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XC3090L-8TQG176C - 320 CLB FPGA, 6K Gates, 80MHz, TQFP-176 | Xilinx

MPN: XC3090L-8TQG176C ✗ End of Life
In Stock Ships in 1-3 business days
3.3 V Vdss TQFP-176 (TQG176) Package 80 MHz Speed Internal SRAM (reprogrammable) Memory
From $28.75 USD / Unit
MOQ: 1 |
Price updated: 2026-09-13
Volume Pricing
Qty Unit Price Extended
1 $45 $45.00
10 $41 $410.00
100 $36.5 $3,650.00
500 $32 $16,000.00
1,000 $28.75 $28,750.00
ℹ️ All prices are in USD

Drop-in alternatives for XC3090L-8TQG176C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC3090L-7TQG176C

✅ Drop-In
Xilinx
📦 TQFP-176
XC3000L · XC3090L · 100 CLBs (320 F-FFs) · 5,000 (typical, up to 9,000 peak) · 144 (maximum, TQG176) · SRAM (volatile, requires external PROM) · 0.8 micron CMOS · 3.0 V to 3.6 V

✓ In Stock

$21.2 / Unit

View Datasheet →

XC3090L-6TQG176C

✅ Drop-In
Xilinx
📦 TQFP-176
XC3000L Low-Voltage Logic Cell Array · XC3000L · XC3090L · -6 (6 ns tpd) · 138 · TQG176 (Thin Quad Gull-Wing, 176 pins) · 3.3 V · 6 ns

✓ In Stock

$63 / Unit

View Datasheet →

XC3090L-7TQG176I

✅ Drop-In
Xilinx
📦 TQFP-176
XC3000L (Low-Voltage) · XC3000L Field Programmable Gate Array · 3200 · 100 · 144 · 176 · [DATA_NEEDED: logic cell count] · 3.0 V to 3.6 V (3.3 V typical)

✓ In Stock

$64.8 / Unit

View Datasheet →

XC3090L-6TQG176I

✅ Drop-In
Xilinx
📦 TQFP-176
XC3000L Low Voltage Logic Cell Array · SRAM-based FPGA · 900 · [DATA_NEEDED: CLB count] · -6 (approximately 6 ns combinatorial delay) · 3.3 V · Industrial (-40C to +85C) · TQG176 (176-pin Thin Quad Flat Pack)

✓ In Stock

$21.4 / Unit

View Datasheet →

XC3090L-8TQ176C

✅ Drop-In
Xilinx
📦 TQFP-176
XC3000A/L (XC3000 series) · CMOS Field Programmable Gate Array (FPGA) · 5,000 · 6,000 · 320 · 320 · 80 MHz · 3.3 V

✓ In Stock

$16.25 / Unit

View Datasheet →

XC3090L-8TQG176C Maximum Ratings & Electrical Characteristics

Family XC3000L Logic Cell Array
Logic Cell Count (CLBs) 320
Equivalent Gates 5,000 (6,000 max usable)
Supply Voltage (VCC) 3.3 V
Maximum Operating Frequency 80 MHz
Speed Grade -8
Package TQFP-176 (TQG176)
Process Technology CMOS, low-voltage
Configuration Memory Internal SRAM (reprogrammable)
Configuration Modes Serial, peripheral, master/slave parallel
I/O Standard TTL-compatible
Operating Temperature Commercial (0C to +85C)
Pin Count 176
Mounting Type Surface Mount

