EPM3256AFI256-10 - 256-Macrocell CPLD, 10ns, FBGA-256 | Intel
MPN: EPM3256AFI256-10 ⚠ Lần mua cuốiEPM3256AFI256-10 Tóm tắt
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple SPLDs/GALs and FPGAs in the programmable logic hierarchy (SPLD -> CPLD -> FPGA -> programmable logic -> semiconductor). It uses a combination of AND/OR macrocell fabric and a predictable interconnect network to implement glue logic, interface bridging, and state-machine control functions with deterministic, fixed timing - making it ideal for designs that need deterministic sub-100ns response without FPGA configuration overhead.
Key features of the EPM3256AFI256-10 include MultiVolt I/O supporting 5.0V, 3.3V, and 2.5V logic interfaces, 5ns PCI-compliant timing in faster speed grades, 16 macocells per Logic Array Block (LAB) with 256 total macrocells, and a JTAG-compliant boundary-scan test interface. The MAX 3000A architecture shares the same JTAG, ISP, and 4-pin configuration protocols used across the broader MAX family, simplifying design reuse. The FineLine BGA-256 package provides high I/O density (161 user I/Os) for space-constrained systems, while the EEPROM process technology guarantees 100 program/erase cycles and 20-year data retention without external boot memory.
Typical applications include PCI bus interface glue logic, memory and processor address decoding, bus-width adaptation (e.g., 8-bit to 32-bit bridging), high-speed state-machine control, and power-sequencing logic in multi-rail systems. The deterministic timing makes it well-suited for industrial control, telecom line-card interfaces, and legacy peripheral replacement.
When designing with the EPM3256AFI256-10, ensure the I/O bank supply rails match the logic-level targets (VCCIO for output drive, VCCINT for core) and respect the device's 3.3V core requirement. Use Quartus II or MAX+PLUS II for design entry; legacy designs may continue using MAX+PLUS II for source compatibility.
This page synthesizes distributor stock, drop-in MAX 3000A family alternatives, and practical design notes not consolidated on the manufacturer product page or single distributor listing.
Bộ thay thế dễ dàng lắp đặt cho EPM3256AFI256-10 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM3256AFI256-10 (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, In-System Programmability, Logic Family, Speed Grade.
EPM3256AFI256-10N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPM3256AFC256-10
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM3256AFC256-10N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM3256AFC256-7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM3256AFI256-10 Tỷ lệ tối đa & tính chất điện
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 256 |
| User I/Os | 161 |
| Logic Elements / LABs | 16 Logic Elements per LAB |
| Propagation Delay (tPD) | 10 ns |
| Supply Voltage - Core | 3.3 V |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (MultiVolt I/O) |
| Programmability | In-System Programmable (ISP) via IEEE 1149.1 JTAG |
| Process Technology | CMOS EEPROM |
| Package Type | FBGA-256 (FineLine BGA) |
| Nhiệt độ hoạt động | -40C to +85C (Industrial) |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Speed Grade | -10 (10 ns pin-to-pin) |
Hướng dẫn cấu hình chân EPM3256AFI256-10 fbga-256 (fineline bga)
Cấu hình chân cho EPM3256AFI256-10 (fbga-256 (fineline bga) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EPM3256AFI256-10.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EPM3256AFI256-10 phù hợp cho 6 Áp dụngs: PCI Local Bus Interface Glue Logic, Industrial Control / Factory Automation, Memory and Processor Address Decoding, Bus Width Bridging (8/16-bit to 32-bit), Power Sequencing and Reset Logic, Legacy Peripheral Replacement / Glue Logic Modernization.
PCI Local Bus Interface Glue Logic
The EPM3256AFI256-10 fits PCI bus interface glue logic with 161 user I/Os and deterministic 10 ns pin-to-pin delay. PCI Local Bus 2.2 requires 33 MHz operation with predictable address-decode and command-handling timing - the MAX 3000A architecture delivers fixed tPD independent of routing, which FPGAs cannot guarantee. Place the CPLD between the host bridge and 32-bit peripheral bus, using 5.0V-tolerant I/O for PCI signaling at 3.3V core; JTAG ISP enables post-assembly protocol fixes.
Được đề xuất
Industrial Control / Factory Automation
The EPM3256AFI256-10 is ideal for industrial control applications with -40C to +85C operation and 256 macrocells. Implement deterministic state machines for PLC line-control, motor-driver sequencing, or sensor-multiplexing logic where instant-on non-volatile configuration matters. The 161 I/Os comfortably handle multiple encoder inputs (quadrature decode), relay-driver outputs, and Modbus/RS-485 interfaces; the 10 ns tPD guarantees tight control-loop timing regardless of routing density.
Được đề xuất
Memory and Processor Address Decoding
Use the EPM3256AFI256-10 for memory and processor address decoding in embedded systems requiring deterministic chip-select generation. The 256 macrocells handle complex decode tables for multi-bank Flash, SRAM, and peripheral devices, while the 10 ns tPD stays inside typical memory-access budgets even at full 32-bit address width. MultiVolt I/O lets 5.0V memories and 3.3V processors share the same CPLD without level shifters, and JTAG ISP allows late-stage decode-table fixes after PCB bring-up.
