TPS65951A1ZWSR - OMAP PMIC + Audio Codec 169-NFBGA | Texas Instruments
MPN: TPS65951A1ZWSR ✓ Hoạt độngTPS65951A1ZWSR Tóm tắt
A power management IC (PMIC) is a specialized class of power management integrated circuits that combines multiple voltage regulators, sequencing logic, and supervisory functions on a single die, reducing board area and BOM count in battery-powered systems. Within this hierarchy, the TPS65951 sits at the system-power level, sitting above individual DC-DC converters and LDO regulators and integrating the entire handheld power tree.
According to the TI data manual, the TPS65951 contains several buck converters and low-dropout regulators to generate the multiple rails required by application processors, plus USB transceiver and charger interface functionality typical of the TPS659xx handset family. A distinctive feature is its complete audio subsystem: an entire audio module with audio codecs, digital filters, input preamplifiers and amplifiers, and class-D output amplifiers, allowing a single chip to manage both power and audio signal chains.
Typical applications include OMAP-based smartphone and tablet power management, handheld/mobile device power sequencing, and communication control in cellular handsets. The industrial temperature grade (per distributor data) supports embedded and portable instrumentation designs beyond handsets.
When designing with the TPS65951A1ZWSR, follow the TI reference schematics for OMAP power sequencing, as rail ordering is controlled by the device's internal state machine. Verify software I2C configuration against the TI application code, and confirm battery charger parameters match the chosen Li-ion cell chemistry. Pricing and availability should be verified as of 2026-08-29.
Bộ thay thế dễ dàng lắp đặt cho TPS65951A1ZWSR — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với TPS65951A1ZWSR (cùng hình factor và footprint) — khác nhau ở Audio Subsystem, Function, Package, Operating Temperature, Target Processor.
TPS65950A1ZWSR
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
TPS65951A1ZGUR
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Xem tài liệu →TPS65951A1ZWSR Tỷ lệ tối đa & tính chất điện
| Chức năng | Integrated Power Management / Audio Codec PMIC |
| Target Processor | TI OMAP application processors |
| Battery Chemistry | Li-ion / Li-ion polymer / cobalt-nickel-manganese |
| Audio Subsystem | Audio codecs, digital filters, preamplifiers, class-D output amplifiers |
| Hộp | 169-NFBGA (LFBGA), 12x12 mm square |
| Kiểu lắp đặt | Surface Mount |
| Number of Terminals | 169 |
| Temperature Grade | Industrial |
| Trạng thái vòng đời | Active per TI product page |
Hướng dẫn cấu hình chân TPS65951A1ZWSR 169-nfbga (lfbga), 12x12 mm square
Cấu hình chân cho TPS65951A1ZWSR (169-nfbga (lfbga), 12x12 mm square gói). Động cơ điện này có chân cổng, nguồn và đầu ra. Đối với các gói không phân極, tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết hướng dẫn chính xác của chân 1 và chi tiết về vân footprint. Các ứng dụng phổ biến bao gồm thiết kế nguồn cung cấp điện, điều khiển động cơ và chuyển đổi tải.
Không có dữ liệu chân cụ thể sẵn có cho TPS65951A1ZWSR.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
TPS65951A1ZWSR phù hợp cho 6 Áp dụngs: OMAP Smartphone Power Management, Mobile Audio Signal Chain, Li-ion Battery Charging Management, Embedded ARM/Linux Board Power, Portable Medical and Instrumentation Devices, Communication Control and Modem Power.
OMAP Smartphone Power Management
The TPS65951A1ZWSR is purpose-built for handset power trees around TI OMAP application processors. Its internal state machine sequences the multiple buck converter and LDO rails in the order OMAP devices require, while its charger interface manages a Li-ion or Li-ion polymer cell. Integration of power and audio into one 169-ball 12x12 mm package reduces board area versus a discrete regulator-plus-codec solution. Use the TI reference design for the specific OMAP variant, as rail ordering and default voltages are set by the PMIC firmware and I2C host configuration.