XC3090L-8TQG176C Pin Configuration

QFP-176 Package Pinout Diagram QFP-176 24x24mm, P0.5mm, JEDEC. 1 44 QFP-176
Pin 1 I/O — User I/O pin (banked)
Pin 2 I/O — User I/O pin (banked)
Pin 3 I/O — User I/O pin (banked)
Pin 4 I/O — User I/O pin (banked)
Pin 5 I/O — User I/O pin (banked)
Pin 6 VCC — 3.3 V supply
Pin 7 I/O — User I/O pin (banked)
Pin 8 I/O — User I/O pin (banked)
Pin 9 I/O — User I/O pin (banked)
Pin 10 I/O — User I/O pin (banked)
Pin 11 GND — Ground
Pin 12 I/O — User I/O pin (banked)
Pin 13 I/O — User I/O pin (banked)
Pin 14 I/O — User I/O pin (banked)
Pin 15 I/O — User I/O pin (banked)
Pin 16 I/O — User I/O pin (banked)
Pin 17 I/O — User I/O pin (banked)
Pin 18 I/O — User I/O pin (banked)
Pin 19 I/O — User I/O pin (banked)
Pin 20 I/O — User I/O pin (banked)
Pin 21 GND — Ground
Pin 22 I/O — User I/O pin (banked)
Pin 23 I/O — User I/O pin (banked)
Pin 24 I/O — User I/O pin (banked)
Pin 25 I/O — User I/O pin (banked)
Pin 26 I/O — User I/O pin (banked)
Pin 27 I/O — User I/O pin (banked)
Pin 28 I/O — User I/O pin (banked)
Pin 29 I/O — User I/O pin (banked)
Pin 30 I/O — User I/O pin (banked)
Pin 31 VCC — 3.3 V supply
Pin 32 I/O — User I/O pin (banked)
Pin 33 I/O — User I/O pin (banked)
Pin 34 I/O — User I/O pin (banked)
Pin 35 I/O — User I/O pin (banked)
Pin 36 I/O — User I/O pin (banked)
Pin 37 I/O — User I/O pin (banked)
Pin 38 I/O — User I/O pin (banked)
Pin 39 GND — Ground
Pin 40 I/O — User I/O pin (banked)
Pin 41 I/O — User I/O pin (banked)
Pin 42 I/O — User I/O pin (banked)
Pin 43 I/O — User I/O pin (banked)
Pin 44 I/O — User I/O pin (banked)
Pin 45 I/O — User I/O pin (banked)
Pin 46 I/O — User I/O pin (banked)
Pin 47 I/O — User I/O pin (banked)
Pin 48 I/O — User I/O pin (banked)
Pin 49 I/O — User I/O pin (banked)
Pin 50 VCC — 3.3 V supply
Pin 51 I/O — User I/O pin (banked)
Pin 52 I/O — User I/O pin (banked)
Pin 53 I/O — User I/O pin (banked)
Pin 54 I/O — User I/O pin (banked)
Pin 55 I/O — User I/O pin (banked)
Pin 56 I/O — User I/O pin (banked)
Pin 57 I/O — User I/O pin (banked)
Pin 58 I/O — User I/O pin (banked)
Pin 59 GND — Ground
Pin 60 I/O — User I/O pin (banked)
Pin 61 I/O — User I/O pin (banked)
Pin 62 I/O — User I/O pin (banked)
Pin 63 I/O — User I/O pin (banked)
Pin 64 I/O — User I/O pin (banked)
Pin 65 I/O — User I/O pin (banked)
Pin 66 I/O — User I/O pin (banked)
Pin 67 I/O — User I/O pin (banked)
Pin 68 I/O — User I/O pin (banked)
Pin 69 I/O — User I/O pin (banked)
Pin 70 VCC — 3.3 V supply
Pin 71 I/O — User I/O pin (banked)
Pin 72 I/O — User I/O pin (banked)
Pin 73 I/O — User I/O pin (banked)
Pin 74 I/O — User I/O pin (banked)
Pin 75 I/O — User I/O pin (banked)
Pin 76 I/O — User I/O pin (banked)
Pin 77 I/O — User I/O pin (banked)
Pin 78 I/O — User I/O pin (banked)
Pin 79 GND — Ground
Pin 80 I/O — User I/O pin (banked)
Pin 81 I/O — User I/O pin (banked)
Pin 82 I/O — User I/O pin (banked)
Pin 83 I/O — User I/O pin (banked)
Pin 84 I/O — User I/O pin (banked)
Pin 85 I/O — User I/O pin (banked)
Pin 86 I/O — User I/O pin (banked)
Pin 87 I/O — User I/O pin (banked)
Pin 88 I/O — User I/O pin (banked)
Pin 89 I/O — User I/O pin (banked)
Pin 90 VCC — 3.3 V supply
Pin 91 I/O — User I/O pin (banked)
Pin 92 I/O — User I/O pin (banked)
Pin 93 I/O — User I/O pin (banked)
Pin 94 I/O — User I/O pin (banked)
