H5AN4G8NBJR-VKIR vs H5AN4G8NBJR-RDC 比較

詳細並排比較 H5AN4G8NBJR-VKIR 由 SK hynix 與 H5AN4G8NBJR-RDC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5AN4G8NBJR-VKIR H5AN4G8NBJR-VKIR - 4Gb DDR4 2666Mbps DRAM | SK hynix

H5AN4G8NBJR-VKIR - 4Gb DDR4 2666Mbps DRAM | SK hynix

H5AN4G8NBJR-VKIR ✓ 啟用中
SK hynix
H5AN4G8NBJR-RDC H5AN4G8NBJR-RDC - 4Gb DDR4 SDRAM x8 | SK hynix | Main Memory

H5AN4G8NBJR-RDC - 4Gb DDR4 SDRAM x8 | SK hynix | Main Memory

H5AN4G8NBJR-RDC ✓ 啟用中

規格比較

參數 H5AN4G8NBJR-VKIR H5AN4G8NBJR-RDC
品牌 SK hynix SK hynix
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM DDR4 SDRAM
Density 4 Gb 4 Gbit
組織 512M x 8 512M x 8
資料速率 2666 Mbps per pin [DATA_NEEDED: speed grade Mbps]
Supply Voltage (VDD) 1.2 V —
封裝 78-ball FBGA 78-ball FBGA
安裝類型 Surface Mount Surface Mount
Operating Temperature (Industrial) -40C to +85C (case) —
Extended Temperature Range +85C to +95C (case, per datasheet conditions) —
Technology CMOS DRAM —
Product Family H5AN4G4/6/8NBJR series —
Speed Grade Code -VKI —
Packing Suffix R (Tape & Reel) —
VPP Supply [DATA_NEEDED: VPP supply voltage] —
CAS 延遲 [DATA_NEEDED: CAS latency] —
Package Dimensions [DATA_NEEDED: package dimensions] —
Refresh [DATA_NEEDED: refresh interval specification] Auto-refresh and self-refresh
介面 — DDR4 (Double Data Rate IV)
供應電壓 — [DATA_NEEDED: VDD supply voltage]
Bank Architecture — 8 banks with 4 bank groups (x8)
Temperature Grade — [DATA_NEEDED: operating temperature range]
Termination — On-Die Termination (ODT)
RoHS 狀態 — Lead-Free & Halogen-Free (RoHS Compliant)
Process Technology — CMOS
Manufacturer — SK hynix
Family Series — H5AN4G4/8/6NBJR

資料表與資源

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