Intel

EPM570GT144C3 - MAX II 570 LE CPLD, 5.4ns, 144-TQFP | Intel

MPN: EPM570GT144C3 ✓ Hoạt động
1.8 V (internal regulator from VCCINT 3.3 V) Vdss 144-pin TQFP (GT144) Package 8 Kbits (8,192 bits) Memory
MOQ: 1 |

EPM570GT144C3 Tóm tắt

The Intel EPM570GT144C3 is a member of the MAX II family of Complex Programmable Logic Devices (CPLDs), delivering 570 Logic Elements (LEs), 8 Kbits of user flash memory (UFM), and a 5.4 ns pin-to-pin propagation delay in a 144-pin TQFP (GT144) package with commercial temperature grading. Manufactured on a 0.30 µm 6-layer-metal flash process, it targets glue-logic, bus-bridging, and control-plane applications where low cost, non-volatile configuration, and instant-on behavior are required.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device built from multiple PAL-like macrocells interconnected by a global routing interconnect. It occupies a position in the programmable logic hierarchy between discrete logic gates (smallest) and FPGAs (largest and highest-density), offering deterministic timing, instant-on operation from on-chip flash, and high-drive I/O suitable for bus-interface and control-plane tasks. MAX II devices specifically combine the lowest static power of any CPLD family with non-volatile storage and a built-in user flash memory block for system housekeeping data.

Key features of the EPM570GT144C3 include 440 macrocells, 76 user-available I/Os in the 144-pin TQFP package, MultiVolt I/O support (1.5V, 1.8V, 2.5V, 3.3V mixed-voltage interfaces), 1.8V core supply with on-chip voltage regulator, JTAG-based IEEE 1149.1 in-system programmability (ISP), and a built-in UFM block (8 Kbits) that can store user data such as serial numbers, configuration parameters, or boot code. The device consumes as little as 35 µA of standby current in power-saving modes.

Architecturally, the MAX II device combines a non-volatile flash configuration cell with a volatile SRAM-based logic fabric, where each Logic Element contains a 4-input look-up table (LUT), a programmable register, and a carry chain for arithmetic. The flash cell holds the configuration permanently, eliminating the need for an external boot PROM and enabling instant-on operation within microseconds of power-up. The MultiVolt I/O banks allow direct interfacing to 1.5V, 1.8V, 2.5V, and 3.3V logic without external level shifters.

Typical applications include bus-interface bridging (PCI to local bus, I2C to SPI), power-sequencer and supervisory logic for FPGA-based systems, address decoding and glue logic in microcontroller designs, industrial control and factory automation, and consumer electronics requiring low-cost, low-power programmable logic. The 144-pin TQFP package is suitable for hand-solderable prototypes and low-volume through-hole-friendly manufacturing, as opposed to the FineLine BGA variants used in high-density portable designs.

When designing with the EPM570GT144C3, plan for the Quartus Prime design suite (MAX II device support) and verify that I/O bank voltage assignments match the connected logic rails; misuse of MultiVolt banks is the most common cause of CPLD I/O failures during bring-up. The 5.4 ns tPD1 figure is sufficient for sub-200 MHz glue-logic applications but should be derated against temperature for worst-case timing closure.

Bộ thay thế dễ dàng lắp đặt cho EPM570GT144C3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM570GT144C3 (cùng hình factor và footprint) — khác nhau ở Package, Programming Interface, Operating Temperature, Process Technology, User Flash Memory (UFM).

Intel
Package: 144-pin TQFP (20 x 20 mm)
Programming Interface: JTAG (IEEE 1149.1)
Operating Temperature: 0 C to +85 C (Commercial)
So sánh với EPM570GT144C3 →
Intel
Package: TQFP-144 (GT)
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: 0.18 µm, 6-layer-metal flash
So sánh với EPM570GT144C3 →
Intel
Package: 144-pin TQFP
Programming Interface: JTAG (IEEE 1149.1) / ByteBlaster
Operating Temperature: 0 °C to +85 °C (commercial)
So sánh với EPM570GT144C3 →
Intel
Package: 144-TQFP (20x20 mm)
Operating Temperature: 0C to +85C (commercial)
So sánh với EPM570GT144C3 →
Altera
Package: 144-pin TQFP (20 x 20 mm)
Programming Interface: JTAG (IEEE 1149.1) / IEEE 1532 ISP
Process Technology: 0.18 µm
So sánh với EPM570GT144C3 →
Intel
Package: TQFP-144 (GT144)
Programming Interface: JTAG (IEEE 1149.1) ISP
Operating Temperature: -40C to +100C (industrial)
So sánh với EPM570GT144C3 →
Intel
Package: 144-pin TQFP (20 mm × 20 mm × 1.4 mm)
Programming Interface: IEEE 1149.1 JTAG (ISP)
Process Technology: 0.18 µm
So sánh với EPM570GT144C3 →

