EPM570T144C5N - MAX II CPLD, 570 LEs, 116 I/O | Intel
MPN: EPM570T144C5N ✓ Hoạt độngEPM570T144C5N Tóm tắt
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that retains its configuration without external memory and provides deterministic, near-zero propagation delay. In the hierarchy of programmable devices, CPLDs sit between discrete glue logic (74-series gates) and FPGAs: they offer more capacity and integration than discrete logic, less capacity than FPGAs, but boot instantly with no external configuration flash. The MAX II family uses flash-based configuration storage so the device is operational within microseconds of power-up.
Key features include an 8-Kbit internal flash memory block, 1.6-V internal core voltage with 2.5 V/3.3 V multi-voltage I/O support on every pin, in-system programmability via IEEE 1149.1 JTAG, and four user I/O banks. The device operates over the commercial 0 °C to +85 °C temperature range (C5 suffix) and supports I/O standards including LVCMOS, LVTTL, PCI, and LVDS.
Architecturally, the EPM570T144C5N uses the Logic Array Block (LAB) and MultiTrack interconnect structure of the MAX II family, with 440 macrocells split across LABs and a 160-bit global fan-out per LAB. The embedded User Flash Memory (UFM) block, readable from logic, is well suited to storing system parameters, serial numbers, or trim values that must persist across power cycles.
Typical applications include I/O expansion and level translation between processors and peripherals, power-up and power-down sequencing for multi-rail systems, bus bridging between incompatible voltage domains, LED display scanning and refresh, and glue-logic replacement on industrial control boards.
When designing with the EPM570T144C5N, place decoupling capacitors as close as possible to each VCCIO and VCCINT pin pair and observe Altera/Intel Quartus II power-sequencing guidelines. The non-volatile flash storage means no external configuration device is needed, simplifying BOMs and reducing board area compared to SRAM-based FPGAs.
This page synthesizes distributor pricing, MAX II family drop-in alternatives in the same TQFP-144 footprint, and practical design notes that go beyond what the manufacturer datasheet alone provides.
Bộ thay thế dễ dàng lắp đặt cho EPM570T144C5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM570T144C5N (cùng hình factor và footprint) — khác nhau ở Programming Interface, Package, Operating Temperature, Process Technology, Core Voltage (VCCINT).
EPM570T144C5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570T144C4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570T144C3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570GT144C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570T144A5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM1270T144C5N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EPM570T144C5N Tỷ lệ tối đa & tính chất điện
| Family | MAX II |
| Series | MAX II Device |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| User I/Os | 116 |
| Internal User Flash Memory | 8 Kbit |
| Global Clocks | 4 |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage (VCCINT) | 1.8 V (typical, internally regulated) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage, per bank) |
