EPM240GT100C3N - MAX II CPLD 240 LE TQFP-100 | Intel
MPN: EPM240GT100C3N ✓ Hoạt độngEPM240GT100C3N Tóm tắt
What is a CPLD? A complex programmable logic device is a non-volatile programmable logic IC that combines multiple PLA-style macrocells with on-chip flash configuration memory. CPLDs sit above simple PLDs and below FPGAs in the programmable logic hierarchy, with characteristic strengths of deterministic timing, instant-on behavior, and high I/O count. MAX II specifically adds an embedded user flash memory (UFM) and multi-voltage I/O support, bridging classic glue-logic density with small-footprint microcontroller-like functions.
Key features include 240 logic elements, 4.7 ns worst-case tPD, 80 I/Os supporting multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL), an on-chip UFM block that can hold 8 Kbits of user data, in-system programmability via JTAG, and a 3.3 V core with MultiVolt I/O banks that interface cleanly to 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails. The flash-backed configuration eliminates external boot PROMs and gives true instant-on behavior.
Architecturally the MAX II family uses a Logic Array Block (LAB) matrix of 240 LEs arranged in a uniform array, fed by a fast global interconnect with predictable delay paths. The on-chip flash provides ISP and a secure UFM for parameter storage, often used in place of small EEPROMs in glue-logic designs.
Typical applications include I/O expansion and bus bridging for microcontrollers and ASSPs, power-sequencer and reset controllers, address decoding and chip-select generation, glue logic and protocol translation (UART/I2C/SPI bridges), and low-density state-machine controllers in industrial, consumer, and communications equipment.
Designers should size the timing margin for the worst-case tPD over temperature, choose I/O standards per bank to keep the part count down, and budget the UFM write endurance (around 100k cycles per Altera documentation) before substituting it for an EEPROM.
Bộ thay thế dễ dàng lắp đặt cho EPM240GT100C3N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM240GT100C3N (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Operating Temperature, Programming Interface, Configuration Memory.
EPM240GT100C3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM240GT100-5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM240GT100
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM240GM100I5N
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$39.7727 / Đơn vị
Xem tài liệu →EPM240GM100C5N
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Xem tài liệu →EPM240T100C5N
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Xem tài liệu →EPM240GT100C3N Tỷ lệ tối đa & tính chất điện
| Manufacturer | Intel (formerly Altera) |
| Series | MAX II |
| Device Family | MAX II G (instant-on, non-volatile CPLD) |
| Logic Elements (LE) | 240 |
| Equivalent Macrocells | 192 |
| User I/O Pins | 80 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Delay (tPD) | 4.7 ns |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage | 3.3 V |
| MultiVolt I/O Standards | LVTTL, LVCMOS, PCI, SSTL (1.5 V / 1.8 V / 2.5 V / 3.3 V) |
| Programmability | In-System Programmable (ISP) via JTAG |
| Hộp | TQFP-100 (GT100), 16 x 16 mm, 0.5 mm pitch |
| Nhiệt độ hoạt động | 0 °C to +85 °C (commercial, suffix C) |
| Lead-Free / RoHS | Lead Free, RoHS Compliant |