EPM570GT144C5N

✅ Drop-In
Altera
📦 144-pin TQFP (GT144)
MAX II · 440 · 212 · 5.4 ns · 201.1 MHz · 8 Kbits · 0.18 µm · 1.8 V

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Xem tài liệu →

EPM570GT144I5N

✅ Drop-In
Intel
📦 144-pin TQFP (GT144)
MAX II · CPLD (Complex Programmable Logic Device) · 570 · 440 · 116 (TQFP-144) · 8 Kbits · 1.8 V

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Xem tài liệu →

EPM570GT144C3N

✅ Drop-In ⚠️ Thông số chưa được xác minh
Intel
📦 144-pin TQFP (GT144)
MAX II · 570 · 440 · 116 · 5.4 ns · 8 Kbits · 1.71 V to 1.89 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS/LVTTL

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Xem tài liệu →

EPM570GT144C4N

✅ Drop-In ⚠️ Thông số chưa được xác minh
Intel
📦 144-pin TQFP (GT144)
MAX II · 570 · 440 · 116 · 8 Kbit · 5.4 ns (C4 speed grade) · 3.3 V · 1.5 V, 1.8 V, 2.5 V, 3.3 V

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Xem tài liệu →

EPM570GT144C3 Tỷ lệ tối đa & tính chất điện

Family MAX II
Logic Elements (LEs) 570
Equivalent Macrocells 440
User I/O Count 76 (max, package-dependent)
Pin-to-Pin Propagation Delay (tPD1) 5.4 ns (commercial, fastest speed grade)
User Flash Memory (UFM) 8 Kbits (8,192 bits)
Core Supply Voltage 1.8 V (internal regulator from VCCINT 3.3 V)
I/O Supply Voltages 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Nhiệt độ hoạt động 0 °C to +85 °C (commercial, C3 grade)
Hộp 144-pin TQFP (GT144)
Kiểu lắp đặt Surface Mount
Process Technology 0.30 µm 6-layer-metal flash CMOS
Configuration Method Non-volatile on-chip flash (instant-on)
Programming Interface JTAG IEEE 1149.1 (ISP)
Trạng thái RoHS Compliant
Cấp MSL MSL 3 (per JEDEC J-STD-020)

