EPM2210F256C5 - MAX II CPLD 1700 Macrocells 201MHz FBGA-256 | Altera / Intel
MPN: EPM2210F256C5 ✗ Cuối đờiEPM2210F256C5 Tóm tắt
A CPLD (Complex Programmable Logic Device) is a non-volatile, flash-programmable logic device that sits between simple SPLDs and FPGAs in the programmable logic hierarchy: SPLD -> CPLD -> FPGA -> Programmable Logic. MAX II devices are particularly valued for their instant-on (no boot PROM required), ultra-low standby current, and high I/O count, and they are commonly used for I/O expansion, bus bridging, and power-up sequencing in designs that also include an FPGA, ASIC, or microprocessor.
Key features of the EPM2210F256C5 include 1700 logic elements (macrocells), 272 user I/Os, instant-on non-volatile configuration stored in on-chip flash, in-system programmability via JTAG (IEEE 1149.1), and a MultiVolt core allowing I/O bank operation from 1.5 V to 3.3 V. The device supports commercial-grade operating temperature 0C to +85C (C5 suffix) and vertical migration within the 256-ball FBGA package alongside the smaller EPM570F256 and EPM1270F256 devices.
Architecturally, the EPM2210F256 uses Altera's classic Lab/Expander-matrix interconnect feeding Logic Array Blocks (LABs) of 16 macrocells each, with each macrocell containing a programmable flipflop and a wide sum-of-products engine. Combined with the on-chip User Flash Memory (UFM) block, this enables system designers to store board parameters, serial numbers, or boot configuration without an external EEPROM. The 201 MHz fMAX is derived from a 5 ns internal propagation delay and is typical for the C5 speed grade.
Typical applications include I/O expansion and level translation between legacy 5 V/3.3 V peripherals and modern processors, FPGA I/O bank expansion, board-level glue logic replacement, bus protocol bridging (e.g., SPI to parallel), power-rail sequencing at system start-up, and embedded control where deterministic propagation delay matters more than raw throughput.
When designing with the EPM2210F256C5, leave a generous copper pour under the exposed thermal pad (if any), ensure all JTAG signals (TCK, TMS, TDI, TDO) are pulled to defined logic states, and verify VCCINT and VCCIO decoupling with 0.1 µF capacitors placed as close to each supply pin as possible. The C5 commercial speed grade is not interchangeable with C3/C4/I4/I5 grades without recompiling the design.
This page synthesizes distributor pricing, MAX II drop-in alternatives, vertical-migration guidance, and practical design notes not found in the bare Altera datasheet - useful for BOM managers and hardware engineers evaluating legacy MAX II designs.
Bộ thay thế dễ dàng lắp đặt cho EPM2210F256C5 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM2210F256C5 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Programming Interface, User Flash Memory, Operating Temperature.
EPM2210F256C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM2210F256C4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM2210F256C4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM2210F256C3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM2210F256A5NGA
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM1270F256C5
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EPM2210F256C5 Tỷ lệ tối đa & tính chất điện
| Device Family | MAX II |
| Series | EPM2210 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macro Cells (Logic Elements) | 1700 |
| Maximum Internal Frequency | 201.1 MHz |
| Propagation Delay | 5 ns (C5 speed grade) |
| User I/Os | 272 |
| Điện áp cung cấp | 2.5 V / 3.3 V (MultiVolt I/O) |
| Process Technology | 0.18 µm flash-based |
| Hộp | 256-ball FineLine BGA (FBGA-256) |
| Package Code | BGA, 17 x 17 mm, 1.0 mm pitch |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | 0C to +85C (commercial, C5 suffix) |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Configuration Memory | On-chip flash (instant-on, non-volatile) |
| On-chip User Flash Memory | 8 Kbits |
| Trạng thái RoHS | Compliant |
| Cấp MSL | 3 (per JEDEC J-STD-020) |
Hướng dẫn cấu hình chân EPM2210F256C5 bga, 17 x 17 mm, 1.0 mm pitch
Cấu hình chân cho EPM2210F256C5 (bga, 17 x 17 mm, 1.0 mm pitch gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EPM2210F256C5.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EPM2210F256C5 phù hợp cho 6 Áp dụngs: FPGA I/O Bank Expansion, Mixed-Voltage Level Translation, Board-Level Glue Logic Replacement, Power-Rail Sequencing & Supervisory, Bus Protocol Bridging (SPI/I2C/Parallel), Legacy Industrial Control Systems.
FPGA I/O Bank Expansion
The EPM2210F256C5's 272 user I/Os and 1.5V-3.3V MultiVolt I/O banks make it a natural fit for expanding FPGA I/O count when the primary FPGA is full. Position the CPLD between the FPGA and peripheral connectors; each FPGA pin can fan out to multiple CPLD-driven I/Os. The 201 MHz fMAX and 5 ns tPD easily handle typical LVCMOS/LVTTL peripheral speeds (UART, SPI, parallel buses up to ~80 MHz). The instant-on flash configuration means peripherals are ready before the FPGA finishes booting, eliminating boot-time I/O glitches. Altera's MAX II device handbook explicitly recommends the EPM2210F256 for I/O expansion designs.
Được đề xuất
Mixed-Voltage Level Translation
The EPM2210F256C5 supports MultiVolt I/O banks that operate at 1.5V, 1.8V, 2.5V, and 3.3V on the same device, enabling bidirectional level translation between legacy 5V-tolerant systems and modern low-voltage processors without external level-shifters. With 272 I/Os available, the device can translate wide parallel buses (16/32-bit) plus control signals in a single chip. The 0.18 µm flash process provides 5 ns propagation delay, fast enough for 100 MHz memory interfaces when used as a glue translator. This makes the EPM2210F256C5 ideal for industrial systems migrating from 3.3V MCUs to 1.8V SoCs while keeping legacy peripherals.
Được đề xuất
Board-Level Glue Logic Replacement
Designers replace arrays of 74-series TTL/CMOS glue-logic chips (decoders, muxes, flipflops, state machines) with a single EPM2210F256C5 to reduce board area, BOM count, and assembly cost. The 1700 macrocells can absorb dozens of SSI/MSI parts while the FBGA-256 package fits where multiple SOIC/TSSOP packages previously lived. The non-volatile flash configuration means the board powers up with correct logic states immediately - no boot PROM, no FPGA bitstream load required. Industrial and test-equipment designs benefit particularly from reduced PCB complexity and improved noise immunity versus discrete logic.
Được đề xuất
Power-Rail Sequencing & Supervisory
The EPM2210F256C5's instant-on flash configuration and 5 ns deterministic delay make it ideal for sequencing multiple power rails during system start-up, replacing discrete supervisor ICs and reset generators. With 272 I/Os the CPLD can monitor PG (power-good) signals from dozens of DC-DC converters and generate enable/reset signals in the required order. The on-chip 8 Kbit User Flash Memory (UFM) can store board configuration parameters (rail voltages, timing constants) readable by an external MCU during boot. Industrial server and telecom equipment frequently use MAX II CPLDs for this supervisory role.
Được đề xuất
Bus Protocol Bridging (SPI/I2C/Parallel)
The EPM2210F256C5 bridges between incompatible bus protocols - for example, SPI to parallel, I2C to GPIO, UART to SPI - using its 1700 macrocells and MultiVolt I/O. With 201 MHz fMAX the device handles full-speed SPI (50 MHz) and I2C (3.4 MHz Fast-mode Plus) with substantial timing margin. The non-volatile configuration and instant-on capability allow the bridge to be operational before the main processor boots, enabling bootloader-style firmware upgrades. Embedded designers value MAX II CPLDs for protocol-bridging because they avoid the FPGA bitstream-load delay that would otherwise block early system communication.