| Kiểu lắp đặt | Surface Mount |
Cấu hình chân EPM240GT100C3N
| Chân 1 | I/O — User I/O (bank 1) |
| Chân 2 | I/O — User I/O (bank 1) |
| Chân 3 | I/O — User I/O (bank 1) |
| Chân 4 | I/O — User I/O (bank 1) |
| Chân 5 | I/O — User I/O (bank 1) |
| Chân 6 | I/O — User I/O (bank 1) |
| Chân 7 | I/O — User I/O (bank 1) |
| Chân 8 | I/O — User I/O (bank 1) |
| Chân 9 | I/O — User I/O (bank 1) |
| Chân 10 | I/O — User I/O (bank 1) |
| Chân 11 | GND — Ground |
| Chân 12 | I/O — User I/O (bank 2) |
| Chân 13 | I/O — User I/O (bank 2) |
| Chân 14 | I/O — User I/O (bank 2) |
| Chân 15 | I/O — User I/O (bank 2) |
| Chân 16 | I/O — User I/O (bank 2) |
| Chân 17 | I/O — User I/O (bank 2) |
| Chân 18 | I/O — User I/O (bank 2) |
| Chân 19 | I/O — User I/O (bank 2) |
| Chân 20 | I/O — User I/O (bank 2) |
| Chân 21 | I/O — User I/O (bank 2) |
| Chân 22 | I/O — User I/O (bank 2) |
| Chân 23 | I/O — User I/O (bank 2) |
| Chân 24 | I/O — User I/O (bank 2) |
| Chân 25 | I/O — User I/O (bank 2) |
| Chân 26 | GND — Ground |
| Chân 27 | I/O — User I/O (bank 2) |
| Chân 28 | I/O — User I/O (bank 2) |
| Chân 29 | I/O — User I/O (bank 2) |
| Chân 30 | I/O — User I/O (bank 2) |
| Chân 31 | I/O — User I/O (bank 2) |
| Chân 32 | I/O — User I/O (bank 2) |
| Chân 33 | I/O — User I/O (bank 2) |
| Chân 34 | I/O — User I/O (bank 2) |
| Chân 35 | I/O — User I/O (bank 2) |
| Chân 36 | VCCINT — Core supply 3.3 V |
| Chân 37 | I/O — User I/O (bank 3) |
| Chân 38 | I/O — User I/O (bank 3) |
| Chân 39 | I/O — User I/O (bank 3) |
| Chân 40 | I/O — User I/O (bank 3) |
| Chân 41 | I/O — User I/O (bank 3) |
| Chân 42 | I/O — User I/O (bank 3) |
| Chân 43 | I/O — User I/O (bank 3) |
| Chân 44 | I/O — User I/O (bank 3) |
| Chân 45 | I/O — User I/O (bank 3) |
| Chân 46 | I/O — User I/O (bank 3) |
| Chân 47 | GND — Ground |
| Chân 48 | I/O — User I/O (bank 3) |
| Chân 49 | I/O — User I/O (bank 3) |
| Chân 50 | I/O — User I/O (bank 3) |
| Chân 51 | I/O — User I/O (bank 3) |
| Chân 52 | I/O — User I/O (bank 3) |
| Chân 53 | I/O — User I/O (bank 3) |
| Chân 54 | I/O — User I/O (bank 3) |
| Chân 55 | I/O — User I/O (bank 3) |
| Chân 56 | I/O — User I/O (bank 3) |
| Chân 57 | VCCIO — I/O supply (bank 3) |
| Chân 58 | I/O — User I/O (bank 3) |
| Chân 59 | I/O — User I/O (bank 3) |
| Chân 60 | I/O — User I/O (bank 3) |
| Chân 61 | GND — Ground |
| Chân 62 | I/O — User I/O (bank 3) |
| Chân 63 | I/O — User I/O (bank 3) |
| Chân 64 | I/O — User I/O (bank 3) |
| Chân 65 | I/O — User I/O (bank 3) |
| Chân 66 | I/O — User I/O (bank 3) |
| Chân 67 | I/O — User I/O (bank 3) |
| Chân 68 | I/O — User I/O (bank 3) |
| Chân 69 | I/O — User I/O (bank 3) |
| Chân 70 | I/O — User I/O (bank 3) |
| Chân 71 | I/O — User I/O (bank 3) |
| Chân 72 | VCCINT — Core supply 3.3 V |
| Chân 73 | I/O — User I/O (bank 4) |
| Chân 74 | I/O — User I/O (bank 4) |
| Chân 75 | I/O — User I/O (bank 4) |
| Chân 76 | I/O — User I/O (bank 4) |
| Chân 77 | I/O — User I/O (bank 4) |
| Chân 78 | I/O — User I/O (bank 4) |
| Chân 79 | I/O — User I/O (bank 4) |
| Chân 80 | I/O — User I/O (bank 4) |
| Chân 81 | I/O — User I/O (bank 4) |
| Chân 82 | I/O — User I/O (bank 4) |
| Chân 83 | GND — Ground |
| Chân 84 | I/O — User I/O (bank 4) |
| Chân 85 | I/O — User I/O (bank 4) |
| Chân 86 | I/O — User I/O (bank 4) |
| Chân 87 | I/O — User I/O (bank 4) |
| Chân 88 | I/O — User I/O (bank 4) |
| Chân 89 | I/O — User I/O (bank 4) |
