XC3090L-8TQG176C - 320 CLB FPGA, 6K Gates, 80MHz, TQFP-176 | Xilinx
MPN: XC3090L-8TQG176C ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $41 | $410.00 |
| 100 | $36.5 | $3,650.00 |
| 500 | $32 | $16,000.00 |
| 1,000 | $28.75 | $28,750.00 |
Drop-in alternatives for XC3090L-8TQG176C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC3090L-7TQG176C
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View Datasheet →XC3090L-6TQG176C
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$63 / Unit
View Datasheet →XC3090L-7TQG176I
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$64.8 / Unit
View Datasheet →XC3090L-6TQG176I
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →XC3090L-8TQ176C
✅ Drop-In✓ In Stock
$16.25 / Unit
View Datasheet →XC3090L-8TQG176C Maximum Ratings & Electrical Characteristics
| Family | XC3000L Logic Cell Array |
| Logic Cell Count (CLBs) | 320 |
| Equivalent Gates | 5,000 (6,000 max usable) |
| Supply Voltage (VCC) | 3.3 V |
| Maximum Operating Frequency | 80 MHz |
| Speed Grade | -8 |
| Package | TQFP-176 (TQG176) |
| Process Technology | CMOS, low-voltage |
| Configuration Memory | Internal SRAM (reprogrammable) |
| Configuration Modes | Serial, peripheral, master/slave parallel |
| I/O Standard | TTL-compatible |
| Operating Temperature | Commercial (0C to +85C) |
| Pin Count | 176 |
| Mounting Type | Surface Mount |
XC3090L-8TQG176C Pin Configuration
| Pin 1 | I/O — User I/O pin (banked) |
| Pin 2 | I/O — User I/O pin (banked) |
| Pin 3 | I/O — User I/O pin (banked) |
| Pin 4 | I/O — User I/O pin (banked) |
| Pin 5 | I/O — User I/O pin (banked) |
| Pin 6 | VCC — 3.3 V supply |
| Pin 7 | I/O — User I/O pin (banked) |
| Pin 8 | I/O — User I/O pin (banked) |
| Pin 9 | I/O — User I/O pin (banked) |
| Pin 10 | I/O — User I/O pin (banked) |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O pin (banked) |
| Pin 13 | I/O — User I/O pin (banked) |
| Pin 14 | I/O — User I/O pin (banked) |
| Pin 15 | I/O — User I/O pin (banked) |
| Pin 16 | I/O — User I/O pin (banked) |
| Pin 17 | I/O — User I/O pin (banked) |
| Pin 18 | I/O — User I/O pin (banked) |
| Pin 19 | I/O — User I/O pin (banked) |
| Pin 20 | I/O — User I/O pin (banked) |
| Pin 21 | GND — Ground |
| Pin 22 | I/O — User I/O pin (banked) |
| Pin 23 | I/O — User I/O pin (banked) |
| Pin 24 | I/O — User I/O pin (banked) |
| Pin 25 | I/O — User I/O pin (banked) |
| Pin 26 | I/O — User I/O pin (banked) |
| Pin 27 | I/O — User I/O pin (banked) |
| Pin 28 | I/O — User I/O pin (banked) |
| Pin 29 | I/O — User I/O pin (banked) |
| Pin 30 | I/O — User I/O pin (banked) |
| Pin 31 | VCC — 3.3 V supply |
| Pin 32 | I/O — User I/O pin (banked) |
| Pin 33 | I/O — User I/O pin (banked) |
| Pin 34 | I/O — User I/O pin (banked) |
| Pin 35 | I/O — User I/O pin (banked) |
| Pin 36 | I/O — User I/O pin (banked) |
| Pin 37 | I/O — User I/O pin (banked) |
| Pin 38 | I/O — User I/O pin (banked) |
| Pin 39 | GND — Ground |
| Pin 40 | I/O — User I/O pin (banked) |
| Pin 41 | I/O — User I/O pin (banked) |
| Pin 42 | I/O — User I/O pin (banked) |
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| Pin 46 | I/O — User I/O pin (banked) |
| Pin 47 | I/O — User I/O pin (banked) |
| Pin 48 | I/O — User I/O pin (banked) |
| Pin 49 | I/O — User I/O pin (banked) |
| Pin 50 | VCC — 3.3 V supply |
| Pin 51 | I/O — User I/O pin (banked) |
| Pin 52 | I/O — User I/O pin (banked) |
| Pin 53 | I/O — User I/O pin (banked) |
| Pin 54 | I/O — User I/O pin (banked) |
| Pin 55 | I/O — User I/O pin (banked) |
| Pin 56 | I/O — User I/O pin (banked) |
| Pin 57 | I/O — User I/O pin (banked) |
| Pin 58 | I/O — User I/O pin (banked) |
| Pin 59 | GND — Ground |
| Pin 60 | I/O — User I/O pin (banked) |
| Pin 61 | I/O — User I/O pin (banked) |
| Pin 62 | I/O — User I/O pin (banked) |
