H5ANAG6NAMR-UHC vs H5ANAG6NCR-RDC 比較
詳細並排比較 H5ANAG6NAMR-UHC 由 SK hynix 與 H5ANAG6NCR-RDC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | H5ANAG6NAMR-UHC | H5ANAG6NCR-RDC |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Memory Density | 16 Gbit (2 GB) | — |
| 組織 | 1G x 16 | 1G x 16 |
| Speed Grade / Data Rate | DDR4-2400 (UHC bin, PC4-19200) | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Architecture | CMOS DDR4 with bank groups | — |
| Power Class | Normal Power | — |
| 封裝 | FBGA-96 (PBGA96) | 96-ball FBGA |
| 安裝類型 | Surface Mount (BGA solder ball) | Surface Mount |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature Range] |
| Refresh | Self-refresh and auto-refresh (DDR4 standard 64 ms) | — |
| CAS 延遲 | [DATA_NEEDED: CL for UHC bin] | — |
| 介面類型 | Parallel, synchronous, double data rate | — |
| Available Speed Bins (family) | PB / RD / TF / UH / VK | — |
| Application Class | Main memory, embedded, industrial | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| 生命週期狀態 | Active production | — |
| 記憶體容量 | — | 16 Gb (2 GB) |
| 資料速率 | — | 3200 Mbps (PC4-25600 class) |
| Package Body | — | Rectangular, 8 mm width |
| Maximum Standby Current | — | 0.074 A |
| Number of Terminals (Balls) | — | 96 |
| Auto Self-Refresh | — | Yes |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| Data Mask (DM) Function | — | Yes |
| Dynamic On-Chip Termination (ODT) | — | Yes |
| ZQ Calibration | — | Yes |
| CRC Function | — | Yes |
| Write Leveling | — | Yes |
| Refresh Interval | — | [DATA_NEEDED: Refresh Interval] |