không có trong danh mục)

EP4CE115F23I7N

✅ Drop-In

Intel

📦 484-ball FineLine BGA (F23)

Cyclone IV E · EP4CE115 (F23 package) · 114,480 · 3,981,312 bits · 280 · 7,180 · 4 · 266

Liên hệ để biết giá

Xem tài liệu →

EP4CE115F23C8N

✅ Drop-In

Intel

📦 484-ball FineLine BGA (F23)

Cyclone IV E · 114,480 LE · 3,981,312 bits (3.8 Mbit) · 280 · 432 · 4 · 60 nm

Liên hệ để biết giá

Xem tài liệu →

EP4CE115F23A7N

✅ Drop-In ⚠️ Thông số chưa được xác minh

📦 484-ball FineLine BGA (F23)

same 484-BGA F23 ball map, automotive temperature grade -40C to +125C vs commercial

📋 Tham chiếu thay thế (không có trong danh mục)

EP4CE115F23C9N

✅ Drop-In ⚠️ Thông số chưa được xác minh

📦 484-ball FineLine BGA (F23)

same 484-BGA F23 ball map, slower C9 speed grade vs C8 (~10% Fmax reduction, cost saving)

📋 Tham chiếu thay thế (không có trong danh mục)

EP4CE115F23C8N

✅ Drop-In

Intel

📦 484-ball FineLine BGA (F23)

Cyclone IV E · 114,480 LE · 3,981,312 bits (3.8 Mbit) · 280 · 432 · 4 · 60 nm

Liên hệ để biết giá

Xem tài liệu →

EP4CE115F23C8N Tỷ lệ tối đa & tính chất điện

Series	Cyclone IV E
Logic Elements	114,480 LE
Embedded Memory	3,981,312 bits (3.8 Mbit)
User I/O Count	280
Embedded 18x18 Multipliers	432
General-purpose PLLs	4
Process Node	60 nm
Core Voltage	1.2 V
Hộp	484-ball FineLine BGA (F23)
Ball Pitch	1.0 mm
Kiểu lắp đặt	Surface Mount (BGA)
Nhiệt độ hoạt động	0C to +85C (Commercial)
Speed Grade	C8
Trạng thái RoHS	Compliant

Hướng dẫn cấu hình chân EP4CE115F23C8N 484-ball fineline bga (f23)

Cấu hình chân cho EP4CE115F23C8N (484-ball fineline bga (f23) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.

Bảng cấu hình chân 484-ball fineline bga (f23) cho EP4CE115F23C8N

Không có dữ liệu chân cụ thể sẵn có cho EP4CE115F23C8N.

Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.

Ứng dụng tiêu biểu

EP4CE115F23C8N phù hợp cho 6 Áp dụngs: Industrial Motor Control, Video Processing and Display Bridge, Telecom Line Card Interface, Automotive Driver-Assistance Pre-Processing, Test and Measurement Equipment, Embedded Control and Machine Vision.

🏭

Industrial Motor Control

The EP4CE115F23C8N suits industrial motor control with 114,480 logic elements for multi-axis FOC algorithms, 432 embedded 18x18 multipliers for Park/Clark transforms, and 280 I/Os for encoder, resolver, and PWM interfaces. At 1.2 V core, it dissipates less than older Cyclone III designs, fitting enclosed IP54 cabinets. Designers should use the Quartus Prime DSP Builder for floating-point motor loops and verify PWM update latency against the speed-grade C8 timing model.

Được đề xuất

📺

Video Processing and Display Bridge

For HDMI-to-LVDS or MIPI-to-RGB bridges, the EP4CE115F23C8N's 432 embedded multipliers handle real-time color-space conversion (YUV422 to RGB888) at 1080p60 with headroom for scaling. The 3.8 Mbit embedded memory supports line-buffer storage without external SRAM. The 484-BGA F23 package allows routing of 24 LVDS pairs required for dual-channel LVDS displays. Engineers must consider HSIO bank placement for differential pairs during floorplanning.

Được đề xuất

EP4CE1152F23C7N · Altera

🌐

Telecom Line Card Interface

Telecom line cards benefit from the EP4CE115F23C8N's rich I/O count (280 pins) for multi-port SERDES-less serial interfaces, 4 PLLs for clock synthesis across backplane domains, and 114K logic elements for protocol termination (e.g., custom Ethernet variants). The 60 nm low-power process reduces thermal load in sealed CO enclosures. Designers should reference the Cyclone IV E handbook for HSTL/SSTL I/O standards used in telecom backplanes.