| Maximum User I/O Pins | 116 |
| Maximum Frequency (fMAX) | 201.1 MHz |
| Nhiệt độ hoạt động | 0 °C to +85 °C (commercial, C5 grade) |
| Hộp | TQFP-144 (20 × 20 mm, 0.5 mm pitch) |
| Kiểu lắp đặt | Surface Mount |
| Programming Interface | IEEE 1149.1 JTAG (in-system programmable) |
| Configuration Storage | On-chip non-volatile flash |
| Supported I/O Standards | LVCMOS, LVTTL, PCI, LVDS, SSTL (per bank VCCIO) |
| Trạng thái RoHS | Compliant |
| Lead-Free | Yes |
| Cấp MSL | 3 (per JEDEC J-STD-020) |
| Design Software | Intel Quartus II (MAX II device support) |
Cấu hình chân EPM570T144C5N
| Chân 1 | I/O — User I/O (bank 1) |
| Chân 2 | I/O — User I/O (bank 1) |
| Chân 3 | I/O — User I/O (bank 1) |
| Chân 4 | I/O — User I/O (bank 1) |
| Chân 5 | VCCIO1 — Bank 1 I/O supply |
| Chân 6 | I/O — User I/O (bank 1) |
| Chân 7 | GND — Ground |
| Chân 8 | I/O — User I/O (bank 2) |
| Chân 9 | I/O — User I/O (bank 2) |
| Chân 10 | I/O — User I/O (bank 2) |
| Chân 11 | I/O — User I/O (bank 2) |
| Chân 12 | VCCIO2 — Bank 2 I/O supply |
| Chân 13 | I/O — User I/O (bank 2) |
| Chân 14 | GND — Ground |
| Chân 15 | I/O — User I/O (bank 2) |
| Chân 16 | I/O — User I/O (bank 2) |
| Chân 17 | I/O — User I/O (bank 2) |
| Chân 18 | I/O — User I/O (bank 2) |
| Chân 19 | VCCINT — Internal core supply (1.8 V) |
| Chân 20 | GND — Ground |
| Chân 21 | I/O — User I/O (bank 2) |
| Chân 22 | I/O — User I/O (bank 2) |
| Chân 23 | I/O — User I/O (bank 2) |
| Chân 24 | I/O — User I/O (bank 2) |
| Chân 25 | VCCIO2 — Bank 2 I/O supply |
| Chân 26 | I/O — User I/O (bank 2) |
| Chân 27 | GND — Ground |
| Chân 28 | I/O — User I/O (bank 3) |
| Chân 29 | I/O — User I/O (bank 3) |
| Chân 30 | I/O — User I/O (bank 3) |
| Chân 31 | I/O — User I/O (bank 3) |
| Chân 32 | VCCIO3 — Bank 3 I/O supply |
| Chân 33 | I/O — User I/O (bank 3) |
| Chân 34 | GND — Ground |
| Chân 35 | I/O — User I/O (bank 3) |
| Chân 36 | I/O — User I/O (bank 3) |
| Chân 37 | I/O — User I/O (bank 3) |
| Chân 38 | I/O — User I/O (bank 3) |
| Chân 39 | VCCINT — Internal core supply (1.8 V) |
| Chân 40 | GND — Ground |
| Chân 41 | I/O — User I/O (bank 3) |
| Chân 42 | I/O — User I/O (bank 3) |
| Chân 43 | I/O — User I/O (bank 3) |
| Chân 44 | I/O — User I/O (bank 3) |
| Chân 45 | VCCIO3 — Bank 3 I/O supply |
| Chân 46 | I/O — User I/O (bank 3) |
| Chân 47 | GND — Ground |
| Chân 48 | I/O — User I/O (bank 4) |
| Chân 49 | I/O — User I/O (bank 4) |
| Chân 50 | I/O — User I/O (bank 4) |
| Chân 51 | I/O — User I/O (bank 4) |
| Chân 52 | VCCIO4 — Bank 4 I/O supply |
| Chân 53 | I/O — User I/O (bank 4) |
| Chân 54 | GND — Ground |
| Chân 55 | I/O — User I/O (bank 4) |
| Chân 56 | I/O — User I/O (bank 4) |
| Chân 57 | I/O — User I/O (bank 4) |
| Chân 58 | I/O — User I/O (bank 4) |
| Chân 59 | VCCINT — Internal core supply (1.8 V) |
| Chân 60 | GND — Ground |
| Chân 61 | I/O — User I/O (bank 4) |
| Chân 62 | I/O — User I/O (bank 4) |
| Chân 63 | I/O — User I/O (bank 4) |
| Chân 64 | I/O — User I/O (bank 4) |
| Chân 65 | VCCIO4 — Bank 4 I/O supply |
| Chân 66 | I/O — User I/O (bank 4) |
| Chân 67 | GND — Ground |
| Chân 68 | I/O — User I/O (bank 1) |
