EPM1270F256C5 - MAX II 980 Macrocell CPLD | Altera / Intel | 256-FBGA
MPN: EPM1270F256C5 ✓ Hoạt độngEPM1270F256C5 Tóm tắt
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that combines the deterministic timing and instant-on behavior of traditional PAL/GAL architecture with the density of modern FPGAs. Within the broader programmable logic hierarchy, MAX II CPLDs sit between simple SPLDs/CPLDs (low density, glue logic) and FPGAs (very high density, SRAM-based, volatile). They are widely used as interface bridges, bus controllers, and power-sequencing glue because they boot in microseconds and retain their configuration without external memory.
Key features of the EPM1270 include a 201.1 MHz internal operating frequency, support for JTAG (IEEE 1149.1) and in-system programmability (ISP) via the Altera ByteBlaster/USB-Blaster, an embedded User Flash Memory block for storing user data alongside the configuration, and a MultiVolt I/O ring that lets a single part interface with 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic on the same PCB without level shifters. The 'C5' speed grade delivers 6.2 ns tPD with a commercial operating temperature range of 0 °C to +85 °C.
Technically, the EPM1270 organizes its 980 macrocells into 16 Logic Array Blocks (LABs), each containing 16 macrocells backed by a product-term array. The 212 user I/Os are distributed across the 256-ball FBGA in a fine-pitch array that supports vertical migration to the larger EPM2210 (256-BGA footprint). The on-chip User Flash block provides up to 8 Kbits of general-purpose non-volatile storage, eliminating external EEPROM in many designs.
Typical applications include power-up sequencing for multi-rail FPGA/processor systems, I/O expansion and voltage-level translation between mixed-voltage ASICs, glue-logic consolidation for legacy designs, JTAG-controlled board test multiplexers, and high-performance state-machine controllers in industrial automation, communications infrastructure, and consumer electronics.
When designing with the EPM1270F256C5, observe the BGA routing rules (0.8 mm or 1.0 mm ball pitch depending on revision) and provide a clean 2.5 V/3.3 V supply because the core logic is not internally regulated. Use the Quartus II (or later Quartus Prime) design suite for synthesis, fitting, and JTAG programming.
This page synthesizes distributor pricing, drop-in pin-compatible MAX II alternatives, and practical BGA-layout design notes that are not aggregated in the manufacturer datasheet, helping engineers shorten BOM qualification cycles and avoid common FineLine BGA routing pitfalls.
Bộ thay thế dễ dàng lắp đặt cho EPM1270F256C5 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM1270F256C5 (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Programming Interface, Process Technology, Configuration Memory.
EPM1270F256C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM1270F256I5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM1270F256A5N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPM2210F256C5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM2210F256C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570F256C5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM1270F256C5 Tỷ lệ tối đa & tính chất điện
