5CGXBC9C6F23C7N - Cyclone V GX FPGA, 301K LE, 484-FBGA | Intel
MPN： 5CGXBC9C6F23C7N ✓ 啟用中5CGXBC9C6F23C7N 概覽
What is a Cyclone V GX FPGA? A Cyclone V GX FPGA is a mid-range, low-power programmable logic device from Intel's Cyclone V family that combines general-purpose logic fabric with multi-gigabit transceivers (MGTs) on a single die. The Cyclone V family sits within Intel's broader product taxonomy: Cyclone V FPGA -> low-power FPGA family -> FPGA -> programmable logic device -> semiconductor IC. The GX variant specifically adds up to six 3.125 Gbps transceivers, making it the lowest-cost Intel/Altera FPGA with integrated multi-gigabit serial links and differentiating it from the E (logic-only), GT (transceiver + memory), and SX/ST (ARM Hard Processor System) variants.
Key features include 224 GPIO organized in 11 banks, integrated 6.144 Mbit transceiver PMA block, dedicated 8-input adaptive logic modules (ALMs), and embedded hard IP blocks including PLLs, memory controllers, and PCIe Gen2 hard IP. The 5CGXBC9 prefix indicates the 9-series (highest density) device with six transceivers (BC9 family code).
The Cyclone V GX architecture combines a fabric of LABs (Logic Array Blocks), M20K SRAM blocks, DSP blocks, and hard PCIe Gen2 controllers with up to six 3.125 Gbps transceivers per side. This heterogeneous architecture reduces power by approximately 40% compared to the prior Cyclone IV generation while delivering higher logic density and DSP throughput.
Typical applications include industrial motor control and machine vision, broadcast video processing, low-cost wireless backhaul, video surveillance DVR/NVR, and PCIe Gen2 endpoint cards. The integrated transceivers make the device particularly suited for designs that previously required an FPGA plus an external PHY.
When designing with this device, allocate sufficient BGA fanout escape routing on at least 6 PCB layers and provide a clean 1.13 V core rail with sub-milliohm PDN impedance to meet 3.125 Gbps link margin. Decoupling strategy should follow Intel's Cyclone V PDN guide: 0402 ceramic caps placed directly under each transceiver lane and bulk capacitors within 50 mm of the FBGA footprint.
This page synthesizes distributor pricing, Cyclone V GX drop-in alternatives, and practical high-speed design notes that go beyond the manufacturer datasheet summary.
直接替換替代品，適用於 5CGXBC9C6F23C7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 5CGXBC9C6F23C7N （相同外形與佔位） — 差異在於 Package, Operating Temperature, RoHS Status, Mounting Type, Process Technology.
5CGXBC9C6F23C8N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
5CGXBC9C6F23I7N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
5CGXBC9C7F23C7N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
5CGXBC9A7U19C8N
✅ 直接替換聯絡詢價
查看資料表 →5CGXBC7C6F23C7N
✅ 直接替換聯絡詢價
查看資料表 →5CGXFC7C6F23C7N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
5CGXBC9C6F23C7N 最大額定值與電氣特性
| Family | Cyclone V GX |
| Series | 5CGXBC9 (9-series, 6 transceivers) |
| Logic Elements | 301,000 |
| Embedded Memory | 13,917 Kbit |
| Number of GPIO | 224 |
| Number of Transceivers | 6 |
| Transceiver Data Rate | 3.125 Gbps |
| Core Supply Voltage | 1.13 V (typ) |
| Process Technology | TSMC 28 nm low-power |
| Maximum Operating Frequency | 800 MHz |
| 封裝 | 484-ball FBGA (F23, 23x23 mm) |
| 工作溫度 | 0 °C to +85 °C (commercial, suffix 7) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
| Tape & Reel Quantity | 60 (per FindIC) |
| 記憶體類型 | SRAM-based configuration |
5CGXBC9C6F23C7N 484-ball fbga (f23, 23x23 mm) 腳位配置指南
5CGXBC9C6F23C7N（484-ball fbga (f23, 23x23 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 5CGXBC9C6F23C7N.
請參閱 資料表 以查看完整腳位配置。
典型應用
5CGXBC9C6F23C7N 適用於 6 應用s: Industrial Machine Vision, Video Surveillance NVR/DVR, Wireless Small-Cell Backhaul, Industrial Motor Control Drives, PCIe Endpoint Add-In Cards, Broadcast Video Processing.
