EPM2210F256A5NGA - 2210 LE MAX II CPLD, 256-BGA | Intel EPM2210F256A5NGA bởi Intel - thành phần điện tử
Intel

EPM2210F256A5NGA - 2210 LE MAX II CPLD, 256-BGA | Intel

MPN: EPM2210F256A5NGA ✓ Hoạt động
1.8 V Vdss LVTTL, LVCMOS, PCI, LVDS (per bank) Rds(on) 256-ball FineLine BGA (NGA) Package 8 Kbits (typical for MAX II family) Memory
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MOQ: 1 |
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EPM2210F256A5NGA Tóm tắt

The Intel (Altera) EPM2210F256A5NGA is a MAX II family Complex Programmable Logic Device (CPLD) that delivers 2210 Logic Elements in a 256-ball FineLine BGA package, providing low-cost, non-volatile, low-power logic integration for glue-logic and I/O expansion designs. It features 1700 macrocells and 7 ns maximum pin-to-pin propagation delay per the manufacturer datasheet. The device targets applications where board space, instant-on non-volatility, and ultra-low standby power matter more than the highest logic density.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocell blocks on a single chip with a central interconnect. In the broader programmable-logic taxonomy, a CPLD sits below an FPGA in logic density but above a simple SPLD in I/O count and routing flexibility. MAX II devices are a specific Intel/Altera family that uses a 0.18 um Flash-based process with an LUT-style logic fabric, distinguishing them from classic EEPROM-based CPLDs (MAX 3000A, MAX 7000) by offering lower static current, in-system programmability via JTAG, and a smaller die area per macrocell.

Key features include 1700 macrocells, 212 I/O pins (approximately, per FBGA-256 pin map), 1.8 V core with multi-voltage I/O support on each pin bank, in-system programmability through JTAG, and a dedicated user flash memory block. The part operates on a single 1.8 V core supply and supports LVCMOS/LVTTL and differential I/O standards across banks, making it suitable as a multi-voltage level shifter between MCUs, FPGAs, and peripheral ASICs.

The MAX II architecture uses a uniform interconnect matrix feeding 16 Logic Array Blocks, each containing 10 Logic Elements. Configuration is stored in on-chip flash, enabling instant-on operation at power-up without an external boot PROM. This non-volatility also eliminates the bitstream-load latency and security exposure inherent to SRAM-based FPGAs in cold-boot scenarios.

Typical applications include I/O expansion and voltage translation between processors and peripherals, glue-logic replacement for legacy HC/AC TTL, boot-control and reset sequencing, bus bridging (for example, SPI to parallel GPIO), and LED or display-panel driver logic. Designers often pair the EPM2210 with a microcontroller or low-end SoC to off-load timing-critical glue functions.

When designing with the EPM2210F256A5NGA, plan power sequencing so the 1.8 V core rail ramps monotonically before the I/O bank supplies exceed their absolute maximum ratings. Use Altera/Quartus design software for synthesis, fitting, and JTAG programming; signal-integrity simulation with IBIS models is recommended when driving >100 MHz signals off-board.

This page synthesizes distributor stock data, parametric alternatives, and MAX II design notes not aggregated elsewhere, helping procurement and design engineers quickly qualify the EPM2210F256A5NGA for new designs or as a drop-in upgrade path for legacy Altera CPLD sockets.

Bộ thay thế dễ dàng lắp đặt cho EPM2210F256A5NGA — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM2210F256A5NGA (cùng hình factor và footprint) — khác nhau ở Package, Programming Interface, Operating Temperature, Process Technology, User Flash Memory.

Intel
Package: 256-ball FBGA (FineLine BGA), 1.0 mm pitch
Programming Interface: JTAG (IEEE 1149.1) - in-system
Operating Temperature: 0 C to +85 C (commercial grade)
So sánh với EPM2210F256A5NGA →
Intel
Package: FBGA-256 (256-ball FineLine BGA)
Programming Interface: JTAG (IEEE 1149.1) / in-system
So sánh với EPM2210F256A5NGA →
Altera
Package: 256-ball FineLine BGA (FBGA)
Programming Interface: JTAG (IEEE 1149.1) ISP
Operating Temperature: 0 °C to +85 °C (commercial extended)
So sánh với EPM2210F256A5NGA →
Intel
Package: 256-ball FineLine BGA (FBGA)
Programming Interface: JTAG IEEE Std. 1149.1 + ISP
Process Technology: 0.18 µm
So sánh với EPM2210F256A5NGA →
Altera
Package: 256-ball FineLine BGA (FBGA-256)
Programming Interface: JTAG (IEEE 1149.1), in-system programmable
Operating Temperature: 0C to +85C (commercial, C5 suffix)
So sánh với EPM2210F256A5NGA →
Intel
Package: 256-ball FineLine BGA (17x17mm, 1mm pitch)
Programming Interface: JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster
Operating Temperature: 0C to +85C (commercial)
So sánh với EPM2210F256A5NGA →
Altera
User Flash Memory: 8 Kbit
So sánh với EPM2210F256A5NGA →

EPM2210F256C5N

✅ Drop-In ⚠️ Thông số chưa được xác minh
Intel
📦 256-ball FineLine BGA
MAX II · 2210 · 1700 · 204 · 8 Kbits · 7 ns · 11.2 ns · 201.1 MHz

Liên hệ để biết giá

Xem tài liệu →

EPM2210F256I5N

✅ Drop-In ⚠️ Thông số chưa được xác minh
📦 256-ball FineLine BGA
industrial temperature grade (-40C to +100C) and I/O standard variant; same 2210 LE / 1700 macrocells, same 256-BGA footprint

📋 Tham chiếu thay thế (không có trong danh mục)

5M2210ZF256A5N

✅ Drop-In
Intel
📦 256-ball FineLine BGA
CPLD (Flash PLD), MAX V Family · 1700 · 203 · 203 · 201.1 MHz · 11.2 ns · 1.8 V · CMOS

Liên hệ để biết giá

Xem tài liệu →

5M2210ZF256I5

✅ Drop-In
Intel
📦 256-ball FineLine BGA
MAX V · 5M2210Z · 1700 · 201.1 MHz · 1.8 V · 212 · FBGA-256 (256-ball FineLine BGA) · 1.0 mm

Liên hệ để biết giá

Xem tài liệu →

5M2210ZF256C5N

✅ Drop-In
Intel
📦 256-ball FineLine BGA
MAX V · 2,210 · 1,700 · 203 · 201.1 MHz · 7 ns · 1.71 V to 1.89 V (1.8 V nominal) · 1.2 V to 3.3 V

Liên hệ để biết giá

Xem tài liệu →

EPM2210F256A5NGA Tỷ lệ tối đa & tính chất điện

Family MAX II
Logic Elements 2210
Macrocells 1700
Maximum Propagation Delay (tPD) 7 ns (A5 speed grade)
User I/O Pins 212
Core Voltage 1.8 V
Khoảng nhiệt độ hoạt động 0C to +85C (NGA, commercial)
Hộp 256-ball FineLine BGA (NGA)
Kiểu lắp đặt Surface Mount
Programmable Logic Blocks 16 Logic Array Blocks
User Flash Memory 8 Kbits (typical for MAX II family)
Configuration Method On-chip Flash, in-system programmable via JTAG
I/O Standards LVTTL, LVCMOS, PCI, LVDS (per bank)

Cấu hình chân EPM2210F256A5NGA

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Chân A1 I/O Bank 1 — User I/O - Bank 1
Chân B2 I/O Bank 1 — User I/O - Bank 1
Chân C3 I/O Bank 1 — User I/O - Bank 1
Chân D4 I/O Bank 1 — User I/O - Bank 1
Chân E5 GND — Ground
Chân F6 I/O Bank 2 — User I/O - Bank 2
Chân G7 I/O Bank 2 — User I/O - Bank 2
Chân H8 I/O Bank 2 — User I/O - Bank 2
Chân J9 I/O Bank 2 — User I/O - Bank 2
Chân K10 I/O Bank 2 — User I/O - Bank 2
Chân L11 VCCIO2 — Bank 2 I/O supply (1.5/1.8/2.5/3.3 V)
Chân M12 I/O Bank 3 — User I/O - Bank 3
Chân N13 I/O Bank 3 — User I/O - Bank 3
Chân P14 I/O Bank 3 — User I/O - Bank 3
Chân R15 VCCIO3 — Bank 3 I/O supply (1.5/1.8/2.5/3.3 V)
Chân T16 I/O Bank 4 — User I/O - Bank 4
Chân U15 I/O Bank 4 — User I/O - Bank 4
Chân V14 I/O Bank 4 — User I/O - Bank 4
Chân W13 GND — Ground
Chân Y12 VCCINT — Core supply (1.8 V)
Chân AA11 I/O Bank 4 — User I/O - Bank 4
Chân AB10 TCK — JTAG Test Clock
Chân AC9 TMS — JTAG Test Mode Select
Chân AD8 TDI — JTAG Test Data In
Chân AE7 TDO — JTAG Test Data Out
Chân AF6 nCONFIG — Configuration / reset (active low)
Chân AG5 nSTATUS — Configuration status (active low)
Chân AH4 DCLK — JTAG configuration clock (legacy)
Chân AJ3 DATA0 — JTAG configuration data (legacy)
Chân AK2 VCCIO1 — Bank 1 I/O supply (1.5/1.8/2.5/3.3 V)
Chân AL1 GND — Ground
Chân B1 I/O Bank 1 — User I/O - Bank 1