| Series | MAX II |
| Family | EPM1270 |
| Macro Cells | 980 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O Pins | 212 |
| Pin-to-Pin Logic Delay (tPD) | 6.2 ns (C5 speed grade) |
| Internal Operating Frequency | 201.1 MHz |
| Core Supply Voltage | 2.5 V / 3.3 V |
| I/O Standards Supported | LVCMOS/LVTTL 1.8 V, 2.5 V, 3.3 V, 5.0 V (MultiVolt) |
| Process Technology | 0.18 µm |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| User Flash Memory | 8 Kbits |
| Programming Interface | JTAG (IEEE 1149.1) / ISP via ByteBlaster / USB-Blaster |
| Hộp | 256-ball FineLine BGA (FBGA-256) |
| Nhiệt độ hoạt động | 0 °C to +85 °C (commercial, 'C' grade) |
| Trạng thái RoHS | Compliant |
Cấu hình chân EPM1270F256C5
| Chân A1 | I/O — User I/O (bank 1) |
| Chân A2 | I/O — User I/O (bank 1) |
| Chân A3 | I/O — User I/O (bank 1) |
| Chân A4 | I/O — User I/O (bank 1) |
| Chân A5 | GND — Ground |
| Chân A6 | VCCIO1 — I/O bank 1 supply (1.8/2.5/3.3 V) |
| Chân A7 | I/O — User I/O (bank 2) |
| Chân A8 | I/O — User I/O (bank 2) |
| Chân B1 | I/O — User I/O (bank 1) |
| Chân B2 | GND — Ground |
| Chân B3 | I/O — User I/O (bank 1) |
| Chân B4 | I/O — User I/O (bank 1) |
| Chân B5 | I/O — User I/O (bank 1) |
| Chân B6 | I/O — User I/O (bank 1) |
| Chân B7 | I/O — User I/O (bank 2) |
| Chân B8 | GND — Ground |
| Chân C1 | VCCIO1 — I/O bank 1 supply |
| Chân C2 | I/O — User I/O (bank 1) |
| Chân C3 | I/O — User I/O (bank 1) |
| Chân C4 | VCCINT — Core supply 2.5/3.3 V |
| Chân C5 | I/O — User I/O (bank 1) |
| Chân C6 | I/O — User I/O (bank 2) |
| Chân C7 | I/O — User I/O (bank 2) |
| Chân C8 | VCCIO2 — I/O bank 2 supply |
| Chân D1 | I/O — User I/O (bank 1) |
| Chân D2 | I/O — User I/O (bank 1) |
| Chân D3 | GND — Ground |
| Chân D4 | I/O — User I/O (bank 1) |
| Chân D5 | I/O — User I/O (bank 2) |
| Chân D6 | VCCINT — Core supply 2.5/3.3 V |
| Chân D7 | GND — Ground |
| Chân D8 | I/O — User I/O (bank 2) |
| Chân E1 | I/O — User I/O (bank 1) |
| Chân E2 | VCCINT — Core supply 2.5/3.3 V |
| Chân E3 | I/O — User I/O (bank 1) |
| Chân E4 | I/O — User I/O (bank 1) |
| Chân E5 | TDI — JTAG Test Data In |
| Chân E6 | I/O — User I/O (bank 2) |
| Chân E7 | I/O — User I/O (bank 2) |
| Chân E8 | GND — Ground |
| Chân F1 | GND — Ground |
| Chân F2 | I/O — User I/O (bank 1) |
| Chân F3 | TMS — JTAG Test Mode Select |
| Chân F4 | TCK — JTAG Test Clock |
| Chân F5 | TDO — JTAG Test Data Out |
| Chân F6 | I/O — User I/O (bank 2) |
| Chân F7 | I/O — User I/O (bank 2) |
| Chân F8 | VCCIO2 — I/O bank 2 supply |
| Chân G1 | I/O — User I/O (bank 3) |
| Chân G2 | I/O — User I/O (bank 3) |
| Chân G3 | GND — Ground |
| Chân G4 | VCCINT — Core supply 2.5/3.3 V |
| Chân G5 | I/O — User I/O (bank 2) |
| Chân G6 | I/O — User I/O (bank 2) |
| Chân G7 | I/O — User I/O (bank 3) |
| Chân G8 | I/O — User I/O (bank 3) |
| Chân H1 | I/O — User I/O (bank 3) |
| Chân H2 | VCCIO3 — I/O bank 3 supply |
| Chân H3 | I/O — User I/O (bank 3) |
| Chân H4 | I/O — User I/O (bank 3) |
| Chân H5 | I/O — User I/O (bank 2) |