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| Pin 67 | I/O — User I/O pin (banked) |
| Pin 68 | I/O — User I/O pin (banked) |
| Pin 69 | I/O — User I/O pin (banked) |
| Pin 70 | VCC — 3.3 V supply |
| Pin 71 | I/O — User I/O pin (banked) |
| Pin 72 | I/O — User I/O pin (banked) |
| Pin 73 | I/O — User I/O pin (banked) |
| Pin 74 | I/O — User I/O pin (banked) |
| Pin 75 | I/O — User I/O pin (banked) |
| Pin 76 | I/O — User I/O pin (banked) |
| Pin 77 | I/O — User I/O pin (banked) |
| Pin 78 | I/O — User I/O pin (banked) |
| Pin 79 | GND — Ground |
| Pin 80 | I/O — User I/O pin (banked) |
| Pin 81 | I/O — User I/O pin (banked) |
| Pin 82 | I/O — User I/O pin (banked) |
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| Pin 87 | I/O — User I/O pin (banked) |
| Pin 88 | I/O — User I/O pin (banked) |
| Pin 89 | I/O — User I/O pin (banked) |
| Pin 90 | VCC — 3.3 V supply |
| Pin 91 | I/O — User I/O pin (banked) |
| Pin 92 | I/O — User I/O pin (banked) |
| Pin 93 | I/O — User I/O pin (banked) |
| Pin 94 | I/O — User I/O pin (banked) |
| Pin 95 | I/O — User I/O pin (banked) |
| Pin 96 | I/O — User I/O pin (banked) |
| Pin 97 | I/O — User I/O pin (banked) |
| Pin 98 | I/O — User I/O pin (banked) |
| Pin 99 | GND — Ground |
| Pin 100 | I/O — User I/O pin (banked) |
| Pin 101 | I/O — User I/O pin (banked) |
| Pin 102 | I/O — User I/O pin (banked) |
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| Pin 107 | I/O — User I/O pin (banked) |
| Pin 108 | I/O — User I/O pin (banked) |
| Pin 109 | I/O — User I/O pin (banked) |
| Pin 110 | VCC — 3.3 V supply |
| Pin 111 | I/O — User I/O pin (banked) |
| Pin 112 | I/O — User I/O pin (banked) |
| Pin 113 | I/O — User I/O pin (banked) |
| Pin 114 | I/O — User I/O pin (banked) |
| Pin 115 | I/O — User I/O pin (banked) |
| Pin 116 | I/O — User I/O pin (banked) |
| Pin 117 | I/O — User I/O pin (banked) |
| Pin 118 | I/O — User I/O pin (banked) |
| Pin 119 | GND — Ground |
| Pin 120 | I/O — User I/O pin (banked) |
| Pin 121 | I/O — User I/O pin (banked) |
| Pin 122 | I/O — User I/O pin (banked) |
| Pin 123 | I/O — User I/O pin (banked) |
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| Pin 125 | I/O — User I/O pin (banked) |
| Pin 126 | I/O — User I/O pin (banked) |
| Pin 127 | I/O — User I/O pin (banked) |
| Pin 128 | I/O — User I/O pin (banked) |
| Pin 129 | I/O — User I/O pin (banked) |
| Pin 130 | VCC — 3.3 V supply |
| Pin 131 | I/O — User I/O pin (banked) |
| Pin 132 | I/O — User I/O pin (banked) |
| Pin 133 | I/O — User I/O pin (banked) |
| Pin 134 | I/O — User I/O pin (banked) |
| Pin 135 | I/O — User I/O pin (banked) |
| Pin 136 | I/O — User I/O pin (banked) |
| Pin 137 | I/O — User I/O pin (banked) |
| Pin 138 | I/O — User I/O pin (banked) |
| Pin 139 | GND — Ground |
| Pin 140 | M2 — Configuration mode select 2 |
| Pin 141 | M1 — Configuration mode select 1 |
| Pin 142 | M0 — Configuration mode select 0 |
| Pin 143 | CCLK — Configuration clock |
| Pin 144 | DONE — Configuration done indicator |
| Pin 145 | PROG — Program/reset (active low) |
| Pin 146 | INIT — Initialization indicator |
| Pin 147 | DIN — Configuration data input (serial) |
| Pin 148 | DOUT — Configuration data output (daisy-chain) |
| Pin 149 | VCC — 3.3 V supply |
| Pin 150 | I/O — User I/O pin (banked) |
| Pin 151 | I/O — User I/O pin (banked) |
| Pin 152 | I/O — User I/O pin (banked) |
| Pin 153 | I/O — User I/O pin (banked) |
| Pin 154 | I/O — User I/O pin (banked) |
| Pin 155 | I/O — User I/O pin (banked) |
| Pin 156 | I/O — User I/O pin (banked) |
| Pin 157 | I/O — User I/O pin (banked) |
| Pin 158 | I/O — User I/O pin (banked) |
| Pin 159 | GND — Ground |
| Pin 160 | I/O — User I/O pin (banked) |
| Pin 161 | I/O — User I/O pin (banked) |
| Pin 162 | I/O — User I/O pin (banked) |
| Pin 163 | I/O — User I/O pin (banked) |