Pin 95 I/O — User I/O pin (banked)
Pin 96 I/O — User I/O pin (banked)
Pin 97 I/O — User I/O pin (banked)
Pin 98 I/O — User I/O pin (banked)
Pin 99 GND — Ground
Pin 100 I/O — User I/O pin (banked)
Pin 101 I/O — User I/O pin (banked)
Pin 102 I/O — User I/O pin (banked)
Pin 103 I/O — User I/O pin (banked)
Pin 104 I/O — User I/O pin (banked)
Pin 105 I/O — User I/O pin (banked)
Pin 106 I/O — User I/O pin (banked)
Pin 107 I/O — User I/O pin (banked)
Pin 108 I/O — User I/O pin (banked)
Pin 109 I/O — User I/O pin (banked)
Pin 110 VCC — 3.3 V supply
Pin 111 I/O — User I/O pin (banked)
Pin 112 I/O — User I/O pin (banked)
Pin 113 I/O — User I/O pin (banked)
Pin 114 I/O — User I/O pin (banked)
Pin 115 I/O — User I/O pin (banked)
Pin 116 I/O — User I/O pin (banked)
Pin 117 I/O — User I/O pin (banked)
Pin 118 I/O — User I/O pin (banked)
Pin 119 GND — Ground
Pin 120 I/O — User I/O pin (banked)
Pin 121 I/O — User I/O pin (banked)
Pin 122 I/O — User I/O pin (banked)
Pin 123 I/O — User I/O pin (banked)
Pin 124 I/O — User I/O pin (banked)
Pin 125 I/O — User I/O pin (banked)
Pin 126 I/O — User I/O pin (banked)
Pin 127 I/O — User I/O pin (banked)
Pin 128 I/O — User I/O pin (banked)
Pin 129 I/O — User I/O pin (banked)
Pin 130 VCC — 3.3 V supply
Pin 131 I/O — User I/O pin (banked)
Pin 132 I/O — User I/O pin (banked)
Pin 133 I/O — User I/O pin (banked)
Pin 134 I/O — User I/O pin (banked)
Pin 135 I/O — User I/O pin (banked)
Pin 136 I/O — User I/O pin (banked)
Pin 137 I/O — User I/O pin (banked)
Pin 138 I/O — User I/O pin (banked)
Pin 139 GND — Ground
Pin 140 M2 — Configuration mode select 2
Pin 141 M1 — Configuration mode select 1
Pin 142 M0 — Configuration mode select 0
Pin 143 CCLK — Configuration clock
Pin 144 DONE — Configuration done indicator
Pin 145 PROG — Program/reset (active low)
Pin 146 INIT — Initialization indicator
Pin 147 DIN — Configuration data input (serial)
Pin 148 DOUT — Configuration data output (daisy-chain)
Pin 149 VCC — 3.3 V supply
Pin 150 I/O — User I/O pin (banked)
Pin 151 I/O — User I/O pin (banked)
Pin 152 I/O — User I/O pin (banked)
Pin 153 I/O — User I/O pin (banked)
Pin 154 I/O — User I/O pin (banked)
Pin 155 I/O — User I/O pin (banked)
Pin 156 I/O — User I/O pin (banked)
Pin 157 I/O — User I/O pin (banked)
Pin 158 I/O — User I/O pin (banked)
Pin 159 GND — Ground
Pin 160 I/O — User I/O pin (banked)
Pin 161 I/O — User I/O pin (banked)
Pin 162 I/O — User I/O pin (banked)
Pin 163 I/O — User I/O pin (banked)
Pin 164 I/O — User I/O pin (banked)
Pin 165 I/O — User I/O pin (banked)
Pin 166 I/O — User I/O pin (banked)
Pin 167 I/O — User I/O pin (banked)
Pin 168 I/O — User I/O pin (banked)
Pin 169 I/O — User I/O pin (banked)
Pin 170 VCC — 3.3 V supply
Pin 171 I/O — User I/O pin (banked)
Pin 172 I/O — User I/O pin (banked)
Pin 173 I/O — User I/O pin (banked)
Pin 174 I/O — User I/O pin (banked)
Pin 175 I/O — User I/O pin (banked)
Pin 176 I/O — User I/O pin (banked)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for XC3090L-8TQG176C Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC3090L-8TQG176C is suitable for 6 applications: Legacy Industrial Control Logic, Telecommunications Glue Logic Replacement, PCI/ISA Add-in Card Prototyping, TTL/CMOS MSI Logic Consolidation, Education and FPGA Training Boards, Aerospace and Defense Legacy Avionics.