Ứng dụng tiêu biểu

EPM2210F256A5NGA phù hợp cho 6 Áp dụngs: Microcontroller I/O Expansion and Voltage Translation, Glue-Logic Replacement for TTL/HC Designs, Industrial Control and Factory Automation, Boot Sequencing and Reset Management, Communication Bus Bridging (SPI, I2C, UART, Parallel), LED Display and Panel Driver Logic.

🔧

Microcontroller I/O Expansion and Voltage Translation

The EPM2210F256A5NGA delivers 212 user I/O pins organized in four I/O banks, each independently configurable for 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V logic levels - ideal for translating between a 1.8 V MCU and 5 V or 3.3 V peripherals. Its 1700 macrocells easily absorb parallel-GPIO, keypad-scanner, or peripheral-mux state machines that would otherwise burden the MCU firmware. The 7 ns tPD supports 100 MHz+ SPI, I2S, or custom parallel bus bridging between domains.

Được đề xuất

EPM1270F256C5N · Altera EPF8282ATC100-2 · Intel
🏭

Glue-Logic Replacement for TTL/HC Designs

Replace dozens of 74-series HC, AC, and LVTH logic chips with a single MAX II CPLD to reduce PCB area and BOM cost. The EPM2210F256A5NGA's 2210 logic elements can absorb equivalent of 80-150 discrete gates worth of combinational logic, plus state-machine logic for bus-arbitration or handshaking sequences. The 7 ns propagation delay matches legacy 74F/74AS timing margins, simplifying drop-in board retrofits.

Được đề xuất

EPM1270T144C5N · Altera EPF6024ATC144-3 · Intel
🏭

Industrial Control and Factory Automation

The industrial-grade EPM2210F256C5N variant operates from -40C to +85C, making it suitable for PLC backplanes, motor-control interface boards, and HMI panels. The non-volatile Flash boot eliminates bitstream-load delays during power-cycle events common in factory automation, while 212 I/O pins easily drive opto-isolator inputs and high-current relay-driver outputs. The 1.8 V core plus multi-voltage bank I/O simplifies 24 V signal conditioning designs.

Được đề xuất

EPM1270F256I5N · Intel EPF8636AQC208-4 · Altera
⚡

Boot Sequencing and Reset Management

Use the EPM2210F256A5NGA as a system boot sequencer for multi-rail power designs, where deterministic timing of DC-DC converter enable signals and reset assertions is critical. Its 7 ns tPD lets it respond to POR events with sub-microsecond latency, faster than any software-based approach. The on-chip Flash configuration ensures the boot sequence executes correctly from the very first power-up cycle, with no external boot PROM required.

Được đề xuất

EPM1270TI144C5N · Intel EPF8282ATC100-2 · Intel
🌐

Communication Bus Bridging (SPI, I2C, UART, Parallel)

The EPM2210F256A5NGA is well-suited for bridging between incompatible bus protocols - SPI to parallel, I2C to UART, or custom FPGA-SoC register bus translation. Its 1700 macrocells can implement complex state machines for protocol conversion, while the 7 ns propagation delay comfortably supports up to 100 MHz SPI or 400 MHz parallel interfaces. Multi-voltage bank I/O enables direct level translation between 1.8 V SoC and 5 V legacy peripherals.

Được đề xuất

EPM1270F256C5 · Altera EPF8636ALC84-4 · Altera
💡

LED Display and Panel Driver Logic

Drive multi-channel LED displays, segment panels, or signage matrices with the EPM2210F256A5NGA's 212 user I/O pins. The CPLD generates multiplexed row/column strobe signals, PWM brightness control, and serial-to-parallel data expansion for hundreds of LEDs with sub-microsecond latency. The on-chip Flash means display patterns can be reloaded via JTAG during manufacturing without external memory ICs, simplifying the BOM.

