EP3C25F324I7N vs EP3C25F324C7N 比較

詳細並排比較 EP3C25F324I7N 由 Intel 與 EP3C25F324C7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3C25F324C7N EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N ✓ 啟用中

規格比較

參數 EP3C25F324I7N EP3C25F324C7N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone III —
Logic Elements (LEs) 24,624 —
Embedded Memory 608,256 bits (66 M9K blocks of 9 Kbits each) 608,256 bits
Embedded 18x18 Multipliers 66 —
Maximum User I/O Pins 215 —
LVDS Pairs 66 —
PLLs 4 —
Global Clock Networks 20 —
Process Technology 65 nm 65 nm
Core Voltage 1.2 V 1.2 V
I/O Bank Voltage Range 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) —
封裝 324-ball FBGA (Fine-Pitch BGA) 324-ball FBGA
工作溫度 -40C to +100C (Industrial) —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) —
Speed Grade 7 (slower speed grade, lower power) —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
Lead-Free Yes —
MSL 等級 3 (168 hours) —
Product Type — Field Programmable Gate Array (FPGA)
Device Family — Cyclone III
Logic Cells — 24,624 cells
Available I/O Pins — 215 I/O
Maximum Listed Frequency — 437.5 MHz
Terminal Count — 324 terminals
Terminal Form — Ball
Package Code — BGA
Package Shape — Rectangular
安裝類型 — Surface Mount
Temperature Grading — Other
Programmability — Field programmable
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

資料表與資源

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