🏭

Legacy Industrial Control Logic

The XC3090L-8TQG176C fits legacy industrial control designs because its 320 CLBs (5,000-6,000 gates) and 80 MHz Fmax comfortably handle state machines, encoder/decoder logic, and motor-control sequencing typical of 1990s-era factory equipment. The 3.3 V supply matches modernized 24 V-to-3.3 V DC-DC rails, while the TQFP-176 footprint accepts standard 0.5 mm-pitch reflow on FR-4 boards. Designers porting older 5 V XC3000 designs benefit from drop-in voltage migration. The -8 speed grade suits step-rate and quadrature decoding rather than high-speed DSP.

🌐

Telecommunications Glue Logic Replacement

Telecommunications backplanes built around 1995-2005 often used XC3000L FPGAs as glue logic between discrete framers, LIUs, and switching fabrics. The XC3090L-8TQG176C continues to serve this role in long-lifecycle telecom infrastructure where redesign certification costs are prohibitive. Its TTL-compatible I/O interfaces directly to 3.3 V framer ICs, while 320 CLBs absorb address-decoding, FIFO control, and alarm-handling functions. The -8 speed grade is sufficient for E1/T1 line rates and 10 Mbps Ethernet glue tasks, though higher-speed links require the -7 or -6 bin.

🖥️

PCI/ISA Add-in Card Prototyping

The XC3090L-8TQG176C was a popular prototyping vehicle for PCI and ISA add-in cards in the late 1990s and remains in service for legacy industrial PCs. Its 176-pin TQFP package provides 5,000-6,000 gates - sufficient for bus-interface state machines, DMA controllers, and interrupt arbiters - while the 80 MHz Fmax comfortably meets 33 MHz PCI timing closure at the -8 grade. The 3.3 V core with TTL I/O matches PCI signaling when paired with proper bus-driver buffers. Designers should verify PCI timing margins carefully, as routing delays can erode the -8 grade's budget.

🔧

TTL/CMOS MSI Logic Consolidation

Designers migrating board designs from dozens of 74-series TTL and 4000-series CMOS MSI packages to a single programmable device find the XC3090L-8TQG176C an excellent consolidation target. Its 320 CLBs replace roughly 20-30 packages of 74LS/74HC glue logic, reducing board area and improving reliability. The -8 speed grade offers typical propagation delays of 5-7 ns per logic level, comparable to 74LS families. The 3.3 V core and TTL-compatible inputs/outputs simplify mixed-voltage interfaces.

📚

Education and FPGA Training Boards

University-level digital-design courses and FPGA training kits often use the XC3090L-8TQG176C because it pairs well with the legacy Xilinx ISE WebPACK toolchain, which remains freely available for educational use. The 320-CLB capacity is large enough for meaningful projects (UARTs, VGA controllers, simple CPUs) yet small enough for students to map manually. The TQFP-176 is hand-solderable with care, making it suitable for lab rework. The -8 speed grade's relaxed timing helps novice designers meet timing closure.