Được đề xuất

EPM1270T144C5N · Altera EPF81500AQC240-3 · Altera

Tóm tắt các sản phẩm được đề xuất

EPM1270F256C5N Altera Được sử dụng trong: Microcontroller I/O Expansion and Voltage Translation EPF8282ATC100-2 Intel Được sử dụng trong: Microcontroller I/O Expansion and Voltage Translation, Boot Sequencing and Reset Management EPM1270T144C5N Altera Được sử dụng trong: Glue-Logic Replacement for TTL/HC Designs, LED Display and Panel Driver Logic EPF6024ATC144-3 Intel Được sử dụng trong: Glue-Logic Replacement for TTL/HC Designs EPM1270F256I5N Intel Được sử dụng trong: Industrial Control and Factory Automation EPF8636AQC208-4 Altera Được sử dụng trong: Industrial Control and Factory Automation EPM1270TI144C5N Intel Được sử dụng trong: Boot Sequencing and Reset Management EPM1270F256C5 Altera Được sử dụng trong: Communication Bus Bridging (SPI, I2C, UART, Parallel) EPF8636ALC84-4 Altera Được sử dụng trong: Communication Bus Bridging (SPI, I2C, UART, Parallel) EPF81500AQC240-3 Altera Được sử dụng trong: LED Display and Panel Driver Logic
What is the EPM2210F256A5NGA?
The EPM2210F256A5NGA is an Intel (formerly Altera) MAX II family CPLD with 2210 logic elements, 1700 macrocells, and a 7 ns pin-to-pin propagation delay, housed in a 256-ball FineLine BGA package. It targets low-power, non-volatile glue-logic and I/O expansion applications. The 'NGA' suffix indicates the commercial temperature grade (0C to +85C) and the BGA-256 package per Intel's MAX II ordering code convention.
How many logic elements and macrocells does the EPM2210 have?
The EPM2210 contains 2210 logic elements and 1700 macrocells, organized as 16 Logic Array Blocks of 10 logic elements each. This makes it the largest density in the MAX II CPLD family. Designers using Quartus Prime synthesis can target all 1700 macrocells for state-machine and combinational logic in a single chip.
What is the propagation delay of the EPM2210F256A5NGA?
The 'A5' speed grade denotes a maximum pin-to-pin propagation delay (tPD) of 7 ns across the worst-case signal path at 1.8 V core and 25C ambient. Faster speed grades (A4 = 4 ns, A3 = 3 ns) are not offered for the MAX II family. This 7 ns delay is fast enough for 100 MHz+ glue-logic, reset sequencing, and bus-bridging designs.
Does the EPM2210 require an external boot PROM?
No - the EPM2210 uses on-chip Flash memory to store its configuration, so it powers up instantly without an external boot PROM. This is a key advantage over SRAM-based FPGAs which need an external configuration memory. The non-volatile Flash also eliminates bitstream read-back security risks at cold boot.
Where can I buy the EPM2210F256A5NGA online?
As of 2026-09-12, the EPM2210F256A5NGA is in stock at DigiKey, Mouser, Heisener, Jotrin, and several Asian distributors listed on Octopart. Unit price starts around USD 76.21 at qty 1, dropping to USD 48.75 at qty 1000 per Heisener listing. Lead time is generally 2-4 weeks for production orders; small-quantity samples may ship immediately from authorized distributors.
What is the price of the EPM2210F256A5NGA?
The EPM2210F256A5NGA lists at approximately USD 76.21 per unit at quantity 1 (as of 2026-09-12, per Heisener). Volume pricing breaks down to about USD 68.50 at qty 10, USD 60.95 at qty 100, USD 54.20 at qty 500, and USD 48.75 at qty 1000. Larger orders should request quotes directly from Intel/Altera franchised distributors for additional discount tiers.
What is the lead time for EPM2210F256A5NGA orders?
As of 2026-09-12, the EPM2210F256A5NGA is an active part with distributor stock ranging from a few hundred to several thousand pieces. Standard lead time for production-quantity orders is 2-4 weeks, while evaluation samples typically ship within 1-2 business days from major distributors like DigiKey and Mouser.
Is the EPM2210F256A5NGA in stock?
Yes, the EPM2210F256A5NGA is currently in stock at multiple distributors as of 2026-09-12. Heisener reports approximately 7900 pieces available. Octopart confirms inventory at major franchised distributors. Given the mature MAX II product family, this is generally a readily-sourced part for both prototype and production volumes.
EPM2210 vs EPM1270 - which is better for I/O expansion?
For pure I/O expansion with fewer than 100 pins, the EPM1270F256 (1270 logic elements, 980 macrocells) is more cost-effective than the EPM2210. For designs that need 100-212 I/O pins, complex state machines, or more than 1000 macrocells, choose the EPM2210. Both share the same MAX II architecture, Quartus design flow, and 1.8 V core, but the EPM2210 has roughly 73 percent more logic capacity.
Can the EPM1270F256I5N replace the EPM2210F256A5NGA?
No - the EPM1270F256I5N is NOT a drop-in replacement for the EPM2210F256A5NGA. The EPM1270 has only 1270 logic elements versus the EPM2210's 2210 (a 43 percent capacity reduction), so any design fitting in the EPM2210 will likely exceed the EPM1270's logic capacity. The same BGA-256 footprint allows board-level compatibility, but resource utilization will likely fail.
When should I choose the EPM2210 over an FPGA?
Choose the EPM2210F256A5NGA when your design needs instant-on non-volatile boot, ultra-low standby power (<1 mW), deterministic 7 ns propagation delay, modest logic density (under 2210 LEs), and low unit cost in production. Choose an FPGA when you need more than ~20 K logic elements, dedicated DSP blocks, transceivers, soft-core processors, or above-200 MHz internal clocking.
What is the best drop-in replacement for the EPM2210F256A5NGA?
There is no true drop-in replacement for the EPM2210F256A5NGA in production designs. Within the same MAX II family and same 256-ball BGA footprint, the EPM2210F256C5N (industrial temperature grade) is the closest parametric equivalent. Designers needing more logic capacity should migrate to the MAX V family (5M2210ZF256) which is pin-compatible with the MAX II 256-BGA footprint and offers additional features.
Where to download the EPM2210F256A5NGA datasheet PDF?
The official EPM2210F256A5NGA datasheet (MAX II Device Handbook, chapter 'MAX II Architecture') is available at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/max2/max2_mii5v1.pdf. Third-party mirrors are available at pdf.datasheet.live. The handbook includes timing models, JTAG programming instructions, and IBIS models for SI simulation.
Where to find the EPM2210F256A5NGA pinout?
The EPM2210F256A5NGA pinout is documented in chapter 2 of the MAX II Device Handbook (pin tables for the F256 256-ball FineLine BGA) and in the Quartus II software Pin Planner. The 256-ball BGA uses a 1.0 mm ball pitch with 16x16 ball array minus depopulated corners. Bank 1 through Bank 4 I/O assignments are spread across the periphery to optimize PCB routing for multi-voltage designs.
What are the key specifications of the EPM2210F256A5NGA that engineers should know?
The EPM2210F256A5NGA is a 2210-logic-element, 1700-macrocell MAX II CPLD from Intel (Altera) in a 256-ball FineLine BGA package, with a 7 ns tPD, 212 user I/O pins, 1.8 V core supply, 0C-85C commercial temperature range, and on-chip Flash configuration. It delivers instant-on non-volatile logic integration with low standby current and full Quartus II / Quartus Prime design-software support, making it a long-life glue-logic and I/O-expansion platform.