Cấu hình chân EPM570GT144C3

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Chân 1 I/O — User I/O (bank 1)
Chân 2 I/O — User I/O (bank 1)
Chân 3 I/O — User I/O (bank 1)
Chân 4 I/O — User I/O (bank 1)
Chân 5 I/O — User I/O (bank 1)
Chân 6 I/O — User I/O (bank 1)
Chân 7 I/O — User I/O (bank 1)
Chân 8 VCCIO1 — I/O bank 1 supply voltage (1.5/1.8/2.5/3.3V)
Chân 9 I/O — User I/O (bank 1)
Chân 10 I/O — User I/O (bank 1)
Chân 11 I/O — User I/O (bank 1)
Chân 12 I/O — User I/O (bank 1)
Chân 13 I/O — User I/O (bank 2)
Chân 14 I/O — User I/O (bank 2)
Chân 15 VCCIO2 — I/O bank 2 supply voltage
Chân 16 I/O — User I/O (bank 2)
Chân 17 I/O — User I/O (bank 2)
Chân 18 I/O — User I/O (bank 2)
Chân 19 I/O — User I/O (bank 2)
Chân 20 I/O — User I/O (bank 2)
Chân 21 I/O — User I/O (bank 2)
Chân 22 I/O — User I/O (bank 2)
Chân 23 I/O — User I/O (bank 2)
Chân 24 I/O — User I/O (bank 2)
Chân 25 I/O — User I/O (bank 2)
Chân 26 I/O — User I/O (bank 2)
Chân 27 I/O — User I/O (bank 3)
Chân 28 VCCIO3 — I/O bank 3 supply voltage
Chân 29 I/O — User I/O (bank 3)
Chân 30 I/O — User I/O (bank 3)
Chân 31 I/O — User I/O (bank 3)
Chân 32 I/O — User I/O (bank 3)
Chân 33 I/O — User I/O (bank 3)
Chân 34 I/O — User I/O (bank 3)
Chân 35 I/O — User I/O (bank 3)
Chân 36 I/O — User I/O (bank 3)
Chân 37 VCCINT — Core analog 3.3V supply
Chân 38 GND — Ground
Chân 39 I/O — User I/O (bank 4)
Chân 40 I/O — User I/O (bank 4)
Chân 41 I/O — User I/O (bank 4)
Chân 42 I/O — User I/O (bank 4)
Chân 43 I/O — User I/O (bank 4)
Chân 44 I/O — User I/O (bank 4)
Chân 45 I/O — User I/O (bank 4)
Chân 46 VCCIO4 — I/O bank 4 supply voltage
Chân 47 I/O — User I/O (bank 4)
Chân 48 I/O — User I/O (bank 4)
Chân 49 I/O — User I/O (bank 4)
Chân 50 I/O — User I/O (bank 4)
Chân 51 I/O — User I/O (bank 4)
Chân 52 I/O — User I/O (bank 4)
Chân 53 I/O — User I/O (bank 4)
Chân 54 I/O — User I/O (bank 4)
Chân 55 I/O — User I/O (bank 4)
Chân 56 I/O — User I/O (bank 4)
Chân 57 I/O — User I/O (bank 4)
Chân 58 I/O — User I/O (bank 4)
Chân 59 I/O — User I/O (bank 4)
Chân 60 I/O — User I/O (bank 4)
Chân 61 I/O — User I/O (bank 4)
Chân 62 I/O — User I/O (bank 4)
Chân 63 I/O — User I/O (bank 4)
Chân 64 I/O — User I/O (bank 4)
Chân 65 I/O — User I/O (bank 4)
Chân 66 I/O — User I/O (bank 4)
Chân 67 VCCIO4 — I/O bank 4 supply voltage
Chân 68 I/O — User I/O (bank 4)
Chân 69 I/O — User I/O (bank 4)
Chân 70 I/O — User I/O (bank 4)
Chân 71 I/O — User I/O (bank 4)
Chân 72 I/O — User I/O (bank 4)
Chân 73 TDI — JTAG Test Data In
Chân 74 TCK — JTAG Test Clock
Chân 75 TMS — JTAG Test Mode Select
Chân 76 nCONFIG — Configuration start (active low)
Chân 77 I/O — User I/O (bank 3)
Chân 78 I/O — User I/O (bank 3)
Chân 79 I/O — User I/O (bank 3)
Chân 80 VCCIO3 — I/O bank 3 supply voltage
Chân 81 I/O — User I/O (bank 3)
Chân 82 I/O — User I/O (bank 3)
Chân 83 I/O — User I/O (bank 3)
Chân 84 I/O — User I/O (bank 3)
Chân 85 I/O — User I/O (bank 3)
Chân 86 I/O — User I/O (bank 3)
Chân 87 I/O — User I/O (bank 3)
Chân 88 I/O — User I/O (bank 3)
Chân 89 I/O — User I/O (bank 3)
Chân 90 I/O — User I/O (bank 3)
Chân 91 GND — Ground
Chân 92 I/O — User I/O (bank 2)
Chân 93 I/O — User I/O (bank 2)
Chân 94 I/O — User I/O (bank 2)
Chân 95 I/O — User I/O (bank 2)
Chân 96 VCCIO2 — I/O bank 2 supply voltage
Chân 97 I/O — User I/O (bank 2)
Chân 98 I/O — User I/O (bank 2)
Chân 99 I/O — User I/O (bank 2)
Chân 100 I/O — User I/O (bank 2)
Chân 101 I/O — User I/O (bank 2)
Chân 102 I/O — User I/O (bank 2)
Chân 103 I/O — User I/O (bank 2)
Chân 104 I/O — User I/O (bank 2)
Chân 105 I/O — User I/O (bank 2)
Chân 106 I/O — User I/O (bank 2)
Chân 107 I/O — User I/O (bank 2)
Chân 108 I/O — User I/O (bank 1)
Chân 109 VCCIO1 — I/O bank 1 supply voltage
Chân 110 I/O — User I/O (bank 1)
Chân 111 I/O — User I/O (bank 1)
Chân 112 I/O — User I/O (bank 1)
Chân 113 I/O — User I/O (bank 1)
Chân 114 I/O — User I/O (bank 1)
Chân 115 I/O — User I/O (bank 1)
Chân 116 I/O — User I/O (bank 1)
Chân 117 I/O — User I/O (bank 1)
Chân 118 CONF_DONE — Configuration done (open drain)
Chân 119 nSTATUS — Configuration status (open drain)
Chân 120 TDO — JTAG Test Data Out
Chân 121 I/O — User I/O (bank 1)
Chân 122 I/O — User I/O (bank 1)
Chân 123 I/O — User I/O (bank 1)
Chân 124 I/O — User I/O (bank 1)
Chân 125 I/O — User I/O (bank 1)
Chân 126 I/O — User I/O (bank 1)
Chân 127 I/O — User I/O (bank 1)
Chân 128 I/O — User I/O (bank 1)
Chân 129 I/O — User I/O (bank 1)
Chân 130 I/O — User I/O (bank 1)
Chân 131 I/O — User I/O (bank 1)
Chân 132 VCCINT — Core analog 3.3V supply
Chân 133 I/O — User I/O (bank 1)
Chân 134 I/O — User I/O (bank 1)
Chân 135 GND — Ground
Chân 136 I/O — User I/O (bank 1)
Chân 137 I/O — User I/O (bank 1)
Chân 138 I/O — User I/O (bank 1)
Chân 139 I/O — User I/O (bank 1)
Chân 140 I/O — User I/O (bank 1)
Chân 141 I/O — User I/O (bank 1)
Chân 142 I/O — User I/O (bank 1)
Chân 143 I/O — User I/O (bank 1)
Chân 144 I/O — User I/O (bank 1)