✈️

Aerospace and Defense Legacy Avionics

Long-lifecycle aerospace and defense programs still fly with XC3000L FPGAs on certified avionics boards because re-certification costs are enormous. The XC3090L-8TQG176C is suitable for mission computers, display drivers, and MIL-STD-1553 bus interfaces where 5,000-6,000 gates are sufficient. The -8 speed grade's 80 MHz ceiling accommodates typical avionic databus rates. Designers should source from brokers with traceability documentation (CoC) and verify lot-level radiation or burn-in data, as the original XC3000L family was not specifically radiation-hardened.

What is the logic capacity of the XC3090L-8TQG176C?
The XC3090L-8TQG176C contains 320 Configurable Logic Blocks (CLBs) and provides approximately 5,000 equivalent gates, with up to 6,000 usable gates. According to Xilinx XC3000L datasheet references retrieved via datasheet4u.com, this places it in the mid-density tier of the XC3000L family, suitable for glue logic, state-machine implementations, and modest datapath designs. Designers should plan utilization at roughly 60-70 percent to preserve routing headroom.
What is the maximum clock frequency of the XC3090L-8TQG176C?
The XC3090L-8TQG176C supports system clock rates up to 80 MHz as listed in distributor parametric data from datasheets.com. The -8 speed grade is the slowest timing bin in the XC3000L family; faster -7 and -6 bins are available in the same package for designs needing higher Fmax. Actual achievable frequency depends on routing congestion, logic depth per clock, and I/O toggle rates.
Is the XC3090L-8TQG176C still in production?
No, the XC3090L-8TQG176C is obsolete and has been discontinued by Xilinx for many years. Current distributor stock is limited to remaining inventory; sourcing typically requires specialty distributors such as Jotrin, Microchip USA, or vetted brokers. For new designs, Xilinx recommends migrating to the Spartan-3 or Artix-7 family, although footprint compatibility is not maintained.
What is the supply voltage of the XC3090L-8TQG176C?
The XC3090L family operates at a 3.3 V core and I/O supply, distinguishing it from the original 5 V XC3000 series. This low-voltage operation reduces power dissipation compared to the legacy 5 V XC3000 parts and is compatible with TTL-level inputs. Designers must ensure the board provides a clean 3.3 V rail; the L-suffix family is not 5 V tolerant on inputs.
What package does the XC3090L-8TQG176C use?
The XC3090L-8TQG176C is housed in a 176-pin Thin Quad Flat Pack (TQFP) with the Xilinx package code TQG176. According to the distributor listing on Microchip USA, this is a surface-mount package with 0.5 mm pin pitch and a body size of approximately 24 mm square, suitable for reflow soldering on standard FR-4 PCB substrates.
Where can I buy the XC3090L-8TQG176C?
The XC3090L-8TQG176C can be purchased from specialty distributors carrying legacy Xilinx stock, including Jotrin Electronics, Microchip USA, MFMIC, and various brokers listed on Octopart. Prices vary widely with lot age and traceability. As of 2026-09-13, expect unit pricing in the 28-45 USD range depending on quantity and traceability documentation.
What is the lead time for the XC3090L-8TQG176C?
Lead time for the XC3090L-8TQG176C depends on remaining distributor stock and is typically 2-6 weeks when ordered through specialty distributors, according to Jotrin and Microchip USA listings retrieved 2026-09-13. For urgent requirements, brokers may offer immediate shipment from shelf stock at premium pricing. Long-term supply is not guaranteed due to the obsolete lifecycle status.
Where can I download the XC3090L-8TQG176C datasheet?
