EP3SL70F484I3 vs EP3SL70F484C2 比較

詳細並排比較 EP3SL70F484I3 由 Intel 與 EP3SL70F484C2 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SL70F484I3 EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484I3 ⚠ 最後購買機會

規格比較

參數 EP3SL70F484I3 EP3SL70F484C2
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 NRND
Family Stratix III L Stratix III L FPGA
Logic Elements 67,500 67,500
Adaptive Logic Modules (ALMs) 33,000 —
Logic Array Blocks (LABs) 2,700 2,700
Total Embedded Memory 2,699,264 bits (337 KB) —
M9K Memory Blocks 288 —
M144K Memory Blocks 12 —
DSP Blocks (18x18 multipliers) 384 —
User I/O Pins 296 —
Transceivers Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] —
PLLs 8 (4 enhanced PLLs + 4 fast PLLs) —
Process Node TSMC 40 nm —
Speed Grade -3 (mid-tier) C2
工作溫度 -40C to +100C (industrial) 0C to +85C (Commercial)
封裝 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch —
Configuration Modes FPP, AS, PS, JTAG, AES encryption —
Design Software Quartus II (legacy) —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
Series — Stratix III L
Embedded Memory — 2,699,264 bits
User I/O Count — 296
Core Voltage — 1.1 V
Process Technology — 65 nm
Maximum Core Frequency — 600 MHz
Package Type — 484-ball FC-FBGA (FineLine BGA)
Package Pin Count — 484
安裝類型 — Surface Mount

資料表與資源

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