EP3SE50F484C3G vs EP3SE50F484C2G 比較
詳細並排比較 EP3SE50F484C3G 由 Intel 與 EP3SE50F484C2G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE50F484C3G | EP3SE50F484C2G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 最後購買 |
| Family | Stratix III E | — |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | — |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| 封裝 | 484-ball FCBGA (F484), 1.0 mm pitch | — |
| Speed Grade | C3 | — |
| 工作溫度 | 0C to +85C (commercial, "C") | 0 °C to +85 °C (TJ) |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | Compliant (lead-free) | Compliant |
| Series | — | Stratix III E |
| Number of Logic Elements / Cells | — | 47,500 |
| Number of LABs / CLBs | — | 1,900 |
| Total RAM Bits | — | 5,760,000 (5,760 Kbit) |
| Number of User I/O | — | 296 |
| 封裝 / 外殼 | — | 484-BBGA, FCBGA (FineLine BGA) |
| Core Voltage Supply | — | 0.86 V to 1.15 V |
| Process Technology | — | 40 nm TSMC low-power CMOS |
| Logic Element Architecture | — | Adaptive Logic Module (ALM) with 8-input fracturable LUT |
| Embedded DSP Blocks | — | Yes (variable-precision multipliers) |
| Transceivers | — | Multi-gigabit transceivers (selected package pins) |
| Memory Interface Support | — | DDR / DDR2 / DDR3 with hard PHY |
| Partial Reconfiguration | — | Supported |
| Configuration Interface | — | JTAG, Passive Serial, Fast Passive Parallel |
| Part Status | — | Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy |