EPM240GT100C3N - MAX II CPLD 240 LE TQFP-100 | Intel
MPN: EPM240GT100C3N ✓ פעילEPM240GT100C3N סקירה
What is a CPLD? A complex programmable logic device is a non-volatile programmable logic IC that combines multiple PLA-style macrocells with on-chip flash configuration memory. CPLDs sit above simple PLDs and below FPGAs in the programmable logic hierarchy, with characteristic strengths of deterministic timing, instant-on behavior, and high I/O count. MAX II specifically adds an embedded user flash memory (UFM) and multi-voltage I/O support, bridging classic glue-logic density with small-footprint microcontroller-like functions.
Key features include 240 logic elements, 4.7 ns worst-case tPD, 80 I/Os supporting multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL), an on-chip UFM block that can hold 8 Kbits of user data, in-system programmability via JTAG, and a 3.3 V core with MultiVolt I/O banks that interface cleanly to 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails. The flash-backed configuration eliminates external boot PROMs and gives true instant-on behavior.
Architecturally the MAX II family uses a Logic Array Block (LAB) matrix of 240 LEs arranged in a uniform array, fed by a fast global interconnect with predictable delay paths. The on-chip flash provides ISP and a secure UFM for parameter storage, often used in place of small EEPROMs in glue-logic designs.
Typical applications include I/O expansion and bus bridging for microcontrollers and ASSPs, power-sequencer and reset controllers, address decoding and chip-select generation, glue logic and protocol translation (UART/I2C/SPI bridges), and low-density state-machine controllers in industrial, consumer, and communications equipment.
Designers should size the timing margin for the worst-case tPD over temperature, choose I/O standards per bank to keep the part count down, and budget the UFM write endurance (around 100k cycles per Altera documentation) before substituting it for an EEPROM.
חלופות תחליף ישיר עבור EPM240GT100C3N — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EPM240GT100C3N (אותו גורם צורה וטביעת רגל) — שונים ב Package, Process Technology, Operating Temperature, Programming Interface, Configuration Memory.
EPM240GT100C3
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240GT100-5N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240GT100
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240GM100I5N
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240GM100C5N
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240T100C5N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240GT100C3N דירוגים מרביים ומאפיינים חשמליים
| Manufacturer | Intel (formerly Altera) |
| Series | MAX II |
| Device Family | MAX II G (instant-on, non-volatile CPLD) |
| Logic Elements (LE) | 240 |
| Equivalent Macrocells | 192 |
| User I/O Pins | 80 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Delay (tPD) | 4.7 ns |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage | 3.3 V |
| MultiVolt I/O Standards | LVTTL, LVCMOS, PCI, SSTL (1.5 V / 1.8 V / 2.5 V / 3.3 V) |
| Programmability | In-System Programmable (ISP) via JTAG |
| מארז | TQFP-100 (GT100), 16 x 16 mm, 0.5 mm pitch |
| טמפרטורת פעולה | 0 °C to +85 °C (commercial, suffix C) |
| Lead-Free / RoHS | Lead Free, RoHS Compliant |
| סוג הרכבה | Surface Mount |
תצורת פינים של EPM240GT100C3N
| פין 1 | I/O — User I/O (bank 1) |
| פין 2 | I/O — User I/O (bank 1) |
| פין 3 | I/O — User I/O (bank 1) |
| פין 4 | I/O — User I/O (bank 1) |
| פין 5 | I/O — User I/O (bank 1) |
| פין 6 | I/O — User I/O (bank 1) |
| פין 7 | I/O — User I/O (bank 1) |
| פין 8 | I/O — User I/O (bank 1) |
| פין 9 | I/O — User I/O (bank 1) |
| פין 10 | I/O — User I/O (bank 1) |
| פין 11 | GND — Ground |
| פין 12 | I/O — User I/O (bank 2) |
| פין 13 | I/O — User I/O (bank 2) |
| פין 14 | I/O — User I/O (bank 2) |
| פין 15 | I/O — User I/O (bank 2) |
| פין 16 | I/O — User I/O (bank 2) |
| פין 17 | I/O — User I/O (bank 2) |
| פין 18 | I/O — User I/O (bank 2) |
| פין 19 | I/O — User I/O (bank 2) |
| פין 20 | I/O — User I/O (bank 2) |
| פין 21 | I/O — User I/O (bank 2) |
| פין 22 | I/O — User I/O (bank 2) |
| פין 23 | I/O — User I/O (bank 2) |