| Pin 164 | I/O — User I/O pin (banked) |
| Pin 165 | I/O — User I/O pin (banked) |
| Pin 166 | I/O — User I/O pin (banked) |
| Pin 167 | I/O — User I/O pin (banked) |
| Pin 168 | I/O — User I/O pin (banked) |
| Pin 169 | I/O — User I/O pin (banked) |
| Pin 170 | VCC — 3.3 V supply |
| Pin 171 | I/O — User I/O pin (banked) |
| Pin 172 | I/O — User I/O pin (banked) |
| Pin 173 | I/O — User I/O pin (banked) |
| Pin 174 | I/O — User I/O pin (banked) |
| Pin 175 | I/O — User I/O pin (banked) |
| Pin 176 | I/O — User I/O pin (banked) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC3090L-8TQG176C is suitable for 6 applications: Legacy Industrial Control Logic, Telecommunications Glue Logic Replacement, PCI/ISA Add-in Card Prototyping, TTL/CMOS MSI Logic Consolidation, Education and FPGA Training Boards, Aerospace and Defense Legacy Avionics.
Legacy Industrial Control Logic
The XC3090L-8TQG176C fits legacy industrial control designs because its 320 CLBs (5,000-6,000 gates) and 80 MHz Fmax comfortably handle state machines, encoder/decoder logic, and motor-control sequencing typical of 1990s-era factory equipment. The 3.3 V supply matches modernized 24 V-to-3.3 V DC-DC rails, while the TQFP-176 footprint accepts standard 0.5 mm-pitch reflow on FR-4 boards. Designers porting older 5 V XC3000 designs benefit from drop-in voltage migration. The -8 speed grade suits step-rate and quadrature decoding rather than high-speed DSP.
Recommended
Telecommunications Glue Logic Replacement
Telecommunications backplanes built around 1995-2005 often used XC3000L FPGAs as glue logic between discrete framers, LIUs, and switching fabrics. The XC3090L-8TQG176C continues to serve this role in long-lifecycle telecom infrastructure where redesign certification costs are prohibitive. Its TTL-compatible I/O interfaces directly to 3.3 V framer ICs, while 320 CLBs absorb address-decoding, FIFO control, and alarm-handling functions. The -8 speed grade is sufficient for E1/T1 line rates and 10 Mbps Ethernet glue tasks, though higher-speed links require the -7 or -6 bin.
Recommended
PCI/ISA Add-in Card Prototyping
The XC3090L-8TQG176C was a popular prototyping vehicle for PCI and ISA add-in cards in the late 1990s and remains in service for legacy industrial PCs. Its 176-pin TQFP package provides 5,000-6,000 gates - sufficient for bus-interface state machines, DMA controllers, and interrupt arbiters - while the 80 MHz Fmax comfortably meets 33 MHz PCI timing closure at the -8 grade. The 3.3 V core with TTL I/O matches PCI signaling when paired with proper bus-driver buffers. Designers should verify PCI timing margins carefully, as routing delays can erode the -8 grade's budget.
Recommended
TTL/CMOS MSI Logic Consolidation
Designers migrating board designs from dozens of 74-series TTL and 4000-series CMOS MSI packages to a single programmable device find the XC3090L-8TQG176C an excellent consolidation target. Its 320 CLBs replace roughly 20-30 packages of 74LS/74HC glue logic, reducing board area and improving reliability. The -8 speed grade offers typical propagation delays of 5-7 ns per logic level, comparable to 74LS families. The 3.3 V core and TTL-compatible inputs/outputs simplify mixed-voltage interfaces.
Recommended
Education and FPGA Training Boards
University-level digital-design courses and FPGA training kits often use the XC3090L-8TQG176C because it pairs well with the legacy Xilinx ISE WebPACK toolchain, which remains freely available for educational use. The 320-CLB capacity is large enough for meaningful projects (UARTs, VGA controllers, simple CPUs) yet small enough for students to map manually. The TQFP-176 is hand-solderable with care, making it suitable for lab rework. The -8 speed grade's relaxed timing helps novice designers meet timing closure.
