K4A8G085WB-BICR vs K4A8G085WB-BIRC 比較
詳細並排比較 K4A8G085WB-BICR 由 Samsung Electronics 與 K4A8G085WB-BIRC 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K4A8G085WB-BICR - Samsung 8Gb DDR4 1Gx8 2400Mbps Industrial
K4A8G085WB-BICR ✓ 啟用中
規格比較
| 參數 | K4A8G085WB-BICR | K4A8G085WB-BIRC |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 庫存狀態 | — | In Stock |
| 單價 (USD) | — | $6.56 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gb |
| 組織 | 1G x 8 | 1G x 8 |
| 資料速率 | 2400 Mbps | 2400 Mbps |
| 供應電壓 | 1.2 V (VDD/VDDQ) | 1.2 V |
| Number of Banks | 16 | — |
| Refresh Cycles | 8192 | 8192 |
| 封裝 | 78-ball FBGA | 78-FBGA |
| 腳位數 | 78 | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Temperature Grade | Industrial (I-grade) | — |
| 工作溫度範圍 | [DATA_NEEDED: exact temperature range for BICR industrial suffix] | — |
| Die / Process | Samsung 8Gb B-die DDR4 | — |
| Speed Grade | DDR4-2400 (PC4-19200) | — |
| RoHS 狀態 | Compliant | — |
| Lead-Free | Yes | — |
| Refresh Management | Row refresh, auto-refresh and self-refresh supported | — |
| 工作溫度 | — | -40°C to 95°C |
| Number of Terminals | — | 78 |
| Die Family | — | B-die |
| CAS 延遲 | — | [DATA_NEEDED: CAS Latency] |
| Burst Length | — | 8, 16 |
| 介面 | — | SSTL-12 |
| RoHS | — | Compliant |