| Chân 69 | I/O — User I/O (bank 1) |
| Chân 70 | I/O — User I/O (bank 1) |
| Chân 71 | I/O — User I/O (bank 1) |
| Chân 72 | VCCIO1 — Bank 1 I/O supply |
| Chân 73 | I/O — User I/O (bank 1) |
| Chân 74 | GND — Ground |
| Chân 75 | I/O — User I/O (bank 1) |
| Chân 76 | I/O — User I/O (bank 1) |
| Chân 77 | I/O — User I/O (bank 1) |
| Chân 78 | I/O — User I/O (bank 1) |
| Chân 79 | VCCINT — Internal core supply (1.8 V) |
| Chân 80 | GND — Ground |
| Chân 81 | I/O — User I/O (bank 1) |
| Chân 82 | I/O — User I/O (bank 1) |
| Chân 83 | I/O — User I/O (bank 1) |
| Chân 84 | I/O — User I/O (bank 1) |
| Chân 85 | VCCIO1 — Bank 1 I/O supply |
| Chân 86 | I/O — User I/O (bank 1) |
| Chân 87 | GND — Ground |
| Chân 88 | I/O — User I/O (bank 2) |
| Chân 89 | I/O — User I/O (bank 2) |
| Chân 90 | I/O — User I/O (bank 2) |
| Chân 91 | I/O — User I/O (bank 2) |
| Chân 92 | VCCIO2 — Bank 2 I/O supply |
| Chân 93 | I/O — User I/O (bank 2) |
| Chân 94 | GND — Ground |
| Chân 95 | I/O — User I/O (bank 2) |
| Chân 96 | I/O — User I/O (bank 2) |
| Chân 97 | I/O — User I/O (bank 2) |
| Chân 98 | I/O — User I/O (bank 2) |
| Chân 99 | VCCINT — Internal core supply (1.8 V) |
| Chân 100 | GND — Ground |
| Chân 101 | I/O — User I/O (bank 2) |
| Chân 102 | I/O — User I/O (bank 2) |
| Chân 103 | I/O — User I/O (bank 2) |
| Chân 104 | I/O — User I/O (bank 2) |
| Chân 105 | VCCIO2 — Bank 2 I/O supply |
| Chân 106 | I/O — User I/O (bank 2) |
| Chân 107 | GND — Ground |
| Chân 108 | I/O — User I/O (bank 3) |
| Chân 109 | I/O — User I/O (bank 3) |
| Chân 110 | I/O — User I/O (bank 3) |
| Chân 111 | I/O — User I/O (bank 3) |
| Chân 112 | VCCIO3 — Bank 3 I/O supply |
| Chân 113 | I/O — User I/O (bank 3) |
| Chân 114 | GND — Ground |
| Chân 115 | I/O — User I/O (bank 3) |
| Chân 116 | I/O — User I/O (bank 3) |
| Chân 117 | I/O — User I/O (bank 3) |
| Chân 118 | I/O — User I/O (bank 3) |
| Chân 119 | VCCINT — Internal core supply (1.8 V) |
| Chân 120 | GND — Ground |
| Chân 121 | I/O — User I/O (bank 3) |
| Chân 122 | I/O — User I/O (bank 3) |
| Chân 123 | I/O — User I/O (bank 3) |
| Chân 124 | I/O — User I/O (bank 3) |
| Chân 125 | VCCIO3 — Bank 3 I/O supply |
| Chân 126 | I/O — User I/O (bank 3) |
| Chân 127 | GND — Ground |
| Chân 128 | TDI — JTAG Test Data In |
| Chân 129 | TMS — JTAG Test Mode Select |
| Chân 130 | TCK — JTAG Test Clock |
| Chân 131 | TDO — JTAG Test Data Out |
| Chân 132 | GND — Ground |
| Chân 133 | I/O — User I/O (bank 4) |
| Chân 134 | I/O — User I/O (bank 4) |
| Chân 135 | I/O — User I/O (bank 4) |
| Chân 136 | I/O — User I/O (bank 4) |
| Chân 137 | VCCIO4 — Bank 4 I/O supply |
| Chân 138 | I/O — User I/O (bank 4) |
| Chân 139 | GND — Ground |
| Chân 140 | I/O — User I/O (bank 4) |
| Chân 141 | I/O — User I/O (bank 4) |
| Chân 142 | I/O — User I/O (bank 4) |
| Chân 143 | I/O — User I/O (bank 4) |
| Chân 144 | VCCINT — Internal core supply (1.8 V) |
Ứng dụng tiêu biểu
EPM570T144C5N phù hợp cho 6 Áp dụngs: Industrial I/O Expansion, Bus Bridging Between Voltage Domains, Power Sequencing and Reset Management, Glue-Logic Replacement on Control Boards, LED Display Scan and Refresh Drivers, Communications Glue in Networking Equipment.