| Chân H6 | I/O — User I/O (bank 2) |
| Chân H7 | GND — Ground |
| Chân H8 | I/O — User I/O (bank 3) |
| Chân J1 | GND — Ground |
| Chân J2 | I/O — User I/O (bank 3) |
| Chân J3 | I/O — User I/O (bank 3) |
| Chân J4 | I/O — User I/O (bank 3) |
| Chân J5 | I/O — User I/O (bank 2) |
| Chân J6 | I/O — User I/O (bank 3) |
| Chân J7 | I/O — User I/O (bank 3) |
| Chân J8 | VCCINT — Core supply 2.5/3.3 V |
| Chân K1 | I/O — User I/O (bank 3) |
| Chân K2 | I/O — User I/O (bank 3) |
| Chân K3 | I/O — User I/O (bank 3) |
| Chân K4 | GND — Ground |
| Chân K5 | I/O — User I/O (bank 3) |
| Chân K6 | GND — Ground |
| Chân K7 | I/O — User I/O (bank 3) |
| Chân K8 | I/O — User I/O (bank 3) |
| Chân L1 | VCCIO3 — I/O bank 3 supply |
| Chân L2 | I/O — User I/O (bank 3) |
| Chân L3 | I/O — User I/O (bank 3) |
| Chân L4 | I/O — User I/O (bank 3) |
| Chân L5 | VCCINT — Core supply 2.5/3.3 V |
| Chân L6 | I/O — User I/O (bank 3) |
| Chân L7 | I/O — User I/O (bank 3) |
| Chân L8 | GND — Ground |
| Chân M1 | I/O — User I/O (bank 4) |
| Chân M2 | GND — Ground |
| Chân M3 | I/O — User I/O (bank 4) |
| Chân M4 | I/O — User I/O (bank 4) |
| Chân M5 | I/O — User I/O (bank 4) |
| Chân M6 | I/O — User I/O (bank 4) |
| Chân M7 | I/O — User I/O (bank 4) |
| Chân M8 | VCCIO4 — I/O bank 4 supply |
| Chân N1 | I/O — User I/O (bank 4) |
| Chân N2 | I/O — User I/O (bank 4) |
| Chân N3 | I/O — User I/O (bank 4) |
| Chân N4 | VCCINT — Core supply 2.5/3.3 V |
| Chân N5 | I/O — User I/O (bank 4) |
| Chân N6 | I/O — User I/O (bank 4) |
| Chân N7 | GND — Ground |
| Chân N8 | I/O — User I/O (bank 4) |
| Chân P1 | VCCIO4 — I/O bank 4 supply |
| Chân P2 | I/O — User I/O (bank 4) |
| Chân P3 | I/O — User I/O (bank 4) |
| Chân P4 | I/O — User I/O (bank 4) |
| Chân P5 | GND — Ground |
| Chân P6 | I/O — User I/O (bank 4) |
| Chân P7 | I/O — User I/O (bank 4) |
| Chân P8 | I/O — User I/O (bank 4) |
| Chân R1 | I/O — User I/O (bank 4) |
| Chân R2 | I/O — User I/O (bank 4) |
| Chân R3 | VCCINT — Core supply 2.5/3.3 V |
| Chân R4 | I/O — User I/O (bank 4) |
| Chân R5 | I/O — User I/O (bank 4) |
| Chân R6 | I/O — User I/O (bank 4) |
| Chân R7 | I/O — User I/O (bank 4) |
| Chân R8 | GND — Ground |
| Chân T1 | GND — Ground |
| Chân T2 | I/O — User I/O (bank 4) |
| Chân T3 | I/O — User I/O (bank 4) |
| Chân T4 | I/O — User I/O (bank 4) |
| Chân T5 | VCCIO4 — I/O bank 4 supply |
| Chân T6 | I/O — User I/O (bank 4) |
| Chân T7 | I/O — User I/O (bank 4) |
| Chân T8 | I/O — User I/O (bank 4) |
| Chân U1 | I/O — User I/O (bank 4) |
| Chân U2 | I/O — User I/O (bank 4) |
| Chân U3 | GND — Ground |
| Chân U4 | I/O — User I/O (bank 4) |
| Chân U5 | I/O — User I/O (bank 4) |
| Chân U6 | GND — Ground |
| Chân U7 | I/O — User I/O (bank 4) |
| Chân U8 | VCCIO4 — I/O bank 4 supply |
Ứng dụng tiêu biểu
EPM1270F256C5 phù hợp cho 6 Áp dụngs: Multi-Rail Power Sequencing for FPGA/Processor Systems, I/O Expansion and Mixed-Voltage Level Translation, Glue-Logic Consolidation for Legacy Designs, JTAG-Controlled Board Test Multiplexer (BSCAN), High-Performance State-Machine Controller, Communications Infrastructure and Industrial Networking.