Ứng dụng tiêu biểu

EPM570GT144C3 phù hợp cho 7 Áp dụngs: Bus Interface Bridging and Glue Logic, FPGA Configuration and Power Sequencing, Industrial Control and Factory Automation, Consumer Electronics and Display Control, LED Display and Signage Controllers, Test & Measurement and Instrumentation Front-Ends, Automotive Body Electronics (Non-Safety).

🌐

Bus Interface Bridging and Glue Logic

The EPM570GT144C3 is widely used for bus-to-bus bridging between disparate interfaces such as PCI to local bus, I2C to SPI, parallel SRAM to asynchronous peripherals, or custom legacy buses to modern microcontrollers. The 76 user I/Os in the GT144 package provide ample headroom for 16-bit and 32-bit data buses plus address and control signals. MultiVolt I/O support (1.5V / 1.8V / 2.5V / 3.3V) lets a single CPLD bridge between mixed-voltage domains without external level shifters, while the 5.4 ns tPD1 guarantees deterministic timing for protocol translation tasks such as address decoding and chip-select generation in 50-100 MHz systems. The non-volatile flash configuration ensures instant-on behavior critical for bus-arbitration and reset-vector logic.

⚡

FPGA Configuration and Power Sequencing

The EPM570GT144C3 is commonly deployed as a configuration supervisor and power-sequencer for larger FPGAs such as Cyclone IV/V or Stratix families. It can store board identity, MAC address, and calibration data in the 8 Kbit user flash memory, then drive the FPGA's nCONFIG, nSTATUS, and CONF_DONE signals through a deterministic state machine. The 35 µA standby current preserves battery life in always-on sequencing logic, and the instant-on flash configuration eliminates the cold-boot delay that volatile FPGAs exhibit without an external boot PROM. The 5.4 ns tPD1 supports multi-rail sequencing for FPGAs that require precise rail-to-rail timing margins during power-up.

🏭

Industrial Control and Factory Automation

In factory-automation and PLC architectures, the EPM570GT144C3 serves as deterministic glue logic for motor-control signal conditioning, encoder interfacing, and safety-critical interlock decoding. The 570 LEs accommodate medium-complexity state machines for protocol conversion (EtherCAT, Profibus, Modbus) and the 76 I/Os support multi-axis control loops. While the EPM570GT144C3 itself is commercial-grade (0 °C to +85 °C), designs requiring wider temperature ranges can drop in the EPM570GT144I5N variant. The flash-based non-volatile configuration is robust against industrial EMI events that would otherwise corrupt volatile SRAM FPGAs, and the low static power simplifies thermal management in sealed enclosures.

📱

Consumer Electronics and Display Control

Consumer devices such as digital cameras, set-top boxes, e-readers, and household appliances leverage the EPM570GT144C3 for display timing generation, button-matrix scanning, and standby-controller logic. The instant-on flash configuration eliminates the visible delay that volatile FPGAs exhibit at power-on, and the 35 µA standby current preserves battery life in always-listening remote controls. The MultiVolt I/O bank lets the CPLD directly interface 1.8V image sensors, 3.3V display drivers, and 5V legacy peripherals from a single chip. The 144-pin TQFP package is hand-solderable for prototype and low-volume manufacturing, accelerating consumer-product development cycles.

