EPM240GT100C3N - MAX II CPLD 240 LE TQFP-100 | Intel
MPN: EPM240GT100C3N ✓ AktifEPM240GT100C3N Ringkasan
What is a CPLD? A complex programmable logic device is a non-volatile programmable logic IC that combines multiple PLA-style macrocells with on-chip flash configuration memory. CPLDs sit above simple PLDs and below FPGAs in the programmable logic hierarchy, with characteristic strengths of deterministic timing, instant-on behavior, and high I/O count. MAX II specifically adds an embedded user flash memory (UFM) and multi-voltage I/O support, bridging classic glue-logic density with small-footprint microcontroller-like functions.
Key features include 240 logic elements, 4.7 ns worst-case tPD, 80 I/Os supporting multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL), an on-chip UFM block that can hold 8 Kbits of user data, in-system programmability via JTAG, and a 3.3 V core with MultiVolt I/O banks that interface cleanly to 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails. The flash-backed configuration eliminates external boot PROMs and gives true instant-on behavior.
Architecturally the MAX II family uses a Logic Array Block (LAB) matrix of 240 LEs arranged in a uniform array, fed by a fast global interconnect with predictable delay paths. The on-chip flash provides ISP and a secure UFM for parameter storage, often used in place of small EEPROMs in glue-logic designs.
Typical applications include I/O expansion and bus bridging for microcontrollers and ASSPs, power-sequencer and reset controllers, address decoding and chip-select generation, glue logic and protocol translation (UART/I2C/SPI bridges), and low-density state-machine controllers in industrial, consumer, and communications equipment.
Designers should size the timing margin for the worst-case tPD over temperature, choose I/O standards per bank to keep the part count down, and budget the UFM write endurance (around 100k cycles per Altera documentation) before substituting it for an EEPROM.
Alternatif penggantian untuk EPM240GT100C3N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPM240GT100C3N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Operating Temperature, Programming Interface, Configuration Memory.
EPM240GT100C3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM240GT100-5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM240GT100
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM240GM100I5N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPM240GM100C5N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPM240T100C5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM240GT100C3N Rating Maksimal & Karakteristik Listrik
| Manufacturer | Intel (formerly Altera) |
| Series | MAX II |
| Device Family | MAX II G (instant-on, non-volatile CPLD) |
| Logic Elements (LE) | 240 |
| Equivalent Macrocells | 192 |
| User I/O Pins | 80 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Delay (tPD) | 4.7 ns |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage | 3.3 V |
| MultiVolt I/O Standards | LVTTL, LVCMOS, PCI, SSTL (1.5 V / 1.8 V / 2.5 V / 3.3 V) |
| Programmability | In-System Programmable (ISP) via JTAG |
| Paket | TQFP-100 (GT100), 16 x 16 mm, 0.5 mm pitch |
| Suhu Kerja | 0 °C to +85 °C (commercial, suffix C) |
| Lead-Free / RoHS | Lead Free, RoHS Compliant |
| Tipe Mounting | Surface Mount |
Konfigurasi Pin EPM240GT100C3N