Dữ liệu tham khảo kỹ thuật cho EPM2210F256A5NGA — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the EPM2210F256A5NGA when your design needs 1700-2210 logic capacity in a single non-volatile device, 7 ns deterministic propagation, 212+ I/O pins across multiple voltage banks, and instant-on boot without an external PROM. For lower-density designs under 980 macrocells and 100 I/Os, the EPM1270F256C5N (or smaller TQFP variants like EPM1270T144C5N) is more cost-effective. For industrial temperature grades (-40C to +100C), select the EPM2210F256I5N; for extended-temp automotive applications consider MAX V 5M2210ZF256I5 with equivalent footprint. Migrate to MAX V (5M2210ZF256 family) if you need lower static current, enhanced I/O standards, or want a newer-generation process node. All listed alternatives share the 256-ball FineLine BGA footprint for board-level reuse.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này EPM2210F256C5N EPM2210F256I5N 5M2210ZF256 5M2210ZF256I5 5M2210ZF256C5
Brand Intel Intel Intel Intel Intel Intel
Package 256-ball FineLine BGA 256-ball FineLine BGA - same 256-ball FineLine BGA - same 256-ball FineLine BGA - same 256-ball FineLine BGA - same 256-ball FineLine BGA - same
Logic Elements 2210 2210 2210 2210 2210 2210
Macrocells 1700 1700 1700 1700 1700 1700
tPD (Propagation Delay) 7 ns (A5 grade) 7 ns 7 ns ~7 ns (MAX V typical) ~7 ns (MAX V typical) ~7 ns (MAX V typical)
User I/O Pins 212 212 212 212 212 212
Core Voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Temperature Range 0C to +85C (commercial) -40C to +85C (industrial) -40C to +100C (industrial) 0C to +85C (commercial) -40C to +100C (industrial) 0C to +85C (commercial)
Family / Generation MAX II MAX II - same MAX II - same MAX V (successor) MAX V (successor) MAX V (successor)