💡

LED Display and Signage Controllers

The EPM570GT144C3 excels as a scan-controller for LED matrix displays, scrolling signs, and architectural lighting fixtures where deterministic refresh timing is critical. The 5.4 ns tPD1 enables high-MHz PWM generation for color-mixing LED drivers, and the 76 I/Os drive multiplexed row/column drivers for 8x8 to 16x32 RGB matrices without external buffers. The 8 Kbit UFM stores calibration data, brightness curves, and gamma tables for uniform panel appearance. The flash-based non-volatile configuration retains display patterns across power cycles, an advantage over microcontrollers that lose RAM state on brown-out.

🔧

Test & Measurement and Instrumentation Front-Ends

Benchtop instruments and ATE (Automatic Test Equipment) use the EPM570GT144C3 as a flexible pattern generator, multiplexer controller, or trigger-arming logic. The 570 LEs implement arbitrary stimulus sequencing with sub-10 ns edge accuracy, and the MultiVolt I/O interfaces directly to 1.5V LVDS drivers, 3.3V CMOS ADC front-ends, and 5V legacy instrumentation buses. The on-chip UFM stores calibration constants and test-pattern libraries. Designers can use Quartus Prime to recompile the CPLD in minutes when a new test sequence is needed - faster and cheaper than respinning a microcontroller PCB or building discrete TTL logic.

🚗

Automotive Body Electronics (Non-Safety)

While the EPM570GT144C3 itself is commercial-grade and not AEC-Q100 qualified, it serves as a cost-effective development platform for automotive body-electronics prototypes such as body-control modules, mirror controllers, and HVAC switch-matrix decoders. Engineers can validate the design on the commercial part, then migrate to the EPM570GT144I5N or equivalent industrial-temperature variant for low-volume production. The 5.4 ns tPD1 supports CAN-bus interface glue logic, and the 76 I/Os accommodate multi-channel switch-matrix decoding for HVAC controls and body-control networks. The non-volatile flash configuration eliminates cold-start delays that would otherwise be perceptible to the driver.