| Pin produk 1 | I/O — User I/O (bank 1) |
| Pin produk 2 | I/O — User I/O (bank 1) |
| Pin produk 3 | I/O — User I/O (bank 1) |
| Pin produk 4 | I/O — User I/O (bank 1) |
| Pin produk 5 | I/O — User I/O (bank 1) |
| Pin produk 6 | I/O — User I/O (bank 1) |
| Pin produk 7 | I/O — User I/O (bank 1) |
| Pin produk 8 | I/O — User I/O (bank 1) |
| Pin produk 9 | I/O — User I/O (bank 1) |
| Pin produk 10 | I/O — User I/O (bank 1) |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O (bank 2) |
| Pin produk 13 | I/O — User I/O (bank 2) |
| Pin produk 14 | I/O — User I/O (bank 2) |
| Pin produk 15 | I/O — User I/O (bank 2) |
| Pin produk 16 | I/O — User I/O (bank 2) |
| Pin produk 17 | I/O — User I/O (bank 2) |
| Pin produk 18 | I/O — User I/O (bank 2) |
| Pin produk 19 | I/O — User I/O (bank 2) |
| Pin produk 20 | I/O — User I/O (bank 2) |
| Pin produk 21 | I/O — User I/O (bank 2) |
| Pin produk 22 | I/O — User I/O (bank 2) |
| Pin produk 23 | I/O — User I/O (bank 2) |
| Pin produk 24 | I/O — User I/O (bank 2) |
| Pin produk 25 | I/O — User I/O (bank 2) |
| Pin produk 26 | GND — Ground |
| Pin produk 27 | I/O — User I/O (bank 2) |
| Pin produk 28 | I/O — User I/O (bank 2) |
| Pin produk 29 | I/O — User I/O (bank 2) |
| Pin produk 30 | I/O — User I/O (bank 2) |
| Pin produk 31 | I/O — User I/O (bank 2) |
| Pin produk 32 | I/O — User I/O (bank 2) |
| Pin produk 33 | I/O — User I/O (bank 2) |
| Pin produk 34 | I/O — User I/O (bank 2) |
| Pin produk 35 | I/O — User I/O (bank 2) |
| Pin produk 36 | VCCINT — Core supply 3.3 V |
| Pin produk 37 | I/O — User I/O (bank 3) |
| Pin produk 38 | I/O — User I/O (bank 3) |
| Pin produk 39 | I/O — User I/O (bank 3) |
| Pin produk 40 | I/O — User I/O (bank 3) |
| Pin produk 41 | I/O — User I/O (bank 3) |
| Pin produk 42 | I/O — User I/O (bank 3) |
| Pin produk 43 | I/O — User I/O (bank 3) |
| Pin produk 44 | I/O — User I/O (bank 3) |
| Pin produk 45 | I/O — User I/O (bank 3) |
| Pin produk 46 | I/O — User I/O (bank 3) |
| Pin produk 47 | GND — Ground |
| Pin produk 48 | I/O — User I/O (bank 3) |
| Pin produk 49 | I/O — User I/O (bank 3) |
| Pin produk 50 | I/O — User I/O (bank 3) |
| Pin produk 51 | I/O — User I/O (bank 3) |
| Pin produk 52 | I/O — User I/O (bank 3) |
| Pin produk 53 | I/O — User I/O (bank 3) |
| Pin produk 54 | I/O — User I/O (bank 3) |
| Pin produk 55 | I/O — User I/O (bank 3) |
| Pin produk 56 | I/O — User I/O (bank 3) |
| Pin produk 57 | VCCIO — I/O supply (bank 3) |
| Pin produk 58 | I/O — User I/O (bank 3) |
| Pin produk 59 | I/O — User I/O (bank 3) |
| Pin produk 60 | I/O — User I/O (bank 3) |
| Pin produk 61 | GND — Ground |
| Pin produk 62 | I/O — User I/O (bank 3) |
| Pin produk 63 | I/O — User I/O (bank 3) |
| Pin produk 64 | I/O — User I/O (bank 3) |
| Pin produk 65 | I/O — User I/O (bank 3) |
| Pin produk 66 | I/O — User I/O (bank 3) |
| Pin produk 67 | I/O — User I/O (bank 3) |
| Pin produk 68 | I/O — User I/O (bank 3) |
| Pin produk 69 | I/O — User I/O (bank 3) |
| Pin produk 70 | I/O — User I/O (bank 3) |
| Pin produk 71 | I/O — User I/O (bank 3) |
| Pin produk 72 | VCCINT — Core supply 3.3 V |
| Pin produk 73 | I/O — User I/O (bank 4) |
| Pin produk 74 | I/O — User I/O (bank 4) |
| Pin produk 75 | I/O — User I/O (bank 4) |
| Pin produk 76 | I/O — User I/O (bank 4) |
| Pin produk 77 | I/O — User I/O (bank 4) |
| Pin produk 78 | I/O — User I/O (bank 4) |
| Pin produk 79 | I/O — User I/O (bank 4) |
