K4A8G085WC-BCPB vs K4A8G085WC-BCRC 比較
詳細並排比較 K4A8G085WC-BCPB 由 Samsung Electronics 與 K4A8G085WC-BCRC 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4A8G085WC-BCPB | K4A8G085WC-BCRC |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | DRAM | DRAM |
| 生命週期狀態 | 停產終止 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gbit |
| 組織 | 1G x 8 | 1G x 8 |
| 資料速率 | 2133 Mbps | 2400 Mbps (DDR4-2400) |
| 供應電壓 | 1.2 V | 1.2 V |
| 工作溫度 | 0 C to +85 C | 0C to +95C |
| 封裝 | 78FBGA | 78-ball FBGA (TFBGA) |
| Number of Terminals | 78 | — |
| Maximum Seated Height | 1.2 mm | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Speed Grade | DDR4-2133 | — |
| 功能特色 | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask | — |
| Refresh | [DATA_NEEDED: refresh rate 1x/2x] | Auto/Self refresh |
| CAS 延遲 | [DATA_NEEDED: CAS latency] | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| Die Revision | [DATA_NEEDED: die revision] | — |
| Standard Package Quantity | [DATA_NEEDED: standard package quantity] | — |
| Terminal Pitch | — | 0.8 mm |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic On-Die Termination | — | Yes |
| Data Mask Function | — | Yes |