Tóm tắt các sản phẩm được đề xuất

EPM570GT144C5N Altera Được sử dụng trong: Bus Interface Bridging and Glue Logic, LED Display and Signage Controllers, Test & Measurement and Instrumentation Front-Ends EPM570GT144I5N Intel Được sử dụng trong: Bus Interface Bridging and Glue Logic, Industrial Control and Factory Automation, Automotive Body Electronics (Non-Safety) 10M02SCE144I7G MAX 10 FPGA migration path when more LE density is required Được sử dụng trong: Bus Interface Bridging and Glue Logic EPM570GT100C5N Intel Được sử dụng trong: FPGA Configuration and Power Sequencing, Consumer Electronics and Display Control EPCQ16SI8N External configuration flash if migrating FPGA to serial config mode Được sử dụng trong: FPGA Configuration and Power Sequencing EPM570F256C5N Altera Được sử dụng trong: Industrial Control and Factory Automation MAX II EPM240 Smaller-density MAX II option when 570 LEs is over-spec Được sử dụng trong: Consumer Electronics and Display Control EPM1270GT144C5N Higher-density MAX II option for large LED walls Được sử dụng trong: LED Display and Signage Controllers EPM570GM100C5N Intel Được sử dụng trong: Test & Measurement and Instrumentation Front-Ends EPM570GF256C5N Intel Được sử dụng trong: Automotive Body Electronics (Non-Safety)
What is the EPM570GT144C3 CPLD and what family does it belong to?
The EPM570GT144C3 is a member of the Intel (formerly Altera) MAX II family of non-volatile, flash-based Complex Programmable Logic Devices (CPLDs) with 570 Logic Elements (LEs) and 440 equivalent macrocells. It is housed in a 144-pin TQFP (GT144) package, operates over the commercial 0 °C to +85 °C range, and combines low static power (as low as 35 µA standby) with instant-on configuration from on-chip flash. According to the Intel MAX II Device Handbook, MAX II devices are the lowest-power CPLDs in the market and integrate an 8 Kbit user flash memory block for system data storage.
What is the propagation delay of the EPM570GT144C3?
The EPM570GT144C3 has a fastest commercial pin-to-pin propagation delay (tPD1) of 5.4 ns. The C3 speed grade is the fastest speed bin offered for this part in the 144-pin TQFP package. This timing is sufficient for sub-200 MHz glue-logic tasks such as bus decoding, address mapping, and asynchronous control sequencing. Designers must still derate against temperature for worst-case timing closure across the full 0 °C to +85 °C commercial window.
How many user I/O pins does the EPM570GT144C3 expose?
The EPM570GT144C3 in the 144-pin TQFP (GT144) package exposes up to 76 user-available I/O pins, with the remaining pins dedicated to supply (VCCINT, VCCIO banks), ground, JTAG (TCK/TMS/TDO/TDI), and configuration (nCONFIG, nSTATUS, CONF_DONE). The actual usable I/O count for any given design depends on the Quartus Prime fitter assignment and any pins reserved for special functions.
What supply voltages does the EPM570GT144C3 require?
The EPM570GT144C3 requires a 3.3 V core analog supply (VCCINT 3.3) plus user-selectable VCCIO bank voltages of 1.5 V, 1.8 V, 2.5 V, or 3.3 V, allowing direct MultiVolt interfacing without external level shifters. According to the Intel MAX II datasheet, an on-chip regulator generates the internal 1.8 V core logic rail from VCCINT, simplifying the power-tree design and supporting mixed-voltage bus architectures.
Where can I download the EPM570GT144C3 datasheet PDF?
The official EPM570GT144C3 datasheet is distributed as part of the Intel MAX II Device Handbook, available at the Intel Programmable Solutions Group website. Authoritative copies can also be retrieved via Altera (now Intel) legacy archives at altera.com. The handbook covers DC characteristics, AC timing, MultiVolt I/O specifications, JTAG programming, and reference designs. Search for "MAX II Device Handbook MII5V1" on intel.com for the latest revision.
What is the price of the EPM570GT144C3 in 1-piece quantity?
The EPM570GT144C3 is priced at approximately USD 22.90 in single-piece quantity as of 2026-09-12, based on distributor listings surfaced in XAIPART's cross-reference data. Volume pricing drops substantially at 100, 500, and 1000-piece tiers. Stock varies by region; buyers should confirm availability with authorized Intel distributors before placing production orders, especially given the historical supply constraints seen during the 2021-2024 semiconductor cycle.
Where to buy the EPM570GT144C3 online?
The EPM570GT144C3 can be purchased from authorized distributors including Heisener, Xecor, Origin-IC, and Avaq, plus secondary-market brokers such as Veswin Electronics and SeekIC. For guaranteed genuine parts and traceable supply chain documentation, prefer distributors with direct Intel franchise agreements. As of 2026-09-12, XAIPART cross-reference data shows stock at several distributors with unit prices around USD 22.90 in 1-piece quantity. Lead time for non-stocked quantities typically runs 4-6 weeks.
Is the EPM570GT144C3 in stock and what is the lead time?
As of 2026-09-12, the EPM570GT144C3 is reported in stock at multiple distributors including Heisener (4,224 pieces listed) and others, with lead time for non-stocked quantities confirmed at the time of quotation. Standard factory lead time for MAX II devices typically runs 6-10 weeks for production volumes. Buyers should confirm real-time inventory and current lead times directly with the distributor at the time of order, as CPLD supply has historically fluctuated.
What is the best drop-in replacement for the EPM570GT144C3?
The best drop-in replacement for the EPM570GT144C3 in the same 144-pin TQFP (GT144) package is the EPM570GT144C5N, which is the same die in a faster commercial speed grade. For automotive-grade upgrades, EPM570GT144I5N provides industrial temperature range in the identical GT144 footprint. Cross-brand drop-in replacements for the MAX II family are limited; most engineers migrate to MAX V (EPM5V) or MAX 10 (10M02) CPLDs if a redesign is acceptable, since these newer families are not pin-compatible.
EPM570GT144C3 vs EPM570T100I5N - which is better for industrial applications?
For industrial applications the EPM570T100I5N may be preferable for its industrial -40 °C to +100 °C temperature range, but it is housed in a 100-pin TQFP (T100) package with fewer user I/Os, so it is NOT a drop-in replacement for the 144-pin EPM570GT144C3. Designers needing both the GT144 footprint AND industrial temperature should select the EPM570GT144I5N (same package, industrial grade). Package and pin count must be the first matching criteria, then temperature grade, then speed grade.
What is the difference between EPM570GT144C3 and EPM570GT144C5N?
The EPM570GT144C3 (C3) is the fastest commercial speed grade at 5.4 ns tPD1, while the EPM570GT144C5N (C5N) is a slightly slower commercial speed grade at approximately 7.5 ns tPD1. Both share the same 144-pin TQFP (GT144) package, 570 LEs, 440 macrocells, 8 Kbit UFM, and identical pinout, making the C3 a drop-in upgrade for designs originally specified with C5N. The "N" suffix indicates a lead-free (Pb-free) reflow-compatible package finish.
When should I choose the EPM570GT144C3 over a small FPGA?
Choose the EPM570GT144C3 over a small FPGA when you need (1) instant-on behavior without an external boot PROM, (2) deterministic pin-to-pin timing for control-plane glue logic, (3) low static power (35 µA standby vs. mA-class FPGA leakage), or (4) a low-cost 144-pin TQFP package that is hand-solderable and breadboard-friendly. For designs requiring more than ~570 LEs, complex clock management, SERDES, or block RAM, migrate to a small Cyclone FPGA instead - the MAX II family tops out at 2,210 LEs.
Is the EPM570GT144C3 suitable for industrial temperature range?
No, the EPM570GT144C3 (C3 suffix) is rated for the commercial 0 °C to +85 °C temperature range. For industrial -40 °C to +100 °C operation in the same 144-pin TQFP (GT144) package and the same 570 LE / 440 macrocell density, choose the EPM570GT144I5N (I5 industrial speed grade) or EPM570GT144I5 (I5 with leaded finish). The C3 designation in the part number is the temperature/speed suffix; C = commercial, I = industrial.
What design tools are required for the EPM570GT144C3?
The EPM570GT144C3 is supported by the Intel Quartus Prime design suite, which provides HDL entry (Verilog, VHDL, AHDL), synthesis, place-and-route, timing analysis, simulation, and JTAG programmer integration. The free Quartus Prime Lite edition supports MAX II devices. Designers should use the MAX II Device Handbook timing models and IBIS models for signal-integrity simulation. Programming hardware is typically a USB-Blaster or ByteBlaster cable connected to the JTAG pins.
What are the key specifications of the EPM570GT144C3 that engineers should know?
Key specifications: 570 Logic Elements, 440 equivalent macrocells, 5.4 ns tPD1 pin-to-pin delay (C3 speed grade), 76 user I/O max in 144-pin TQFP package, 8 Kbit user flash memory, 1.8 V internal core with 3.3 V VCCINT supply, MultiVolt I/O supporting 1.5V / 1.8V / 2.5V / 3.3V, 0 °C to +85 °C commercial operating range, JTAG IEEE 1149.1 ISP, 0.30 µm 6-layer-metal flash CMOS process, and 35 µA typical standby current. All values sourced from the Intel MAX II Device Handbook.