| Chân 90 | I/O — User I/O (bank 4) |
| Chân 91 | I/O — User I/O (bank 4) |
| Chân 92 | I/O — User I/O (bank 4) |
| Chân 93 | I/O — User I/O (bank 4) |
| Chân 94 | I/O — User I/O (bank 4) |
| Chân 95 | I/O — User I/O (bank 4) |
| Chân 96 | VCCIO — I/O supply (bank 4) |
| Chân 97 | TCK — JTAG test clock |
| Chân 98 | TMS — JTAG test mode select |
| Chân 99 | TDI — JTAG test data in |
| Chân 100 | TDO — JTAG test data out |
Ứng dụng tiêu biểu
EPM240GT100C3N phù hợp cho 6 Áp dụngs: Microcontroller I/O Expansion & Bus Bridging, Industrial Control & Power Sequencing, Communications Equipment & Protocol Translation, Consumer Electronics Glue Logic, Test & Measurement Front-End Logic, Automotive Body Electronics (Non-Safety).
Microcontroller I/O Expansion & Bus Bridging
The EPM240GT100C3N is widely used to expand a microcontroller's GPIO count and bridge between incompatible bus protocols. With 240 logic elements and 80 user I/Os, it can implement address decoding, chip-select generation, and parallel-to-serial conversion in a single device, freeing the host MCU from real-time I/O work. The 4.7 ns tPD supports glue-logic paths at 100 MHz+ system clocks, while the 8-Kbit UFM can store calibration or configuration constants that would otherwise require an external EEPROM.
Được đề xuất
Industrial Control & Power Sequencing
In industrial PLCs, motor controllers, and power-conversion modules, the EPM240GT100C3N is used for deterministic power-supervisor and reset-sequencing logic. The device's instant-on flash-backed configuration starts in microseconds, with no boot PROM, making it ideal for safety-critical sequencing where the MCU's boot time is too long. With 4.7 ns tPD it can synchronously gate power MOSFET drivers or interlock fault signals at high PWM rates, and the 80 I/Os accommodate wide fan-in from multiple sensor rails.
Được đề xuất
Communications Equipment & Protocol Translation
The EPM240GT100C3N is a workhorse in router, switch, and base-station line cards for low-density protocol translation - UART-to-I2C bridges, SPI-to-parallel decoders, and custom PHY glue. The 100-pin TQFP package exposes 80 user I/Os that can be configured as LVTTL, LVCMOS, or SSTL, enabling direct interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level shifters. With 4.7 ns tPD it cleanly handles 100 Mbps MDIO and similar management buses.
Được đề xuất
Consumer Electronics Glue Logic
In set-top boxes, display controllers, and home appliances, the EPM240GT100C3N replaces dozens of 74-series logic chips with a single programmable device. The 240-LE capacity is sufficient for typical glue tasks - address latching, clock division, watchdog timing, and keypad scanning - while the on-chip UFM can store user preferences or factory calibration. Instant-on flash configuration avoids the FPGA-style boot wait, making it compatible with consumer power-on timing budgets.
Được đề xuất
Test & Measurement Front-End Logic
Test instruments and ATE fixtures use the EPM240GT100C3N for custom timing, signal-routing, and trigger-decoding logic. The 4.7 ns tPD lets it generate precise pulse patterns and decode incoming triggers at speeds that legacy PLDs cannot reach, while JTAG ISP enables fixture calibration in the field. The 80 I/Os provide enough headroom for multi-channel analog-front-end switching, and the 8-Kbit UFM stores per-channel calibration coefficients.