Được đề xuất
Bus Width Bridging (8/16-bit to 32-bit)
The EPM3256AFI256-10 bridges 8-bit and 16-bit peripherals to 32-bit host buses with its 161 user I/Os and 10 ns fixed delay. Capture and re-time multiplexed address/data buses in a single device, with the high I/O count accommodating both the wide host bus and multiple narrow peripherals in parallel. EEPROM non-volatile storage means instant-on bus-ready state without external boot configuration, and the deterministic timing simplifies bus-turnaround analysis versus FPGA-based alternatives.
Được đề xuất
Power Sequencing and Reset Logic
The EPM3256AFI256-10 reliably sequences multi-rail power-up/down in servers, telecom line cards, and FPGA-based subsystems. With 161 I/Os and 256 macrocells, monitor PG (power-good) signals from dozens of rails, generate sequenced EN/MR signals, and provide glitch-filtered resets - all with 10 ns deterministic response. MultiVolt I/O interfaces directly to 5.0V supervisors and 3.3V/2.5V downstream regulators without level shifters, and EEPROM non-volatility ensures the sequencer logic is available before any FPGA config begins.
Được đề xuất
Legacy Peripheral Replacement / Glue Logic Modernization
The EPM3256AFI256-10 modernizes legacy designs by replacing 7400-series TTL/MSI glue logic with a single programmable device. Consolidate dozens of AND/OR gates, latches, and one-shots into the 256-macrocell fabric, reducing board area and improving testability through JTAG boundary scan. With 161 I/Os the CPLD can absorb entire decoder/mux/buffer trees, and 10 ns tPD matches the propagation budget of the original TTL gates - even in industrial environments up to +85C.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPM3256AFI256-10 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPM3256AFI256-10N | EPM3256AFC256-10 | EPM3256AFC256-10N | EPM3256AFC256-7 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 (FineLine BGA) | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Macrocells | 256 | 256 | 256 | 256 | 256 |
| User I/Os | 161 | 161 | 161 | 161 | 161 |
| Propagation Delay (tPD) | 10 ns | 10 ns | 10 ns | 10 ns | 7.5 ns (faster -7 grade) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| MultiVolt I/O | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V |
| In-System Programmability | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP |
| Lifecycle Status | Last-time-buy (MAX 3000A EOL) | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Bảo phân biệt quan trọng
- Industrial temperature grade for harsh environments (vsEPM3256AFC256-10)
- MultiVolt I/O with 5.0V tolerance on a 3.3V core (vsMAX II EPM240)
- 161 user I/Os in FBGA-256 with 10 ns deterministic tPD (vsXilinx XC95288XL in similar BGA package)
Ghi chú thiết kế
The FBGA-256 FineLine BGA package requires careful PCB layout: 1.0mm ball pitch, microvia-compatible land patterns, and matched-length traces for high-speed buses. Place at least four 0.1uF decoupling capacitors as close as possible to the VCCINT and VCCIO supply balls (typically distributed around the package perimeter). For JTAG ISP, route TMS, TCK, TDI, TDO through a 4-pin header with ESD protection. Solder paste stencil aperture should follow the package recommendation (typically 0.5mm diameter pads with 0.1mm stencil thickness).
Common pitfalls include: (1) mixing VCCIO and VCCINT - VCCINT must be 3.3V while VCCIO can be 2.5V/3.3V/5.0V per MultiVolt spec; (2) using JTAG TCK above the rated 10 MHz during ISP programming can fail silently - keep TCK at or below 10 MHz; (3) leaving the OE/CEO# pins floating causes high-Icc standby - tie to known state via 10k resistor; (4) PCI 2.2 timing requires -4/-5/-6/-7 speed grades, NOT the -10 grade - verify speed grade selection. Always check the BSDL file for the exact device before in-system test.
Estimated: at maximum toggle rate (~100 MHz internal, 161 I/Os at 33 MHz PCI), the EPM3256AFI256-10 dissipates roughly 0.5-1.0 W from the 3.3V core supply. The FBGA-256 package's theta_JA is typically 25-30 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of 15-30 C above ambient. For industrial -40C to +85C operation no heatsink is required, but adequate airflow is recommended when the device is mounted near heat sources (e.g., FPGAs or DC-DC converters).
JTAG chain routing: when the EPM3256AFI256-10 is in a JTAG chain with other devices (FPGAs, boundary-scan ICs), match the TMS and TCK trace lengths within 50 mils to avoid setup/hold violations at high TCK frequencies. Place a 10k pull-up on TCK and a 10k pull-up on TMS to keep them in known states during power-up. Add a 4.7k series resistor on TDI/TDO for signal integrity if the JTAG cable exceeds 6 inches. Refer to AN 39: JTAG Boundary-Scan Testing for MAX Series Devices for full layout guidance.
Thông tin tuân thủ
RoHS, REACH, lead-free, and halogen-free status not provided in the verified web data - listed as [DATA_NEEDED]. The -10N suffix on EPM3256AFI256-10N conventionally indicates lead-free finish per Altera/Intel naming convention. Not AEC-Q100 qualified (industrial-grade CPLD, not automotive).