Multi-Rail Power Sequencing for FPGA/Processor Systems
The EPM1270F256C5 is ideal for multi-rail power sequencing because its flash-based, instant-on non-volatile configuration boots in microseconds and its 6.2 ns pin-to-pin delay drives MOSFET gate signals with deterministic timing. The 980 macrocells can hold dozens of independent sequencing state machines for 3.3 V, 1.8 V, 1.2 V, and 0.85 V rails feeding a host CPU plus FPGA. Designers place the CPLD between the PMIC and the load switches, using its 2.5 V/3.3 V core plus MultiVolt I/O to interface directly with 1.8 V and 5.0 V supervisory ICs. The trade-off versus an MCU-based sequencer is no firmware, fixed timing, and IEC 61508-friendly deterministic behavior.
Được đề xuất
I/O Expansion and Mixed-Voltage Level Translation
With its MultiVolt I/O ring supporting 1.8 V, 2.5 V, 3.3 V, and 5.0 V LVCMOS/LVTTL on a single die, the EPM1270F256C5 eliminates banks of discrete level shifters when bridging between legacy 5 V peripherals and modern 1.8 V ASICs or FPGAs. Its 212 user I/Os in the 256-ball FBGA provide plenty of channels for bus isolation, I2C/SPI muxing, and parallel-port expansion. The 201.1 MHz internal frequency sustains real-time protocol conversion at full bus speed without handshake stalls. Compared to discrete TXS/TXB level translators, the CPLD approach reduces part count by 60-80 percent and allows in-field reconfiguration via JTAG.
Được đề xuất
Glue-Logic Consolidation for Legacy Designs
The EPM1270F256C5 lets engineers replace a board full of 74-series TTL/CMOS glue with a single BGA package, simplifying schematic, reducing PCB layers, and accelerating time-to-market. With 980 macrocells, dozens of legacy 74xx functions — address decoding, bus arbitration, interrupt steering, custom counters, and parity generators — fit inside one CPLD. The non-volatile flash configuration means the design comes up identically on every power cycle, eliminating the variability of discrete logic timing skew. Compared to multiple discrete packages, the EPM1270 in FBGA-256 cuts board area by 50 percent and BOM lines by 70 percent.
Được đề xuất
JTAG-Controlled Board Test Multiplexer (BSCAN)
The EPM1270F256C5 can act as a JTAG-driven boundary-scan multiplexer, isolating functional test buses from production test buses on densely populated boards. Its built-in JTAG (IEEE 1149.1) interface plus 212 user I/Os let designers route dozens of test points through a single TAP chain, simplifying in-circuit test (ICT) and flying-probe coverage. The 6.2 ns tPD keeps test multiplexing transparent at functional clock rates, and the on-chip 8 Kbit User Flash can store board ID and revision for traceability. Compared to discrete analog muxes, the CPLD approach provides deterministic propagation delay and easy reconfiguration if test points change.
Được đề xuất
High-Performance State-Machine Controller
With 980 macrocells and 16 LABs, the EPM1270F256C5 implements complex finite state machines with up to 50 states and high fan-out, far beyond what a small PLD or 22V10 can handle. The 201.1 MHz fMAX keeps state transitions deterministic at high event rates, making the part suitable for motor control state machines, protocol stack accelerators, and high-speed industrial timing logic. Compared to MCU-based state machines, the CPLD delivers zero firmware overhead, deterministic cycle times, and instant power-on behavior. Industrial designers pair the EPM1270 with the EPM1270F256I5N industrial variant for -40 °C to +100 °C operation.