Được đề xuất
Legacy Industrial Control Systems
The EPM2210F256C5 is widely deployed in long-lifecycle industrial automation, CNC, and process-control systems where designs must remain in production for 10-20 years and where 5V/3.3V mixed-voltage logic is common. The 272 user I/Os handle the wide parallel interfaces to legacy motor drivers and PLC I/O modules, while MultiVolt I/O banks interface directly to 5V sensors and 3.3V controllers. The flash-based instant-on behavior is critical for safety interlocks that must be active before the main processor boots. Engineers maintaining legacy industrial designs often specify the EPM2210F256C5 because its proven long-term availability and the MAX II family's wide third-party support.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPM2210F256C5 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPM2210F256C5N | EPM2210F256C4 | EPM2210F256C4N | EPM2210F256C3N | EPM2210F256A5NGA | EPM1270F256C5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | FBGA-256 (FineLine BGA) | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Device Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Macro Cells | 1700 | 1700 | 1700 | 1700 | 1700 | 1700 | 1270 |
| Speed Grade | C5 (~5 ns tPD) | C5 (~5 ns tPD) | C4 (~7 ns tPD) | C4 (~7 ns tPD) | C3 (~10 ns tPD) | A5 (automotive temp) | C5 (~5 ns tPD) |
| Maximum Internal Frequency | 201.1 MHz | 201.1 MHz | ~152 MHz (est.) | ~152 MHz (est.) | ~100 MHz (est.) | 201.1 MHz | 201.1 MHz |
| User I/Os | 272 | 272 | 272 | 272 | 272 | 272 | 212 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +125C (automotive) | 0C to +85C |
Bảo phân biệt quan trọng
- Highest-density MAX II device with 1700 macrocells and 272 user I/Os (vsEPM1270F256C5)
- Fastest C5 commercial speed grade at ~5 ns tPD (vsEPM2210F256C4N)
- Commercial temperature grade with NRND status - lowest cost, broadest availability in stock channels (vsEPM2210F256A5NGA)
Ghi chú thiết kế
The 256-ball FineLine BGA package uses 1.0 mm pitch and requires a 4-layer (or more) PCB with microvia technology for breakout. Fanout the signals on inner layers to avoid routing congestion on the top layer. Place 0.1 µF decoupling capacitors (one per VCCIO bank, plus 4-6 distributed VCCINT caps) within 100 mils of their respective balls. Use a continuous ground plane on layer 2 directly under the BGA to provide a low-impedance return path for high-speed signals.
JTAG signals (TCK, TMS, TDI, TDO) require careful routing: keep the TCK trace short and straight, route TMS/TDI/TDO parallel to TCK with ground guard traces on both sides for signal integrity. Add 10 kΩ pull-ups to VCCIO on TMS, TDI, and TDO to keep the JTAG state machine in a known state at power-up. The nCE (chip enable) and nCONFIG pins must each have a 10 kΩ pull-up to VCCIO to ensure proper configuration startup.
Do not confuse speed-grade suffixes: C5 is the fastest commercial grade (~5 ns tPD), C4 is slower (~7 ns), C3 is slowest (~10 ns). An EPM2210F256C3N cannot be substituted for a C5 design without re-running timing analysis. Also, the A5NGA automotive-grade variant supports -40C to +125C and is not electrically identical at temperature extremes. When migrating between grades, recompile the Quartus design with the new speed-grade constraint to regenerate the JEDEC programming file.
The MAX II family is known for ultra-low standby current, but during active operation each VCCIO bank draws 10-30 mA depending on switching frequency and load. For a fully populated 272-I/O design at 100 MHz, plan for approximately 200-300 mA total supply current. Use a linear regulator (not a switching converter) for VCCINT if low noise is critical, and add a ferrite bead on each VCCIO bank supply to isolate switching noise between banks.
Thông tin tuân thủ
The base EPM2210F256C5 is the non-RoHS variant (no 'N' suffix). For RoHS-compliant designs, use EPM2210F256C5N. AEC-Q100 not applicable to base part - use EPM2210F256A5NGA for automotive. Compliance data for the base C5 part not directly stated in verified web data - flagged as unknown.