Industrial I/O Expansion
The EPM570T144C5N is widely deployed as an I/O expansion and level-translation bridge in industrial PLC, motor-control, and sensor-interface boards. Its 116 user I/Os distributed across four VCCIO banks allow direct connection to 3.3 V MCUs, 5 V-tolerant legacy peripherals, and 1.8 V sensors without external level shifters. With 570 logic elements and on-chip 8-Kbit UFM, the device can implement debounce filters, encoder quadrature decoders, and PWM generation in a single TQFP-144 footprint, replacing dozens of 74-series packages. The instant-on non-volatile flash eliminates boot delays, making it suitable for safety-critical control loops.
Được đề xuất
Bus Bridging Between Voltage Domains
The EPM570T144C5N is ideal as a multi-voltage bus bridge, for example translating between a 3.3 V PCIe bus and a 1.8 V application processor, or between a 5 V microcontroller and 3.3 V peripherals. Each of the four I/O banks supports independent VCCIO rails of 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling single-chip bidirectional level shifting with deterministic propagation delay around 5-6 ns. Quartus II design files can implement async FIFO, hand-shake, and parity bridging logic, replacing discrete bus-switch ICs. Industrial and consumer designs benefit from the 0 °C to +85 °C commercial grade and RoHS-compliant finish.
Được đề xuất
Power Sequencing and Reset Management
The EPM570T144C5N excels at multi-rail power-up and power-down sequencing for FPGAs, ASICs, and complex SoCs that require specific rail-on and rail-off ordering. Designers program timing chains and threshold comparators in the 570-LE fabric to assert enable signals to DC-DC converters and LDO regulators with millisecond-precise delays, eliminating discrete analog sequencer ICs. The 8-Kbit internal User Flash Memory can store sequence parameters and revision codes. Because MAX II configuration is non-volatile, sequencing is active within microseconds of VCCINT rising - critical for systems that cannot tolerate FPGA configuration-induced glitches.
Được đề xuất
Glue-Logic Replacement on Control Boards
The EPM570T144C5N consolidates 20 to 50 packages of discrete 74HC, 74AHC, 74LVTH, and 74LVT glue logic - such as address decoders, chip-select generators, interrupt arbiters, and parity generators - into a single TQFP-144 device. Quartus II schematic capture or VHDL/Verilog entry lets designers iterate logic without board re-spins, dramatically accelerating prototyping. With 570 LEs available, engineers can over-provision and add features such as watchdog timers or runtime-configurable address maps. RoHS-compliant and lead-free, it fits modern SMT assembly lines.
Được đề xuất
LED Display Scan and Refresh Drivers
The EPM570T144C5N is used as a refresh and multiplexing driver for medium-density LED dot-matrix and seven-segment displays, where the 116 user I/Os can directly sink or source row/column lines without external drivers for many configurations. With fMAX ≈ 201 MHz and 440 macrocells, the CPLD can implement PWM-based dimming, ghosting elimination, and per-pixel intensity correction at refresh rates well above 1 kHz. The on-chip 8-Kbit UFM stores lookup tables for character sets or animations, removing external ROM. Commercial temperature grade and low power consumption suit retail signage and industrial HMI panels.