Được đề xuất

EP3SL70F780C4N · Altera

🚗

Automotive Driver-Assistance Pre-Processing

Pre-processing for ADAS sensor fusion benefits from the EP4CE115F23C8N's 432 multipliers for radar FFT preprocessing, 114K logic elements for object-tracking state machines, and 280 I/Os for multi-sensor aggregation. For production automotive, designers should specify the F23A7N variant (AEC-Q100 not applicable to C8 commercial temp). The 484-BGA package supports high-density routing for multi-channel LVDS sensor inputs.

Được đề xuất

EP3SE80F1152C4N · Altera

🔧

Test and Measurement Equipment

Test instruments use the EP4CE115F23C8N for waveform synthesis, protocol decoding, and DSP filtering. The 432 embedded 18x18 multipliers implement real-time digital filters at multi-MSPS rates, while 3.8 Mbit embedded memory holds sample buffers. The 280 user I/Os route high-speed LVDS ADC/DAC data and trigger logic. Designers should use TimeQuest timing analysis in Quartus Prime to close timing on the C8 speed grade.

Được đề xuất

EP4CE10E22I8N · Intel

🎥

Embedded Control and Machine Vision

Machine vision systems use the EP4CE115F23C8N to preprocess image data from CMOS sensors before passing to a host processor. The 432 multipliers accelerate Sobel, Laplacian, and morphology filters, while 114K logic elements implement custom region-of-interest engines. The 484-BGA F23 package provides sufficient I/O for multiple MIPI-CSI or LVDS camera lanes. Designers should consider external DDR memory for frame storage beyond the 3.8 Mbit on-chip memory.

Được đề xuất

EP4CE1152F23C7N · Altera

Tóm tắt các sản phẩm được đề xuất

EP4CE10E22C8N Intel Được sử dụng trong: Industrial Motor Control EP4CE1152F23C7N Altera Được sử dụng trong: Industrial Motor Control, Video Processing and Display Bridge, Embedded Control and Machine Vision EP3SL70F780C4N Altera Được sử dụng trong: Telecom Line Card Interface EP3SE80F1152C4N Altera Được sử dụng trong: Automotive Driver-Assistance Pre-Processing EP4CE10E22I8N Intel Được sử dụng trong: Test and Measurement Equipment

What is the logic element count of EP4CE115F23C8N?

The EP4CE115F23C8N contains 114,480 logic elements, making it the largest density option in the Cyclone IV E family. This is corroborated by distributor listings from DigiKey and the Intel/Altera product page. The high logic capacity suits designs that previously required larger or more expensive FPGA devices, including industrial controllers, video bridges, and mid-density signal-processing applications.

What package does EP4CE115F23C8N use?

The EP4CE115F23C8N is housed in a 484-ball FineLine BGA (F23) package with a 1.0 mm ball pitch. According to the Altera product page, this package combination is designated EP4CE115F23. The BGA form factor requires multilayer PCB design with via-in-pad or dog-bone fan-out for proper signal routing and thermal dissipation.

Where can I buy EP4CE115F23C8N and what is the price?

The EP4CE115F23C8N is available from authorized distributors including DigiKey and Mouser, with the single-piece unit price reported at approximately $323.39 as of 2026-09-10 per the Heisener distributor listing. Bulk pricing tiers typically drop the unit cost substantially; lead times vary from same-day shipping at major distributors to multi-week delivery for large volumes through independent distributors.

Is EP4CE115F23C8N in stock at major distributors?

As of 2026-09-10, third-party distributor listings (Heisener) report in stock. DigiKey and Mouser list the part with online ordering enabled. Stock at authorized distributors fluctuates; for production quantities, request a quote and check current lead times directly with the distributor before placing orders.

What is the difference between EP4CE115F23C8N and EP4CE115F29I7N?

The EP4CE115F23C8N and EP4CE115F29I7N share the same 114,480 logic element count, but the F23 suffix denotes a 484-ball BGA package while F29 denotes a 780-ball BGA package. The C8 suffix indicates commercial speed grade 8 and 0C to +85C temperature range, while I7 indicates industrial temperature grade 7 and -40C to +100C range. Both are 100% identical in logic and memory resources.

What is the difference between EP4CE115F23C8N and EP4CE6F17C6N?