| Pin produk 80 | I/O — User I/O (bank 4) |
| Pin produk 81 | I/O — User I/O (bank 4) |
| Pin produk 82 | I/O — User I/O (bank 4) |
| Pin produk 83 | GND — Ground |
| Pin produk 84 | I/O — User I/O (bank 4) |
| Pin produk 85 | I/O — User I/O (bank 4) |
| Pin produk 86 | I/O — User I/O (bank 4) |
| Pin produk 87 | I/O — User I/O (bank 4) |
| Pin produk 88 | I/O — User I/O (bank 4) |
| Pin produk 89 | I/O — User I/O (bank 4) |
| Pin produk 90 | I/O — User I/O (bank 4) |
| Pin produk 91 | I/O — User I/O (bank 4) |
| Pin produk 92 | I/O — User I/O (bank 4) |
| Pin produk 93 | I/O — User I/O (bank 4) |
| Pin produk 94 | I/O — User I/O (bank 4) |
| Pin produk 95 | I/O — User I/O (bank 4) |
| Pin produk 96 | VCCIO — I/O supply (bank 4) |
| Pin produk 97 | TCK — JTAG test clock |
| Pin produk 98 | TMS — JTAG test mode select |
| Pin produk 99 | TDI — JTAG test data in |
| Pin produk 100 | TDO — JTAG test data out |
Aplikasi Umum
EPM240GT100C3N cocok untuk 6 aplikasis: Microcontroller I/O Expansion & Bus Bridging, Industrial Control & Power Sequencing, Communications Equipment & Protocol Translation, Consumer Electronics Glue Logic, Test & Measurement Front-End Logic, Automotive Body Electronics (Non-Safety).
Microcontroller I/O Expansion & Bus Bridging
The EPM240GT100C3N is widely used to expand a microcontroller's GPIO count and bridge between incompatible bus protocols. With 240 logic elements and 80 user I/Os, it can implement address decoding, chip-select generation, and parallel-to-serial conversion in a single device, freeing the host MCU from real-time I/O work. The 4.7 ns tPD supports glue-logic paths at 100 MHz+ system clocks, while the 8-Kbit UFM can store calibration or configuration constants that would otherwise require an external EEPROM.
Direkomendasikan
Industrial Control & Power Sequencing
In industrial PLCs, motor controllers, and power-conversion modules, the EPM240GT100C3N is used for deterministic power-supervisor and reset-sequencing logic. The device's instant-on flash-backed configuration starts in microseconds, with no boot PROM, making it ideal for safety-critical sequencing where the MCU's boot time is too long. With 4.7 ns tPD it can synchronously gate power MOSFET drivers or interlock fault signals at high PWM rates, and the 80 I/Os accommodate wide fan-in from multiple sensor rails.
Direkomendasikan
Communications Equipment & Protocol Translation
The EPM240GT100C3N is a workhorse in router, switch, and base-station line cards for low-density protocol translation - UART-to-I2C bridges, SPI-to-parallel decoders, and custom PHY glue. The 100-pin TQFP package exposes 80 user I/Os that can be configured as LVTTL, LVCMOS, or SSTL, enabling direct interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level shifters. With 4.7 ns tPD it cleanly handles 100 Mbps MDIO and similar management buses.
Direkomendasikan
Consumer Electronics Glue Logic
In set-top boxes, display controllers, and home appliances, the EPM240GT100C3N replaces dozens of 74-series logic chips with a single programmable device. The 240-LE capacity is sufficient for typical glue tasks - address latching, clock division, watchdog timing, and keypad scanning - while the on-chip UFM can store user preferences or factory calibration. Instant-on flash configuration avoids the FPGA-style boot wait, making it compatible with consumer power-on timing budgets.