Industrial Machine Vision
The 5CGXBC9C6F23C7N fits industrial machine vision pipelines where its 301K logic elements host real-time image preprocessing (debayering, color correction, edge detection) and its six 3.125 Gbps transceivers drive MIPI-CSI-2 to GigE Vision bridge conversion. With 13,917 Kbit embedded memory, frame buffers fit on-chip without external SRAM, reducing BOM cost and latency. The 484-FBGA footprint dissipates up to 5W at 100% utilization; design with at least 4 signal layers and a 60 mm x 60 mm copper pour beneath the BGA to keep junction below 85 °C.
推薦
Video Surveillance NVR/DVR
For multi-channel HD/4K video recording, the 5CGXBC9C6F23C7N delivers H.264/H.265 transcode acceleration across 224 GPIO handling camera inputs plus the six transceivers driving SATA III storage links at 6 Gbps. Compared to the GT variant, this GX part saves cost while still supporting SATA PHY directly. With PCIe Gen2 hard IP, the device also serves as a downstream endpoint to an application processor SoC via x4 link. Use Intel's Video and Image Processing (VIP) Suite IP cores to achieve 4K@30 fps decode in roughly 50% of the 301K LE.
推薦
Wireless Small-Cell Backhaul
The 5CGXBC9C6F23C7N integrates six 3.125 Gbps transceivers that natively drive CPRI, OBSAI, and Serial RapidIO for small-cell radio units, eliminating an external PHY and reducing board area by approximately 30%. At 301K LE, the device can host PHY layer baseband functions plus up to two LTE 20 MHz carriers. The 28 nm low-power process keeps total power around 3-4W typical, suitable for fanless outdoor enclosures. Use the device's hard PCIe Gen2 IP for the backhaul SGMII-to-SoC link.
推薦
Industrial Motor Control Drives
The 5CGXBC9C6F23C7N's 224 GPIO connect to industrial field buses (EtherCAT, PROFINET) plus resolver/PWM motor control channels, while its 6 transceivers drive RS-485/RS-232 isolation stages. With 13,917 Kbit embedded memory and 800 MHz DSP blocks, the device implements field-oriented control (FOC) loops in under 4 µs latency for industrial drives up to 50 kW. The -40 to +85 °C commercial range suits cabinet-mounted installations. For outdoor or extreme-temp installations, choose the 5CGXBC9C6F23I7N variant.
推薦
PCIe Endpoint Add-In Cards
The integrated PCIe Gen2 hard IP block makes the 5CGXBC9C6F23C7N an ideal endpoint controller for instrumentation and data acquisition cards, delivering up to 5 Gbps per lane over x4 links. The 301K LE host custom protocol logic, data path FIFO buffers (13,917 Kbit), and DMA engines without consuming soft logic. Combined with six transceivers, one design can host PCIe plus dual 10 GbE KR signalling on the same silicon, reducing PCB layer count from 10 to 8.
推薦
Broadcast Video Processing
Broadcast studios use the 5CGXBC9C6F23C7N for SDI-to-IP gateway conversion where the six transceivers drive SMPTE 2022-6/2110 IP packets at 3 Gbps SDI rates without external PHY. The 224 GPIO connect to HDMI, DisplayPort, and audio codec companion chips. With 301K LE, multiple 1080p60 video channels are processed concurrently with under 100 µs latency. The 28 nm low-power process suits fanless rack-mount units. The 484-FBGA thermal dissipation is suitable for 1U chassis with linear airflow.