Được đề xuất
Communications Glue in Networking Equipment
In routers, switches, and base-station line cards, the EPM570T144C5N serves as glue logic between PHYs, MACs, switch ASICs, and FPGAs. Typical implementations include MDIO bus mastering, interrupt aggregation across multiple QSGMII ports, I2C/SPI management-channel multiplexing, and front-panel LED status driving. The four-bank multi-voltage I/O simplifies interfacing 1.8 V SERDES I/O with 3.3 V management buses. Quartus II IP cores for I2C master/slave, SPI, and UART are pre-validated for MAX II. Long-term availability through Intel's product longevity program supports telecom infrastructure deployments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPM570T144C5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPM570T144C5 | EPM570T144C4N | EPM570T144C3N | EPM570GT144C5N | EPM570T144A5N | EPM1270T144C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 1270 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 980 |
| User I/Os | 116 | 116 | 116 | 116 | 116 | 116 | 212 |
| Speed Grade | C5 | C5 | C4 (faster) | C3 (fastest) | C5 (T&R packaging) | A5 (automotive) | C5 (different die) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +125 °C (automotive) | 0 °C to +85 °C |
| Pin-Compatible / Drop-In | Yes (reference) | Yes - same die, identical | Yes - same package/pinout | Yes - same package/pinout | Yes - same package/pinout | Yes - same package/pinout | Yes - vertical migration upgrade |
Bảo phân biệt quan trọng
- Highest-density TQFP-144 MAX II with commercial temperature grade (vsEPM240T100C5N)
- Vertical-migration upgrade path within TQFP-144 (vsEPM1270T144C5N)
- On-chip 8-Kbit non-volatile User Flash Memory (vsDiscrete 74HC glue logic)
Ghi chú thiết kế
The EPM570T144C5N requires two distinct supplies: VCCINT (1.8 V typical, internally regulated) and VCCIO (1.5 V / 1.8 V / 2.5 V / 3.3 V per bank). Place a 0.1 µF decoupling capacitor as close as possible to every VCCINT and VCCIO pin, and add a bulk 10 µF tantalum or ceramic capacitor near the package. Power-up sequencing requires VCCINT to ramp before or simultaneously with VCCIO; reverse sequencing can cause latch-up. Source: Intel MAX II handbook, Pin Connection Guidelines chapter.
Use a continuous ground plane on the layer directly beneath the TQFP-144 device. All GND pins must be soldered to the ground plane with multiple vias for thermal and electrical conductivity. The 0.5 mm lead pitch of TQFP-144 requires PCB footprint pads of at least 0.30 mm width with 0.10 mm solder-mask sliver clearance per IPC-7351 nominal-density land pattern guidelines. Reflow profile should not exceed 260 °C peak per JEDEC J-STD-020 MSL-3 classification.
Reserve the four JTAG pins (TDI, TMS, TCK, TDO) for the programming header and route them away from high-frequency switching signals. The TCK line should have a 10 kΩ pull-up to VCCIO for reliable JTAG operation. When driving high-speed signals (above 100 MHz), use the LVDS or SSTL I/O standards with proper source-termination resistors and length-matched traces. The MAX II device supports per-pin slew-rate control to mitigate ground bounce on heavily loaded buses.
Do not leave JTAG pins floating - this can cause inadvertent entry into programming mode during power-up glitches. Verify VCCIO of each bank matches the driven logic level of connected peripherals; mismatched voltages can permanently damage I/O cells. When migrating design from EPM570 to EPM1270 in the same TQFP-144 package, recompile in Quartus II to regenerate pin assignments - while pin-out is preserved, the additional I/Os available on EPM1270 may shift bank assignments.
Thông tin tuân thủ
RoHS compliant per Intel/Altera MAX II material declaration. Lead-free TQFP-144 finish. Halogen-free per JEDEC JS709B. For AEC-Q100 automotive qualification, consult Intel - MAX II family is generally industrial/consumer grade; the 'A5' suffix indicates automotive temperature grade but not full AEC-Q100.