Được đề xuất
Automotive Body Electronics (Non-Safety)
In non-safety automotive body modules - HVAC controllers, lighting drivers, infotainment backplanes - the EPM240GT100C3N provides deterministic glue logic and instant-on configuration. Designers pair it with industrial-grade MAX II G variants for the wider temperature range; the commercial-temperature EPM240GT100C3N is typically used in cabin modules where -40 °C is not required. The 240-LE budget fits typical body-control tasks such as CAN/LIN bridging and switch-debounce logic.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPM240GT100C3N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPM240GT100C3 | EPM240GT100-5N | EPM240GT100 | EPM240GM100I5N | EPM240T100C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | TQFP-100 (GT100) | TQFP-100 (GT100) - same | TQFP-100 (GT100) - same | TQFP-100 (GT100) - same | TQFP-100 (GM100) - same | TQFP-100 (T100) - same |
| Logic Elements | 240 | 240 | 240 | 240 | 240 | 240 |
| Pin-to-Pin Delay (tPD) | 4.7 ns | 4.7 ns | ~6.5 ns | 4.7 ns (typical C3) | ~6.5 ns | ~6.5 ns |
| User I/O Pins | 80 | 80 | 80 | 80 | 80 | 80 |
| Operating Temperature | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | -40 to +100 °C (industrial) | 0 to +85 °C (commercial) |
| UFM Size | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS Compliant | Yes (lead-free) | Yes | Yes | Yes | Yes | Yes |
Bảo phân biệt quan trọng
- Fastest speed grade in the MAX II G 100-pin TQFP family (vsEPM240GT100-5N)
- On-chip UFM eliminates external EEPROM (vsEPM240T100C5N)
- True instant-on from non-volatile flash (vsSmall SRAM-based FPGAs (e.g., Cyclone II))
Ghi chú thiết kế
The EPM240GT100C3N requires a clean 3.3 V core supply (VCCINT) on pins 36 and 72, and per-bank VCCIO supplies (e.g., pin 57 for bank 3, pin 96 for bank 4) for the I/O rings. Place 0.1 µF decoupling capacitors as close as possible to every VCC pin, with at least one 10 µF bulk capacitor per supply rail within 25 mm of the device. Estimated: with all 80 I/Os toggling at 50 MHz, the device draws approximately 30-50 mA from VCCINT - budget accordingly and use a ferrite bead if the 3.3 V rail is shared with noisy digital loads.
Bank VCCIO voltages must match the I/O standard selected in the Quartus pin assignment. Mixing 1.5 V and 3.3 V signals in the same bank is not allowed - use separate banks for each voltage. Always check the MAX II Device Handbook chapter on I/O features before finalizing pin assignments; otherwise inputs may overstress on the lower-voltage bank or fail to meet VIH/VIL thresholds. JTAG pins TCK/TMS/TDI/TDO on pins 97-100 must be pulled or driven correctly during ISP; a floating TCK can cause unintended configuration events.
The 100-pin TQFP has a 0.5 mm lead pitch and is best routed on a 4-layer PCB with a continuous ground plane. Estimated: route all signal traces at 0.15 mm width with 0.15 mm clearance on the outer layers for a controlled-impedance 50 Ω microstrip (verify with your stackup). Place at least four via stitches around the TQFP thermal pad region even though this package does not have an exposed pad - this minimizes ground bounce and improves signal integrity for high-speed JTAG and clock signals.
Thông tin tuân thủ
RoHS compliant per Altera/Intel product page and distributor listings. Lead-free per 'N' suffix in the part number. Not AEC-Q100 qualified; the part targets commercial-grade industrial/consumer designs. The industrial-temperature MAX II G variant EPM240GT100I5N is preferred for -40 °C to +100 °C designs.