The EP4CE115F23C8N has 114,480 logic elements in a 484-BGA package, while the EP4CE6F17C6N has only 6,272 logic elements in a 256-BGA package. Both belong to the Cyclone IV E family and share the same core architecture, but the EP4CE115 provides roughly 18x the logic capacity. The two parts are not drop-in compatible - different ball counts require different PCB footprints.

When should I choose EP4CE115F23C8N over EP4CE40F23C8N?

Choose EP4CE115F23C8N when your design requires the full 114,480 logic elements, 432 embedded multipliers, and 3.8 Mbit of embedded memory. Choose EP4CE40F23C8N when your design fits within approximately 39,600 logic elements and you want to reduce cost and power. Both share the same F23 (484-BGA) package, so the EP4CE40F23C8N is not a true drop-in replacement - it offers lower density, not pin-compatible substitution.

What is the best drop-in replacement for EP4CE115F23C8N?

The best drop-in alternatives are same-package 484-BGA F23 variants within the Cyclone IV E family, such as EP4CE115F23C7N (different speed grade) and EP4CE115F23I7N (industrial temperature grade). Both share identical ball maps and 114,480 logic elements. Cross-brand FPGAs in the 484-BGA package from Lattice, Xilinx, or Microchip do not share a pinout and require a full PCB redesign plus firmware port.

Can a Xilinx Spartan-6 replace EP4CE115F23C8N?

No, a Xilinx Spartan-6 cannot directly replace the EP4CE115F23C8N. Although parts like the XC6SLX150T offer similar logic capacity (~150K cells), Spartan-6 uses different ball maps, voltage rails, configuration schemes, and toolchains. A Spartan-6 migration requires a full PCB redesign and firmware port to Xilinx ISE/Vivado - it is a functional alternative, not a drop-in substitute.

Where to download EP4CE115F23C8N datasheet PDF?

The EP4CE115F23C8N datasheet is available on the Intel/Altera product page at https://www.altera.com/products/fpga/cyclone/iv/e/ep4ce115-f23/EP4CE115F23C8N. Third-party datasheet aggregators like Octopart and Datasheets.com also host the PDF. The Cyclone IV E device handbook, available at the Intel FPGA documentation center, contains full pinout, electrical characteristics, and configuration information.

Where to find EP4CE115F23C8N pinout?

The EP4CE115F23C8N pinout (ball map for the 484-BGA F23 package) is documented in the Cyclone IV E device handbook chapter on package information. You can access it via the Intel/Altera product page. The handbook provides per-ball I/O bank assignments, differential pair groupings, and pinout diagrams for all Cyclone IV E package variants including F23.

Is EP4CE115F23C8N the same as EP4CE115F23C7?

No, the EP4CE115F23C8N and EP4CE115F23C7 differ in speed grade. C8 is a slower speed grade than C7, meaning the C7 part achieves higher Fmax on internal logic paths. The C7 part commands a price premium for designs with tight timing margins. Both share the identical 484-BGA F23 footprint and 114,480 logic element count, making them pin-compatible.

What are the key specifications of EP4CE115F23C8N that engineers should know?

The EP4CE115F23C8N combines 114,480 logic elements, 3.8 Mbit embedded memory, 432 18x18 multipliers, 280 user I/Os, and 4 PLLs in a 484-ball BGA package. Built on a 60 nm low-power process with a 1.2 V core, it targets cost-sensitive mid-to-high-density designs. Engineers should note the commercial temperature range (0C to +85C) and speed grade C8 when planning timing closure.

What is a Cyclone IV E FPGA equivalent from Lattice for EP4CE115F23C8N?

Lattice does not offer a true pin-compatible replacement for the EP4CE115F23C8N because the 484-BGA ball map is Altera/Intel proprietary. However, functionally equivalent Lattice parts in different packages include the ECP5 LFE5UM-85F (~85K LUTs, 484-ball package but different ball map) and the Certus-NX family. A Lattice migration requires PCB redesign and IP porting - it is functional equivalence only.

Dữ liệu tham khảo kỹ thuật cho EP4CE115F23C8N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose EP4CE115F23C8N when your design requires the maximum 114,480 logic elements and 3.8 Mbit embedded memory of the Cyclone IV E family in the 484-ball FineLine BGA F23 package, and you can meet timing closure at the C8 speed grade within the commercial 0C to +85C temperature range. Choose EP4CE115F23C7N for tighter Fmax margins - same ball map, ~10-15% faster. Choose EP4CE115F23I7N for industrial -40C to +100C environments in the same package. Choose EP4CE115F23C9N for lower cost with relaxed timing. Choose EP4CE40F23C8N if your design fits within ~39K logic elements and you want lower power and unit cost (still 484-BGA F23, but ~3x smaller capacity - same package but NOT pin-compatible functionally).

So sánh với các sản phẩm thay thế

Tham số	Sản phẩm này	EP4CE115F23C7N	EP4CE115F23I7N	EP4CE115F23A7N	EP4CE115F23C9N
Package	484-ball FineLine BGA (F23)	484-ball FineLine BGA (F23) - same	484-ball FineLine BGA (F23) - same	484-ball FineLine BGA (F23) - same	484-ball FineLine BGA (F23) - same
Brand	Intel	Intel	Intel	Intel	Intel
Logic Elements	114,480	114,480	114,480	114,480	114,480
Embedded Memory (bits)	3,981,312	3,981,312	3,981,312	3,981,312	3,981,312
User I/O	280	280	280	280	280
Embedded 18x18 Multipliers	432	432	432	432	432
Speed Grade	C8 (commercial)	C7 (faster, premium)	I7 (industrial)	A7 (automotive)	C9 (slower, lower cost)
Operating Temperature	0C to +85C	0C to +85C	-40C to +100C	-40C to +125C	0C to +85C
Pin Compatibility	Reference	Yes (drop-in)	Yes (drop-in)	Yes (drop-in)	Yes (drop-in)

Bảo phân biệt quan trọng

Highest logic density in Cyclone IV E family (vsEP4CE40F23C8N)
Industrial temperature variant available in same package (vsEP4CE115F29I7N)
Commercial temperature and C8 speed grade for cost-sensitive designs (vsEP4CE115F23C7N)

Ghi chú thiết kế

The 484-ball FineLine BGA package with 1.0 mm pitch requires at least a 6-layer PCB with microvia (HDI) construction or via-in-pad for reliable assembly. Plan escape routing in groups of 2-3 signals per row to avoid crossing power/ground planes. Use the Cyclone IV E device handbook ball map and your PCB CAD library to verify ball assignment against the bank I/O plan before fabrication. Decoupling: place 0.1uF X7R capacitors under the package within 5 mm of each power ball group.

The EP4CE115F23C8N requires a 1.2 V core supply (VCCINT), a 2.5 V or 3.3 V auxiliary supply (VCCAUX), and per-bank I/O supplies (VCCIO). Estimate worst-case core current at approximately 1.5-2.0 A under full DSP utilization; derate the regulator by at least 25% for margin. Power sequencing requires VCCINT to ramp before VCCAUX, with a maximum delta of 200 mV during ramp to prevent latch-up - use a sequencer IC if your regulator lacks built-in tracking.

Common pitfalls include: (1) forgetting that configuration mode (PS vs FPP vs JTAG) is selected by MSEL pins - wire them correctly to avoid bricking during programming; (2) underestimating the JTAG chain length when using both a USB-Blaster and a microcontroller debugger on the same TCK/TMS; (3) neglecting to enable the CRC error check during configuration in safety-critical designs; (4) ignoring the need for an external configuration device (e.g., EPCS) when using passive serial mode. Review the Cyclone IV E handbook configuration chapter before board bring-up.

Thông tin tuân thủ

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Không chì

Yes

Không halogen

Yes

Khoáng vật xung đột

Compliant

RoHS and REACH compliant per Altera/Intel product page. C8 commercial temperature grade; not AEC-Q100 - choose A7N variant for automotive. Lead-free BGA balls; halogen-free per JEDEC JS709.

Dữ liệu được xác minh vào: 2026-09-10 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Nguồn: Distributor, Distributor, Octopart, Manufacturer Product Page, Distributor

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Intel Altera EP4CE115F23C8N EP4CE115F23C7N EP4CE115F23I7N EP4CE115F23A7N EP4CE115F23C9N EP4CE40F23C8N Cyclone IV E FPGA Field Programmable Gate Array PLD Programmable Logic Device BGA FineLine BGA F23 package 484-ball BGA Logic Element Embedded Memory M9K memory block DSP block 18x18 multiplier PLL LVDS JEDEC RoHS REACH AEC-Q100 Quartus Prime TimeQuest industrial motor control machine vision video bridge telecom line card