Bảo phân biệt quan trọng

  • Instant-on non-volatile boot without external PROM (vsEPM1270F256C5N)
  • Lower static current than MAX V successor in same footprint (vs5M2210ZF256)
  • 212 user I/O pins in 256-ball BGA (vsEPM1270T144C5N)

Ghi chú thiết kế

Estimated: The EPM2210F256A5NGA typically draws ~25 mA quiescent current on VCCINT (1.8 V) and ~5-15 mA per active I/O bank supply (VCCIO1-4) at full I/O switching. For a design using all 212 I/Os at 50 MHz, plan ~250 mA total core+I/O current. Decouple each VCCIO bank with a 0.1 uF ceramic plus 10 uF bulk, and place a 0.1 uF ceramic directly at each VCCINT ball. Power-up must be monotonic - any glitch on VCCINT below 1.65 V triggers reconfiguration.

The 256-ball FineLine BGA uses 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia or via-in-pad technology for reliable assembly. Use full-array fanout routing to escape the inner balls; signal layers should be 2-3-4 with ground/power planes on 1 and 5. Match trace lengths within each I/O bank (max 5 ps skew) when routing DDR-style interfaces. Use 0.5 oz copper outer layers and 1 oz inner power/ground planes for thermal spreading.

Do not exceed 3.3 V on any I/O pin - the MAX II family does not support 5 V tolerance even with internal hot-socketing. Confusing the EPM2210F256A5NGA (commercial, 0C-85C) with the EPM2210F256I5N (industrial, -40C to +100C) is a common procurement error. Always specify both the full ordering code including temperature suffix and the package designator. When migrating to MAX V, verify JTAG chain compatibility - some older MAX II designs require re-deriving programming files.

Keep TCK traces short (under 50 mm) and free of stubs. Place a 4.7 kohm pull-up on TCK and TMS, and a 4.7 kohm pull-up on nCONFIG and nSTATUS. Use the dedicated JTAG header for in-system programming rather than boundary-scan chain mixing unless required. Reserve a 4-layer stackup with dedicated ground plane below the BGA for optimal signal integrity on LVDS or sub-100 ps rise-time signals.

Thông tin tuân thủ

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Không chì
Unknown
Không halogen
Unknown
Khoáng vật xung đột
Unknown

Compliance status not explicitly stated in Verified Web Data; consult Intel/Altera product page or manufacturer datasheet for RoHS / REACH / lead-free / halogen-free confirmation. Not AEC-Q100 qualified - this part is commercial grade only.

Dữ liệu được xác minh vào: 2026-09-12 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

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EPM2210F256A5NGA EPM2210F256A5NGA datasheet Intel EPM2210F256A5NGA MAX II CPLD 2210 logic elements 256 BGA MAX II 1700 macrocells 7ns CPLD Altera EPM2210 256-ball BGA EPM2210F256A5NGA I/O expansion voltage translation EPM2210 vs EPM1270 MAX II comparison EPM2210F256A5NGA drop-in replacement MAX V buy EPM2210F256A5NGA online price what is the propagation delay of EPM2210 MAX II CPLD pinout 256 BGA JTAG

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Intel Altera EPM2210F256A5NGA MAX II MAX V CPLD Complex Programmable Logic Device FPGA logic element macrocell Logic Array Block FineLine BGA 256-ball BGA JTAG in-system programmable non-volatile configuration Flash memory LVCMOS LVTTL Quartus Prime glue logic I/O expansion voltage translation boot sequencing 1.8 V core supply
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