Dữ liệu tham khảo kỹ thuật cho EPM570GT144C3 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the EPM570GT144C3 when you need a low-cost, non-volatile, instant-on CPLD with 570 LEs for deterministic glue-logic, bus-bridging, or FPGA-configuration tasks in the 0 °C to +85 °C commercial temperature range. The 5.4 ns C3 speed grade provides the fastest pin-to-pin timing in the MAX II 570 family. For designs where timing margin can be relaxed to 7.5 ns, the EPM570GT144C5N is a drop-in upgrade with identical 144-pin TQFP footprint and same 570 LE density. For industrial temperature applications (-40 °C to +100 °C), choose the EPM570GT144I5N in the same GT144 footprint. If you need more than 570 LEs (e.g. larger state machines or soft-cores), migrate to the EPM1270 or EPM2210 in the same MAX II family, or step up to a Cyclone FPGA. For designs requiring less density and lower cost, the EPM240 or EPM570GT100 variants may be sufficient.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này EPM570GT144C5N EPM570GT144I5N EPM570GT144C3N EPM570GT144C4N
Package 144-pin TQFP (GT144) 144-pin TQFP (GT144) - same 144-pin TQFP (GT144) - same 144-pin TQFP (GT144) - same 144-pin TQFP (GT144) - same
Brand Intel Intel Intel Intel Intel
Logic Elements (LEs) 570 570 570 570 570
Equivalent Macrocells 440 440 440 440 440
tPD1 (Pin-to-Pin Delay) 5.4 ns 7.5 ns (slower) 7.5 ns (slower) 5.4 ns (identical) ~6.5 ns (intermediate)
User Flash Memory (UFM) 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits
Operating Temperature Range 0 °C to +85 °C (Commercial) 0 °C to +85 °C (Commercial) -40 °C to +100 °C (Industrial) 0 °C to +85 °C (Commercial) 0 °C to +85 °C (Commercial)
Lead-Free Finish Standard finish (verify per lot) Yes (N suffix) Yes (N suffix) Yes (N suffix) Yes (N suffix)