Recommended
Aerospace and Defense Legacy Avionics
Long-lifecycle aerospace and defense programs still fly with XC3000L FPGAs on certified avionics boards because re-certification costs are enormous. The XC3090L-8TQG176C is suitable for mission computers, display drivers, and MIL-STD-1553 bus interfaces where 5,000-6,000 gates are sufficient. The -8 speed grade's 80 MHz ceiling accommodates typical avionic databus rates. Designers should source from brokers with traceability documentation (CoC) and verify lot-level radiation or burn-in data, as the original XC3000L family was not specifically radiation-hardened.
Recommended
Recommended Products Summary
Engineering reference data for XC3090L-8TQG176C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3090L-7TQG176C | XC3090L-6TQG176C | XC3090L-7TQG176I | XC3090L-6TQG176I | XC3090L-8TQ176C |
|---|---|---|---|---|---|---|
| Package | TQFP-176 (TQG176) | TQFP-176 (TQG176) - same | TQFP-176 (TQG176) - same | TQFP-176 (TQG176) - same | TQFP-176 (TQG176) - same | TQFP-176 (TQ176) - same |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Speed Grade | -8 (slowest) | -7 | -6 (fastest) | -7 | -6 | -8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Industrial (-40C to +100C) | Industrial | Commercial |
| Logic Cells (CLBs) | 320 | 320 | 320 | 320 | 320 | 320 |
| Equivalent Gates | 5,000 - 6,000 | 5,000 - 6,000 | 5,000 - 6,000 | 5,000 - 6,000 | 5,000 - 6,000 | 5,000 - 6,000 |
| Maximum Frequency | 80 MHz (-8 grade) | ~100 MHz (-7 grade, higher Fmax) | ~120 MHz (-6 grade, highest Fmax) | ~100 MHz | ~120 MHz | 80 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Slowest, lowest-cost speed grade in the XC3090L TQG176 family (vs XC3090L-7TQG176C)
- Commercial temperature range for non-extended-environment designs (vs XC3090L-7TQG176I)
- TQFP-176 (TQG176) package accepts standard 0.5 mm-pitch reflow (vs XC3090L-8PCG84C)
- L (low-voltage 3.3 V) variant for power-sensitive designs (vs XC3090-8TQG176C (legacy 5 V))
Design Notes
The XC3090L-8TQG176C operates from a single 3.3 V rail. Decouple VCC pins with 0.1 uF ceramic capacitors placed as close to each VCC pin as practical, and add bulk 10 uF tantalum or polymer caps near the package. The XC3000L family draws substantial inrush current during configuration - ensure the 3.3 V regulator can supply at least 500 mA peak. Sharing the 3.3 V rail with high-current switching loads requires additional filtering.
The XC3000L family is NOT 5 V tolerant on inputs. Driving any I/O pin above 3.6 V or below -0.5 V risks latch-up. Use external level-shifters when interfacing to 5 V logic. Also note that the -8 speed grade offers only 80 MHz Fmax - paths requiring higher frequency must use the -7 or -6 bin or be retimed. Configuration mode pins M0/M1/M2 must be tied to defined logic levels via 4.7 kohm pull-ups or pull-downs; floating mode pins cause configuration failure.
Estimated: The XC3000L family in TQFP-176 typically dissipates 0.5-2 W depending on toggle rate and utilization. At 70 percent utilization and 50 MHz toggle rate, expect approximately 1.5 W. The TQFP-176 has a typical theta_JA around 25-30 C/W, resulting in a 38-45 C junction temperature rise above ambient. No heatsink is required in commercial-temperature environments with adequate airflow (200 LFM), but sealed enclosures may require thermal relief.
The TQFP-176 package has 0.5 mm pin pitch and requires careful PCB layout. Use 0.2 mm-wide traces with 0.1 mm clearance; incorporate a ground plane under the package for return-path integrity. Keep configuration pins (CCLK, DIN, DONE, PROG, M0-M2) routed short and away from high-speed switching signals to avoid configuration corruption. Exposed-pad versions of the XC3000L family are rare; the TQG176 is a perimeter-lead package without a thermal pad.
Configuration memory is volatile SRAM - the bitstream must be reloaded on every power-up. Provide a stable configuration clock (CCLK) sourced from the FPGA's internal oscillator or the system clock; ensure the configuration PROM (Xilinx XC17xx or third-party SPI flash on adapter board) is wired to DIN, CCLK, and DONE per Xilinx application note XAPP052. Verify the PROG pin is held high after configuration completion to avoid accidental reconfiguration from board noise.
Compliance Information
XC3000L family predates widespread RoHS adoption. Original parts are typically SnPb-finish. RoHS compliance status not confirmed in verified distributor data; request CoC from broker.