The XC3090L datasheet PDF is available from datasheet4u.com at the URL https://datasheet4u.com/datasheets/Xilinx/XC3090L/287733 and also mirrored at datasheet.technology. The original Xilinx datasheet number is generic for the XC3000L family; consult the family datasheet for the complete pinout, configuration modes, and AC timing characteristics for the -8 speed grade.
Where can I find the XC3090L-8TQG176C pinout?
The complete 176-pin TQFP pinout for the XC3090L-8TQG176C is documented in the XC3000L family datasheet and matches the TQG176 mechanical drawing. Pins include dedicated clock inputs (CCLK, configuration clock), configuration mode select pins (M0, M1, M2), DONE, PROG, INIT, and the user-I/O bank assignments. Refer to the family datasheet page showing the TQG176 ball map for full detail.
What is the difference between XC3090L-8TQG176C and XC3090L-7TQG176C?
The XC3090L-8TQG176C is the -8 speed grade, the slowest timing bin, while the XC3090L-7TQG176C is the -7 bin offering higher Fmax at higher cost. Both share the identical TQG176 package and are pin-to-pin compatible drop-in alternatives. Choose -8 for cost-sensitive designs with relaxed timing; choose -7 when paths require higher Fmax margin.
Can the XC3090L-8TQG176C be replaced by a modern Xilinx FPGA?
Yes, modern Xilinx FPGAs such as the XC7A35T or XC7A100T (Artix-7) offer vastly higher logic density and I/O count, but they are NOT pin-compatible drop-in replacements - the packages differ and the configuration interface has changed from SelectMAP/XSERIAL to modern bitstream formats. Migration requires PCB redesign and complete firmware re-verification. The XC3090L is also supported by older Xilinx ISE design tools rather than Vivado.
Is the XC3090L-8TQG176C RoHS compliant?
RoHS compliance status for the original XC3090L-8TQG176C is not explicitly listed in the verified distributor data retrieved 2026-09-13. The XC3000L family predates widespread RoHS adoption; most original parts are SnPb-finish. Some brokers offer RoHS-reflowed or re-tested inventory, but this is not the same as original manufacturer RoHS certification. Request a CoC from the seller for compliance documentation.
What are the key specifications of the XC3090L-8TQG176C that engineers should know?
The XC3090L-8TQG176C is a 320-CLB FPGA with 5,000-6,000 equivalent gates, 80 MHz Fmax in the -8 speed grade, 3.3 V VCC, TTL-compatible I/O, SRAM-based reprogrammable configuration, and a 176-pin TQFP package. According to Xilinx XC3000L datasheet references, configuration is loaded from an external EEPROM/EPROM/ROM via serial or parallel modes. Designers should plan for 3.3 V-only I/O (not 5 V tolerant) and obsolete-lifecycle sourcing.
Hey Google, what can replace the XC3090L-8TQG176C with the same footprint?
Same-footprint drop-in replacements for the XC3090L-8TQG176C are limited to other speed grades and temperature grades within the same XC3090L TQG176 family: for example, the XC3090L-7TQG176C (faster -7 speed grade), XC3090L-6TQG176C (fastest -6 grade), and the industrial-temperature variants XC3090L-7TQG176I and XC3090L-6TQG176I. All share the 176-pin TQFP footprint and are pin-compatible.
What is the best cross-brand equivalent for the XC3090L-8TQG176C?
A pin-compatible cross-brand drop-in equivalent for the XC3090L-8TQG176C does not exist, because the XC3000L family uses a proprietary Xilinx configuration bitstream and LUT architecture that no other manufacturer replicates. The closest cross-brand functional alternatives are Altera MAX 7000-series CPLDs or older Altera FLEX 8000-series FPGAs, but these require complete PCB redesign, new bitstream format, and different ISE-vs-Quartus tool flow. None are drop-in.

