EP3SE50F780I3G vs EP3SE110F780I3N 比較
詳細並排比較 EP3SE50F780I3G 由 Intel 與 EP3SE110F780I3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N Nrnd規格比較
| 參數 | EP3SE50F780I3G | EP3SE110F780I3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | — |
| DSP Blocks | 264 (18x18 multipliers) | — |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | — |
| Core Voltage | 1.1 V | 1.1 V (range 1.05 V to 1.15 V) |
| Process Technology | TSMC 40 nm | 65 nm CMOS |
| 封裝 | 780-pin FC-FBGA (F780) 29x29 mm | 780-pin FC-FBGA (Flip-Chip FineLine BGA) |
| 工作溫度 | -40C to +100C (Industrial, I3) | -40 °C to +100 °C (Industrial, "I" grade) |
| Speed Grade | 3 | 3 (Fast) |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等級 | 3 | [DATA_NEEDED: MSL level] |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements | — | 107,500 |
| Logic Array Blocks (LABs) | — | 4,300 |
| Embedded Memory Bits | — | 8,936,448 (approximately 1.1 MB) |
| Maximum User I/Os | — | 488 |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) |
| Boundary-Scan Test | — | Yes, per IEEE Std. 1149.1 |
| PLLs | — | Yes, with global and regional clock networks |
| Supply Voltage Tolerance | — | 1.05 V to 1.15 V |