推薦
推薦產品摘要
工程參考資料，適用於 5CGXBC9C6F23C7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 5CGXBC9C6F23C8N | 5CGXBC9C6F23I7N | 5CGXBC9A7U19C8N | 5CGXBC7C6F23C7N | 5CGXFC7C6F23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F23, 23x23 mm) | 484-FBGA (F23, 23x23 mm) - same | 484-FBGA (F23, 23x23 mm) - same | 484-UBGA (U19, 19x19 mm) - smaller | 484-FBGA (F23, 23x23 mm) - same | 484-FBGA (F23, 23x23 mm) - same |
| Logic Elements | 301,000 | 301,000 (same die) | 301,000 (same die) | 301,000 (same die) | 149,500 (-50%) | 149,500 (-50%) |
| Transceivers | 6 x 3.125 Gbps | 6 x 3.125 Gbps (same) | 6 x 3.125 Gbps (same) | 6 x 3.125 Gbps (same) | 6 x 3.125 Gbps (same) | 6 x 3.125 Gbps (same) |
| Embedded Memory | 13,917 Kbit | 13,917 Kbit (same) | 13,917 Kbit (same) | 13,917 Kbit (same) | 7,860 Kbit (-43%) | 7,860 Kbit (-43%) |
| GPIO | 224 | 224 (same) | 224 (same) | 224 (same) | 224 (same) | 224 (same) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| Speed Grade | C7 | C8 (faster) | C7 | C8 | C7 | C7 |
| Hardened PCIe Gen2 | Yes | Yes | Yes | Yes | Yes | Yes |
| Estimated Unit Price (qty-1000) | $334.20 | $420-$460 | $410-$450 | $390-$430 | $135-$155 | $170-$195 |
主要差異化特點
- Highest density (301K LE) at 3.125 Gbps in a single F23 484-FBGA package (對比5CGXBC7C6F23C7N)
- Commercial temperature variant for cost-sensitive indoor applications (對比5CGXBC9C6F23I7N)
- Hardened PCIe Gen2 IP block eliminates soft-logic consumption (對比Cyclone V E family (no transceivers, no PCIe IP))
- 28 nm TSMC low-power process yields ~40% lower power vs prior Cyclone IV (對比Cyclone IV E/GX family)
設計說明
Estimated: At 100% utilization with all six transceivers active at 3.125 Gbps, the 5CGXBC9C6F23C7N draws approximately 3.5-4.5W from the 1.13 V core rail. Use a switching regulator with at least 5 A peak current capability and a ferrite bead network at the BGA. Decoupling: at least twenty 0.1 µF 0402 X7R ceramic capacitors on the bottom side of the BGA, four 4.7 µF bulk capacitors within 25 mm, and one 220 µF polymer tantalum bulk capacitor at the regulator output. Refer to Intel's Cyclone V Device Handbook, Volume 1, Power Distribution Network Design Guidelines chapter.
The 484-FBGA with 1.0 mm ball pitch requires 6 PCB layers minimum for escape routing (top signal / GND / inner signals / VCC_1V13 / GND / bottom signal). Via-in-pad with 0.5 mm laser drill and filled-capped via process is strongly recommended for BGA balls B1-B19 (top row) to route out differential transceiver pairs. Use a 50 Ω controlled-impedance stack-up with 0.20 mm dielectric (Er ~3.8) between top signal and GND. Place 0402 series resistors for transceiver TX on the second signal layer, never as stubs. Refer to Intel AN 528: Cyclone V PCB Design Guidelines.
Estimated: At 4W total power dissipation and 23x23 mm FBGA package, the junction-to-ambient thermal resistance (θ_JA) is approximately 12 °C/W with a 4-layer FR-4 PCB and still air, giving a 48 °C temperature rise above ambient. For commercial 0-85 °C operation, ambient is limited to approximately 37 °C at 4W. To achieve the full 85 °C ambient rating, place a 50 mm x 50 mm x 8 mm aluminum heatsink with thermal interface material (TIM) above the BGA. For sealed enclosures, specify at least 1 m/s of forced airflow.
Each of the six transceivers requires matched-length differential routing within 0.127 mm (5 mil) intra-pair and 6.4 mm inter-pair for 3.125 Gbps operation. Maintain 100 Ω differential impedance with 0.20 mm trace/space on the top layer. Keep the transceiver lane AC-coupling capacitors (0.1 µF 0201 X7R) within 12.7 mm of the BGA ball. Series termination is internal to the FPGA; do not add external resistors in series. Verify signal integrity with a 3D EM solver for the chosen stack-up. Refer to Intel's Cyclone V GX Transceiver User Guide.
Do not assume all 224 GPIO are simultaneously usable: the C7 commercial variant typically supports 184-200 GPIO after subtracting transceiver lane balls and configuration pins. Always cross-check pin assignments against the latest Quartus pin planner file. The JTAG pins (TCK, TMS, TDI, TDO) require external 4.7 kΩ pull-down resistors on TCK and TMS and 4.7 kΩ pull-up on TDI. For the MSEL configuration pins, install a 10 kΩ resistor network per Intel's configuration scheme selection table to avoid mid-level voltages during power-up. Refer to Intel AN 472: Configuration Hardware Design Guidelines.
合規資訊
RoHS and REACH compliant per Intel/Altera product page. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For automotive applications, consider Cyclone V automotive grade variants (e.g., 5CGXBC9E6F27C7N) qualified to AEC-Q100.