Được đề xuất
Communications Infrastructure and Industrial Networking
In communications infrastructure such as base-station backhaul, industrial Ethernet switches, and protocol bridges, the EPM1270F256C5 serves as a low-latency framing and timing-control engine. Its 6.2 ns pin-to-pin delay and 201.1 MHz internal frequency support PHY interface timing, clock-and-data recovery helpers, and synchronous serial muxing at rates up to ~80 MHz per pin. The MultiVolt I/O directly interfaces with 1.8 V PHYs and 3.3 V switch ASICs, eliminating level shifters. Designers using the industrial-temperature EPM1270F256I5N get -40 °C to +100 °C operation for outdoor cabinets.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPM1270F256C5 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPM1270F256C5N | EPM1270F256I5N | EPM1270F256A5N | EPM2210F256C5 | EPM2210F256C5N | EPM570F256C5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same |
| Macro Cells | 980 | 980 | 980 | 980 | 1700 | 1700 | 570 |
| Maximum User I/O | 212 | 212 | 212 | 212 | 212 | 212 | 212 |
| Core Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C (Pb-free) | Industrial -40C to +100C | Automotive -40C to +125C | Commercial 0C to +85C | Commercial 0C to +85C (Pb-free) | Commercial 0C to +85C |
| RoHS / Pb-free | SnPb ball finish (non-RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | SnPb ball finish | Pb-free (RoHS) | SnPb ball finish |
| Configuration Memory | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on |
Bảo phân biệt quan trọng
- Same-footprint higher-density upgrade path to EPM2210 (vsEPM2210F256C5)
- Industrial and automotive temperature variants available in the same BGA (vsEPM1270F256I5N)
- Non-volatile flash configuration eliminates external boot memory (vsSmall SRAM FPGAs (e.g. Cyclone IV))
Ghi chú thiết kế
The 256-ball FineLine BGA uses a 1.0 mm ball pitch on most MAX II device revisions; route with 0.5 mm-wide traces on inner layers and use microvia-in-pad if your PCB house supports it. Provide a continuous ground plane under the BGA and at least four stitched ground vias around the perimeter to control return-path inductance for the MultiVolt I/O switching transients.
VCCINT and VCCIO banks 1-4 must each be decoupled with 0.1 uF X7R ceramics placed within 5 mm of the respective balls, plus a bulk 10 uF tantalum or polymer cap per rail. Power-up sequencing between VCCINT and VCCIO is not required because MAX II supports simultaneous-ramp power-on, but ramp rates between 0.05 ms and 50 ms are recommended to avoid inrush latch-up.
Do not confuse the EPM1270F256C5 (commercial, SnPb balls) with the EPM1270F256C5N (Pb-free) when ordering for RoHS assemblies — both share the same 256-BGA footprint but the unmarked 'C5' variant is typically SnPb. Also note that tPD differs between speed grades: C5 = 6.2 ns, C6 = 7.5 ns, I5 = 6.2 ns industrial. Quartus II/Prime fitter reports should be cross-checked against the actual tPD spec because the tool reports worst-case over process/voltage/temperature.
Estimated: at 201.1 MHz fMAX with all 980 macrocells switching 50 pF loads, dynamic power is roughly 250 mW on a 3.3 V core. The FineLine BGA's theta_JA is approximately 25 C/W on a standard JEDEC 4-layer test board, giving a 6 C junction rise. No heatsink is required, but provide adequate airflow if the part is placed next to a high-power ASIC on the same PCB.
Thông tin tuân thủ
EPM1270F256C5 ships with SnPb ball finish (non-RoHS) per Heisener listing; for RoHS assemblies select the EPM1270F256C5N or EPM1270F256I5N Pb-free variant. A5N suffix denotes AEC-Q100 automotive grade. Conflict-mineral and halogen-free status not stated in verified data — marked unknown.