| פין 24 | I/O — User I/O (bank 2) |
| פין 25 | I/O — User I/O (bank 2) |
| פין 26 | GND — Ground |
| פין 27 | I/O — User I/O (bank 2) |
| פין 28 | I/O — User I/O (bank 2) |
| פין 29 | I/O — User I/O (bank 2) |
| פין 30 | I/O — User I/O (bank 2) |
| פין 31 | I/O — User I/O (bank 2) |
| פין 32 | I/O — User I/O (bank 2) |
| פין 33 | I/O — User I/O (bank 2) |
| פין 34 | I/O — User I/O (bank 2) |
| פין 35 | I/O — User I/O (bank 2) |
| פין 36 | VCCINT — Core supply 3.3 V |
| פין 37 | I/O — User I/O (bank 3) |
| פין 38 | I/O — User I/O (bank 3) |
| פין 39 | I/O — User I/O (bank 3) |
| פין 40 | I/O — User I/O (bank 3) |
| פין 41 | I/O — User I/O (bank 3) |
| פין 42 | I/O — User I/O (bank 3) |
| פין 43 | I/O — User I/O (bank 3) |
| פין 44 | I/O — User I/O (bank 3) |
| פין 45 | I/O — User I/O (bank 3) |
| פין 46 | I/O — User I/O (bank 3) |
| פין 47 | GND — Ground |
| פין 48 | I/O — User I/O (bank 3) |
| פין 49 | I/O — User I/O (bank 3) |
| פין 50 | I/O — User I/O (bank 3) |
| פין 51 | I/O — User I/O (bank 3) |
| פין 52 | I/O — User I/O (bank 3) |
| פין 53 | I/O — User I/O (bank 3) |
| פין 54 | I/O — User I/O (bank 3) |
| פין 55 | I/O — User I/O (bank 3) |
| פין 56 | I/O — User I/O (bank 3) |
| פין 57 | VCCIO — I/O supply (bank 3) |
| פין 58 | I/O — User I/O (bank 3) |
| פין 59 | I/O — User I/O (bank 3) |
| פין 60 | I/O — User I/O (bank 3) |
| פין 61 | GND — Ground |
| פין 62 | I/O — User I/O (bank 3) |
| פין 63 | I/O — User I/O (bank 3) |
| פין 64 | I/O — User I/O (bank 3) |
| פין 65 | I/O — User I/O (bank 3) |
| פין 66 | I/O — User I/O (bank 3) |
| פין 67 | I/O — User I/O (bank 3) |
| פין 68 | I/O — User I/O (bank 3) |
| פין 69 | I/O — User I/O (bank 3) |
| פין 70 | I/O — User I/O (bank 3) |
| פין 71 | I/O — User I/O (bank 3) |
| פין 72 | VCCINT — Core supply 3.3 V |
| פין 73 | I/O — User I/O (bank 4) |
| פין 74 | I/O — User I/O (bank 4) |
| פין 75 | I/O — User I/O (bank 4) |
| פין 76 | I/O — User I/O (bank 4) |
| פין 77 | I/O — User I/O (bank 4) |
| פין 78 | I/O — User I/O (bank 4) |
| פין 79 | I/O — User I/O (bank 4) |
| פין 80 | I/O — User I/O (bank 4) |
| פין 81 | I/O — User I/O (bank 4) |
| פין 82 | I/O — User I/O (bank 4) |
| פין 83 | GND — Ground |
| פין 84 | I/O — User I/O (bank 4) |
| פין 85 | I/O — User I/O (bank 4) |
| פין 86 | I/O — User I/O (bank 4) |
| פין 87 | I/O — User I/O (bank 4) |
| פין 88 | I/O — User I/O (bank 4) |
| פין 89 | I/O — User I/O (bank 4) |
| פין 90 | I/O — User I/O (bank 4) |
| פין 91 | I/O — User I/O (bank 4) |
| פין 92 | I/O — User I/O (bank 4) |
| פין 93 | I/O — User I/O (bank 4) |
| פין 94 | I/O — User I/O (bank 4) |
| פין 95 | I/O — User I/O (bank 4) |
| פין 96 | VCCIO — I/O supply (bank 4) |
| פין 97 | TCK — JTAG test clock |
| פין 98 | TMS — JTAG test mode select |
| פין 99 | TDI — JTAG test data in |
| פין 100 | TDO — JTAG test data out |
יישומים טיפוסיים
EPM240GT100C3N מתאים עבור 6 יישוםs: Microcontroller I/O Expansion & Bus Bridging, Industrial Control & Power Sequencing, Communications Equipment & Protocol Translation, Consumer Electronics Glue Logic, Test & Measurement Front-End Logic, Automotive Body Electronics (Non-Safety).
Microcontroller I/O Expansion & Bus Bridging
The EPM240GT100C3N is widely used to expand a microcontroller's GPIO count and bridge between incompatible bus protocols. With 240 logic elements and 80 user I/Os, it can implement address decoding, chip-select generation, and parallel-to-serial conversion in a single device, freeing the host MCU from real-time I/O work. The 4.7 ns tPD supports glue-logic paths at 100 MHz+ system clocks, while the 8-Kbit UFM can store calibration or configuration constants that would otherwise require an external EEPROM.
מומלץ
Industrial Control & Power Sequencing
In industrial PLCs, motor controllers, and power-conversion modules, the EPM240GT100C3N is used for deterministic power-supervisor and reset-sequencing logic. The device's instant-on flash-backed configuration starts in microseconds, with no boot PROM, making it ideal for safety-critical sequencing where the MCU's boot time is too long. With 4.7 ns tPD it can synchronously gate power MOSFET drivers or interlock fault signals at high PWM rates, and the 80 I/Os accommodate wide fan-in from multiple sensor rails.
