EP2SGX90EF1152I3 vs EP2SGX90EF1152C4N 比較
詳細並排比較 EP2SGX90EF1152I3 由 Intel 與 EP2SGX90EF1152C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ 最後購買機會規格比較
| 參數 | EP2SGX90EF1152I3 | EP2SGX90EF1152C4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 最後購買 |
| Series | Stratix II GX | — |
| Logic Elements | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 bits |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| RoHS 狀態 | Compliant | — |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 90,960 |
| LABs/CLBs | — | 4,548 |
| User I/O Count | — | 558 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage | — | 1.2 V |
| Process Node | — | 90 nm |
| Transceivers | — | Up to 20 channels, 6.375 Gbps per channel |
| Speed Grade | — | C4 |
| 工作溫度 | — | Commercial (0C to +85C) |
| 封裝 | — | 1152-BBGA / FC-FBGA-1152 |
| MSL 等級 | — | MSL-3 / MS-034AAR-1 (per package outline) |
| Lead-Free / RoHS | — | Lead free; RoHS compliance per JEDEC |