Direkomendasikan
Test & Measurement Front-End Logic
Test instruments and ATE fixtures use the EPM240GT100C3N for custom timing, signal-routing, and trigger-decoding logic. The 4.7 ns tPD lets it generate precise pulse patterns and decode incoming triggers at speeds that legacy PLDs cannot reach, while JTAG ISP enables fixture calibration in the field. The 80 I/Os provide enough headroom for multi-channel analog-front-end switching, and the 8-Kbit UFM stores per-channel calibration coefficients.
Direkomendasikan
Automotive Body Electronics (Non-Safety)
In non-safety automotive body modules - HVAC controllers, lighting drivers, infotainment backplanes - the EPM240GT100C3N provides deterministic glue logic and instant-on configuration. Designers pair it with industrial-grade MAX II G variants for the wider temperature range; the commercial-temperature EPM240GT100C3N is typically used in cabin modules where -40 °C is not required. The 240-LE budget fits typical body-control tasks such as CAN/LIN bridging and switch-debounce logic.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPM240GT100C3N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPM240GT100C3 | EPM240GT100-5N | EPM240GT100 | EPM240GM100I5N | EPM240T100C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | TQFP-100 (GT100) | TQFP-100 (GT100) - same | TQFP-100 (GT100) - same | TQFP-100 (GT100) - same | TQFP-100 (GM100) - same | TQFP-100 (T100) - same |
| Logic Elements | 240 | 240 | 240 | 240 | 240 | 240 |
| Pin-to-Pin Delay (tPD) | 4.7 ns | 4.7 ns | ~6.5 ns | 4.7 ns (typical C3) | ~6.5 ns | ~6.5 ns |
| User I/O Pins | 80 | 80 | 80 | 80 | 80 | 80 |
| Operating Temperature | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | -40 to +100 °C (industrial) | 0 to +85 °C (commercial) |
| UFM Size | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS Compliant | Yes (lead-free) | Yes | Yes | Yes | Yes | Yes |
Diferensiator Kunci
- Fastest speed grade in the MAX II G 100-pin TQFP family (vsEPM240GT100-5N)
- On-chip UFM eliminates external EEPROM (vsEPM240T100C5N)
- True instant-on from non-volatile flash (vsSmall SRAM-based FPGAs (e.g., Cyclone II))
Catatan Desain
The EPM240GT100C3N requires a clean 3.3 V core supply (VCCINT) on pins 36 and 72, and per-bank VCCIO supplies (e.g., pin 57 for bank 3, pin 96 for bank 4) for the I/O rings. Place 0.1 µF decoupling capacitors as close as possible to every VCC pin, with at least one 10 µF bulk capacitor per supply rail within 25 mm of the device. Estimated: with all 80 I/Os toggling at 50 MHz, the device draws approximately 30-50 mA from VCCINT - budget accordingly and use a ferrite bead if the 3.3 V rail is shared with noisy digital loads.
Bank VCCIO voltages must match the I/O standard selected in the Quartus pin assignment. Mixing 1.5 V and 3.3 V signals in the same bank is not allowed - use separate banks for each voltage. Always check the MAX II Device Handbook chapter on I/O features before finalizing pin assignments; otherwise inputs may overstress on the lower-voltage bank or fail to meet VIH/VIL thresholds. JTAG pins TCK/TMS/TDI/TDO on pins 97-100 must be pulled or driven correctly during ISP; a floating TCK can cause unintended configuration events.
The 100-pin TQFP has a 0.5 mm lead pitch and is best routed on a 4-layer PCB with a continuous ground plane. Estimated: route all signal traces at 0.15 mm width with 0.15 mm clearance on the outer layers for a controlled-impedance 50 Ω microstrip (verify with your stackup). Place at least four via stitches around the TQFP thermal pad region even though this package does not have an exposed pad - this minimizes ground bounce and improves signal integrity for high-speed JTAG and clock signals.
Informasi Konformitas
RoHS compliant per Altera/Intel product page and distributor listings. Lead-free per 'N' suffix in the part number. Not AEC-Q100 qualified; the part targets commercial-grade industrial/consumer designs. The industrial-temperature MAX II G variant EPM240GT100I5N is preferred for -40 °C to +100 °C designs.