מומלץ
Communications Equipment & Protocol Translation
The EPM240GT100C3N is a workhorse in router, switch, and base-station line cards for low-density protocol translation - UART-to-I2C bridges, SPI-to-parallel decoders, and custom PHY glue. The 100-pin TQFP package exposes 80 user I/Os that can be configured as LVTTL, LVCMOS, or SSTL, enabling direct interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level shifters. With 4.7 ns tPD it cleanly handles 100 Mbps MDIO and similar management buses.
מומלץ
Consumer Electronics Glue Logic
In set-top boxes, display controllers, and home appliances, the EPM240GT100C3N replaces dozens of 74-series logic chips with a single programmable device. The 240-LE capacity is sufficient for typical glue tasks - address latching, clock division, watchdog timing, and keypad scanning - while the on-chip UFM can store user preferences or factory calibration. Instant-on flash configuration avoids the FPGA-style boot wait, making it compatible with consumer power-on timing budgets.
מומלץ
Test & Measurement Front-End Logic
Test instruments and ATE fixtures use the EPM240GT100C3N for custom timing, signal-routing, and trigger-decoding logic. The 4.7 ns tPD lets it generate precise pulse patterns and decode incoming triggers at speeds that legacy PLDs cannot reach, while JTAG ISP enables fixture calibration in the field. The 80 I/Os provide enough headroom for multi-channel analog-front-end switching, and the 8-Kbit UFM stores per-channel calibration coefficients.
מומלץ
Automotive Body Electronics (Non-Safety)
In non-safety automotive body modules - HVAC controllers, lighting drivers, infotainment backplanes - the EPM240GT100C3N provides deterministic glue logic and instant-on configuration. Designers pair it with industrial-grade MAX II G variants for the wider temperature range; the commercial-temperature EPM240GT100C3N is typically used in cabin modules where -40 °C is not required. The 240-LE budget fits typical body-control tasks such as CAN/LIN bridging and switch-debounce logic.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EPM240GT100C3N — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EPM240GT100C3 | EPM240GT100-5N | EPM240GT100 | EPM240GM100I5N | EPM240T100C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | TQFP-100 (GT100) | TQFP-100 (GT100) - same | TQFP-100 (GT100) - same | TQFP-100 (GT100) - same | TQFP-100 (GM100) - same | TQFP-100 (T100) - same |
| Logic Elements | 240 | 240 | 240 | 240 | 240 | 240 |
| Pin-to-Pin Delay (tPD) | 4.7 ns | 4.7 ns | ~6.5 ns | 4.7 ns (typical C3) | ~6.5 ns | ~6.5 ns |
| User I/O Pins | 80 | 80 | 80 | 80 | 80 | 80 |
| Operating Temperature | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | -40 to +100 °C (industrial) | 0 to +85 °C (commercial) |
| UFM Size | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS Compliant | Yes (lead-free) | Yes | Yes | Yes | Yes | Yes |
מבדילים עיקריים
- Fastest speed grade in the MAX II G 100-pin TQFP family (לעומתEPM240GT100-5N)
- On-chip UFM eliminates external EEPROM (לעומתEPM240T100C5N)
- True instant-on from non-volatile flash (לעומתSmall SRAM-based FPGAs (e.g., Cyclone II))
הערות תכנון
The EPM240GT100C3N requires a clean 3.3 V core supply (VCCINT) on pins 36 and 72, and per-bank VCCIO supplies (e.g., pin 57 for bank 3, pin 96 for bank 4) for the I/O rings. Place 0.1 µF decoupling capacitors as close as possible to every VCC pin, with at least one 10 µF bulk capacitor per supply rail within 25 mm of the device. Estimated: with all 80 I/Os toggling at 50 MHz, the device draws approximately 30-50 mA from VCCINT - budget accordingly and use a ferrite bead if the 3.3 V rail is shared with noisy digital loads.
Bank VCCIO voltages must match the I/O standard selected in the Quartus pin assignment. Mixing 1.5 V and 3.3 V signals in the same bank is not allowed - use separate banks for each voltage. Always check the MAX II Device Handbook chapter on I/O features before finalizing pin assignments; otherwise inputs may overstress on the lower-voltage bank or fail to meet VIH/VIL thresholds. JTAG pins TCK/TMS/TDI/TDO on pins 97-100 must be pulled or driven correctly during ISP; a floating TCK can cause unintended configuration events.
The 100-pin TQFP has a 0.5 mm lead pitch and is best routed on a 4-layer PCB with a continuous ground plane. Estimated: route all signal traces at 0.15 mm width with 0.15 mm clearance on the outer layers for a controlled-impedance 50 Ω microstrip (verify with your stackup). Place at least four via stitches around the TQFP thermal pad region even though this package does not have an exposed pad - this minimizes ground bounce and improves signal integrity for high-speed JTAG and clock signals.
מידע על תאימות
RoHS compliant per Altera/Intel product page and distributor listings. Lead-free per 'N' suffix in the part number. Not AEC-Q100 qualified; the part targets commercial-grade industrial/consumer designs. The industrial-temperature MAX II G variant EPM240GT100I5N is preferred for -40 °C to +100 °C designs.