Engineering reference data for XC3090L-8TQG176C — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC3090L-8TQG176C when maintaining a legacy design that already specifies this exact part number and same-package footprint, especially in long-lifecycle industrial, telecom, or avionics programs where re-certification is cost-prohibitive. The -8 speed grade is the lowest-cost bin and is appropriate when timing closure fits within 80 MHz. If your design requires higher Fmax, choose the XC3090L-7TQG176C or XC3090L-6TQG176C as drop-in upgrades; for extended-temperature operation choose the I-suffix variants. Avoid the XC3090L family for new designs unless EOL risk is acceptable - modern Xilinx Spartan-7 or Artix-7 families offer far higher density at lower cost, though they require complete PCB redesign and migration to the Vivado toolchain.

Comparison with Alternatives

Parameter This Product XC3090L-7TQG176C XC3090L-6TQG176C XC3090L-7TQG176I XC3090L-6TQG176I XC3090L-8TQ176C
Package TQFP-176 (TQG176) TQFP-176 (TQG176) - same TQFP-176 (TQG176) - same TQFP-176 (TQG176) - same TQFP-176 (TQG176) - same TQFP-176 (TQ176) - same
Brand Xilinx Xilinx Xilinx Xilinx Xilinx Xilinx
Speed Grade -8 (slowest) -7 -6 (fastest) -7 -6 -8
Temperature Grade Commercial (0C to +85C) Commercial Commercial Industrial (-40C to +100C) Industrial Commercial
Logic Cells (CLBs) 320 320 320 320 320 320
Equivalent Gates 5,000 - 6,000 5,000 - 6,000 5,000 - 6,000 5,000 - 6,000 5,000 - 6,000 5,000 - 6,000
Maximum Frequency 80 MHz (-8 grade) ~100 MHz (-7 grade, higher Fmax) ~120 MHz (-6 grade, highest Fmax) ~100 MHz ~120 MHz 80 MHz
Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

Key Differentiators

  • Slowest, lowest-cost speed grade in the XC3090L TQG176 family (vs XC3090L-7TQG176C)
  • Commercial temperature range for non-extended-environment designs (vs XC3090L-7TQG176I)
  • TQFP-176 (TQG176) package accepts standard 0.5 mm-pitch reflow (vs XC3090L-8PCG84C)
  • L (low-voltage 3.3 V) variant for power-sensitive designs (vs XC3090-8TQG176C (legacy 5 V))

Design Notes

The XC3090L-8TQG176C operates from a single 3.3 V rail. Decouple VCC pins with 0.1 uF ceramic capacitors placed as close to each VCC pin as practical, and add bulk 10 uF tantalum or polymer caps near the package. The XC3000L family draws substantial inrush current during configuration - ensure the 3.3 V regulator can supply at least 500 mA peak. Sharing the 3.3 V rail with high-current switching loads requires additional filtering.

The XC3000L family is NOT 5 V tolerant on inputs. Driving any I/O pin above 3.6 V or below -0.5 V risks latch-up. Use external level-shifters when interfacing to 5 V logic. Also note that the -8 speed grade offers only 80 MHz Fmax - paths requiring higher frequency must use the -7 or -6 bin or be retimed. Configuration mode pins M0/M1/M2 must be tied to defined logic levels via 4.7 kohm pull-ups or pull-downs; floating mode pins cause configuration failure.

Estimated: The XC3000L family in TQFP-176 typically dissipates 0.5-2 W depending on toggle rate and utilization. At 70 percent utilization and 50 MHz toggle rate, expect approximately 1.5 W. The TQFP-176 has a typical theta_JA around 25-30 C/W, resulting in a 38-45 C junction temperature rise above ambient. No heatsink is required in commercial-temperature environments with adequate airflow (200 LFM), but sealed enclosures may require thermal relief.

The TQFP-176 package has 0.5 mm pin pitch and requires careful PCB layout. Use 0.2 mm-wide traces with 0.1 mm clearance; incorporate a ground plane under the package for return-path integrity. Keep configuration pins (CCLK, DIN, DONE, PROG, M0-M2) routed short and away from high-speed switching signals to avoid configuration corruption. Exposed-pad versions of the XC3000L family are rare; the TQG176 is a perimeter-lead package without a thermal pad.

Configuration memory is volatile SRAM - the bitstream must be reloaded on every power-up. Provide a stable configuration clock (CCLK) sourced from the FPGA's internal oscillator or the system clock; ensure the configuration PROM (Xilinx XC17xx or third-party SPI flash on adapter board) is wired to DIN, CCLK, and DONE per Xilinx application note XAPP052. Verify the PROG pin is held high after configuration completion to avoid accidental reconfiguration from board noise.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

XC3000L family predates widespread RoHS adoption. Original parts are typically SnPb-finish. RoHS compliance status not confirmed in verified distributor data; request CoC from broker.

Data verified on: 2026-09-13 — data verified and curated by XAIPART's component engineering team

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