K4A4G165WD-BCRC vs K4A4G165WF-BCRC 比較
詳細並排比較 K4A4G165WD-BCRC 由 Samsung Electronics 與 K4A4G165WF-BCRC 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K4A4G165WF-BCRC - 4Gb DDR4-2400 SDRAM | Samsung Electronics
K4A4G165WF-BCRC ✓ 啟用中規格比較
| 參數 | K4A4G165WD-BCRC | K4A4G165WF-BCRC |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | DRAM |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 單價 (USD) | — | $17.08 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | 4 Gb |
| 組織 | 256M x 16 | 256M x 16 |
| Speed Bin | DDR4-2400 (BCRC) | — |
| 供應電壓 | 1.2 V | 1.2 V |
| 封裝 | FBGA-96 | FBGA-96 (TFBGA) |
| 安裝類型 | Surface Mount | Surface Mount |
| Process Generation | Samsung D-die | — |
| 介面類型 | DDR4 (double data rate, parallel) | — |
| On-Die Termination (ODT) | Yes | — |
| Data Mask Function | Yes | — |
| Auto Precharge | Yes | Supported |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | Supported |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | 0C to +95C |
| RoHS 狀態 | Lead free / RoHS Compliant | Compliant |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Speed Grade | — | DDR4-2400 |
| Operating Voltage Range | — | 1.14 V to 1.26 V |
| Die Type | — | Samsung 4Gb F-die |
| Bank / Bank Group Architecture | — | 8 banks, bank groups |
| Data Mask | — | Supported (DM) |
| CRC / CA Parity | — | Supported |
| Dynamic ODT | — | Supported |
| Asynchronous Reset | — | Supported |