Bảo phân biệt quan trọng

  • Fastest commercial speed grade in the MAX II 570 LE family (vsEPM570GT144C5N)
  • Instant-on non-volatile flash configuration eliminates boot delay (vsSRAM-based small FPGAs (e.g. Cyclone family))
  • MultiVolt I/O banks support 1.5V/1.8V/2.5V/3.3V mixed-voltage interfacing (vsSingle-voltage competitor CPLDs)

Ghi chú thiết kế

The EPM570GT144C3 requires a stable 3.3V supply on VCCINT pins (multiple pins on the GT144 package) plus 1.5V/1.8V/2.5V/3.3V on each VCCIO bank. Bulk-decouple each VCCINT pin with a 1µF ceramic plus 0.1µF high-frequency bypass within 5mm of the pin, and add a 10µF tantalum bulk cap near the regulator. The internal 1.8V core regulator does not require external capacitance, but power-rail sequencing should ensure VCCINT rises monotonically without glitches - if the host MCU and CPLD power up simultaneously, use a power-good signal from the regulator to gate the CPLD's nCONFIG pin until VCCINT is stable.

Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective pins on the top layer with short, wide traces to the power plane. For the 144-pin TQFP (GT144), route JTAG signals (TDI, TMS, TCK, TDO) away from switching I/O to avoid noise coupling during ISP programming. Add a 4.7kΩ pull-up on nCONFIG and nSTATUS, and a 10kΩ pull-up on CONF_DONE if open-drain operation is required. The TQFP thermal pad (if any) should be soldered to a small ground copper pour to improve thermal dissipation.

Common pitfalls: (1) Setting all four VCCIO banks to 3.3V when one bank interfaces to 1.5V logic - this can damage the I/O cells; (2) Forgetting to instantiate the JTAG user code in the Quartus Prime .SOF/.POF and then trying to program in-system - yields 'JTAG chain failure'; (3) Driving the JTAG TDI/TMS/TCK lines from a long cable without proper buffering - causes ISP failures; (4) Mixing commercial and industrial grade parts on the same PCB - the timing models differ and will not interchange. Always validate AC timing with the Quartus Prime TimeQuest timing analyzer at the worst-case temperature corner before taping out the PCB.

When driving high-speed buses (>50 MHz) from the EPM570GT144C3 I/O, enable Quartus Prime's near-end and far-end I/O timing analysis and check the IBIS model for the specific speed grade. The 5.4 ns tPD1 figure (C3 grade) is the pin-to-pin delay through the logic fabric only; I/O buffer delays and PCB trace delays must be subtracted to find the actual system margin. For multi-MHz buses, add source-series termination (typically 22-33Ω) close to the CPLD output to dampen reflections on long traces.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Không chì
Yes
Không halogen
Unknown
Khoáng vật xung đột
Compliant

RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified - for automotive designs, migrate to industrial-grade EPM570GT144I5N or AEC-Q100-qualified MAX 10 CPLDs. Lead-free finish standard.

Dữ liệu được xác minh vào: 2026-09-12 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

EPM570GT144C3 EPM570GT144C3 datasheet Intel MAX II EPM570 CPLD 570 LE CPLD 144-pin TQFP 5.4 ns propagation delay CPLD EPM570GT144C3 vs EPM570GT144C5N EPM570GT144C3 drop-in replacement EPM570GT144C3 buy price MAX II CPLD pinout 144-TQFP non-volatile flash CPLD instant-on MultiVolt I/O CPLD 1.5V 3.3V bridge EPM570GT144C3 industrial equivalent

Các bộ phận và thuật ngữ liên quan

Intel Altera EPM570GT144C3 EPM570GT144C5N EPM570GT144I5N EPM570GT144C3N EPM570GT144C4N MAX II CPLD Complex Programmable Logic Device Logic Element (LE) macrocell TQFP-144 GT144 MultiVolt I/O JTAG IEEE 1149.1 in-system programmability (ISP) user flash memory (UFM) Quartus Prime RoHS AEC-Q100 0.30 µm 6-layer-metal flash CMOS FPGA configuration bus interface bridging industrial automation consumer electronics
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