Được đề xuất
Mobile Audio Signal Chain
The integrated audio module of the TPS65951 combines audio codecs, digital filters, input preamplifiers, and class-D output amplifiers, so handset speaker and headset paths are powered and processed by the same chip that manages the power tree. The class-D outputs drive speakers directly without external amplifier stages, reducing component count and quiescent power. Place the device close to the speaker connectors and follow TI layout guidance for class-D filtering to keep EMI within handset regulatory limits.
Được đề xuất
Li-ion Battery Charging Management
Designed for handsets powered by Li-ion, Li-ion polymer, or cobalt-nickel-manganese cells, the TPS65951 manages charge control and battery supervision as part of its power-management function. The charger interface works with the host processor over the control bus to set charge parameters for the chosen cell chemistry. For designs requiring higher charge currents or USB-PD input, pair the PMIC with a dedicated charger IC and use the TPS65951 for rail generation and audio only.
Được đề xuất
Embedded ARM/Linux Board Power
Although optimized for OMAP handsets, the TPS65951A1ZWSR fits embedded ARM boards needing a multi-rail, processor-managed power solution with an industrial temperature grade (per distributor data). Its several buck converters and LDOs supply core, I/O, and memory rails while the host configures voltages over the control interface. The 169-ball BGA requires careful PCB stack-up; plan via-in-pad fanout and follow TI's 12x12 mm BGA land-pattern recommendation for reliable assembly.
Được đề xuất
Portable Medical and Instrumentation Devices
Battery-powered portable instruments benefit from the TPS65951's single-chip integration of power sequencing, battery management, and audio capture/playback. The industrial temperature grade supports operation in clinical environments, and the codec plus class-D amplifiers implement alarms and voice prompts without extra analog circuitry. Because the device is application-optimized for OMAP processors, verify that its default rail voltages and charger profile match the instrument battery and MCU requirements during design review.
Được đề xuất
Communication Control and Modem Power
The TPS65951 can connect to a modem in addition to or instead of the application processor, managing communication-control power sequencing in cellular designs. Its rail architecture supplies RF and baseband loads typical of handsets, and its audio path supports voice codec functionality. Ensure the I2C host firmware programs modem-specific rail voltages and sequencing, and confirm RF load-transient behavior with the buck converter ratings given in the TI data manual before layout freeze.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho TPS65951A1ZWSR — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | TPS65950A1ZWSR | TPS65951A1ZGUR | TPS659039-Q1 |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Target Processor | TI OMAP processors | TI OMAP processors | TI OMAP processors (same silicon) | TI newer-generation processors |
| Integrated Audio Codec | Yes (with class-D outputs) | Yes (audio block differs) | Yes (identical silicon) | No (power only) |
| Lifecycle Status | Active | Active (verify) | Active (verify) | Active |
Bảo phân biệt quan trọng
- Integrated audio module with class-D output amplifiers (vsTPS65950A1ZWSR)
- Single-chip power plus audio for OMAP handsets (vsTPS659039-Q1)
- Co-Ni-Mn battery chemistry support (vsTPS65950A1ZWSR)
Ghi chú thiết kế
The TPS65951 is an application-specific PMIC: its power-up ordering state machine is optimized for TI OMAP processors. Do not assume generic PMIC behavior - configure rail voltages and sequencing through the host control interface per the TI data manual and reference software. Migrating from TPS65950 to TPS65951 requires audio-routing review because the audio block differs (class-D outputs added).
The 169-ball 12x12 mm NFBGA package needs a careful fanout plan. Use via-in-pad or dog-bone fanout on the outer ball rows, and reserve internal layers for the buck converter power paths. Follow the TI land-pattern recommendation exactly; the ZWSR and ZGUR ordering variants may use different ball maps, so confirm the mechanical drawing matches your PCB before assembly.
Combined power-conversion plus class-D audio operation concentrates heat in the 12x12 mm BGA. Estimate dissipation from converter efficiency and audio output power per the TI data manual, and provide solid ground planes to spread heat. For sustained speaker output, validate junction temperature at worst-case ambient using the package thermal parameters in the TI data manual.
Thông tin tuân thủ
[DATA_NEEDED: RoHS/REACH/lead-free status from TI product page or DigiKey listing]
