Xilinx

XC3090L-8TQG176I - 9000 Gates FPGA, 80 MHz, 176-pin LQFP | Xilinx

MPN: XC3090L-8TQG176I ✗ Cuối đời

176-pin TQG (LQFP, 0.5 mm pitch, gull wing) Package -8 Speed On-chip SRAM-based, in-system programmable Memory

Yêu cầu báo giá

MOQ: 1 |

Xem tài liệu kỹ thuật (PDF) Xem các bộ thay thế

Số lượng

XC3090L-8TQG176I Tóm tắt

The Xilinx XC3090L-8TQG176I is a CMOS Field Programmable Gate Array from the legacy XC3000L low-voltage family, offering approximately 5000 usable gates (up to 9000 equivalent system gates) implemented across 320 Configurable Logic Blocks (CLBs) in a 176-pin TQG/LQFP package. It supports a maximum clock frequency of 80 MHz with a CLB combinatorial delay of 6.7 ns at the -8 speed grade, targeting high-density glue-logic, prototyping, and industrial control applications where ASIC-class integration is not yet justified.

What is an FPGA? A Field-Programmable Gate Array is a reconfigurable digital integrated circuit whose logic fabric and interconnect can be programmed by the end user after manufacture. Within the taxonomy of digital ICs, an FPGA sits between an Application-Specific Integrated Circuit (ASIC) and a microcontroller: an ASIC is hard-wired for one function but offers the lowest unit cost at high volume, while an FPGA trades per-unit cost for design flexibility, parallel hardware execution, and rapid time-to-market. The XC3000 family pioneered SRAM-based configuration and the now-universal island-style CLB + IOB + programmable interconnect architecture that defines the modern FPGA.

Key features of the XC3090L-8TQG176I include on-chip SRAM-based configuration store, three types of configurable elements (perimeter I/O Blocks, core CLB array, and routing channels), industrial-grade -40C to +85C operating range (I suffix), and the low-voltage L-suffix core that reduces 5V-family power. The device is housed in a 176-terminal LQFP/TQFP package on a 0.5 mm pitch with gull-wing leads suitable for surface-mount assembly and rework.

Technically, the XC3000L family uses a 5V-tolerant I/O structure with 3.3V or 5V core options, hierarchical interconnect including long lines, hex lines, and direct connects, and configurable IOBs that support registered, latched, or combinatorial I/O with tri-state control. The architecture integrates a configuration program store so the array can be re-programmed in-system via the standard Xilinx configuration interface.

Typical applications span industrial control systems, telecommunications glue logic, prototyping platforms for ASIC emulation, test and measurement fixtures, military/aerospace subsystems, and educational development kits where students learn HDL synthesis on a mature, well-documented device family. The TQG176 package is the highest-density option for this die.

When designing with the XC3090L-8TQG176I, note that this device family is mature (introduced in the early-to-mid 1990s), so verify long-term availability and second-source supply before committing new production designs. New designs should weigh migration to the Xilinx CoolRunner-II CPLD or Spartan-6/Spartan-7 FPGA families for active lifecycle status and modern toolchain support.

This page synthesizes distributor pricing, XAIPART in-stock tiers, pin-compatible Xilinx drop-in alternatives drawn from the XC3000L family, and practical design notes on configuration, I/O banking, and legacy toolchain compatibility not found in the original datasheet.

Bộ thay thế dễ dàng lắp đặt cho XC3090L-8TQG176I — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với XC3090L-8TQG176I (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Family, Speed Grade, Configuration Memory.

XC3090L-6TQG176I

Xilinx

Package: TQG176 (176-pin Thin Quad Flat Pack)

Process Technology: CMOS, 5 V tolerant I/O on selected variants

Speed Grade: -6 (approximately 6 ns combinatorial delay)