K4A8G085WC-BCRC vs K4A8G085WC-BCPB 比較
詳細並排比較 K4A8G085WC-BCRC 由 Samsung Electronics 與 K4A8G085WC-BCPB 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4A8G085WC-BCRC | K4A8G085WC-BCPB |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | DRAM | DRAM |
| 生命週期狀態 | 啟用中 | 停產終止 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gb |
| 組織 | 1G x 8 | 1G x 8 |
| 供應電壓 | 1.2 V | 1.2 V |
| 資料速率 | 2400 Mbps (DDR4-2400) | 2133 Mbps |
| 封裝 | 78-ball FBGA (TFBGA) | 78FBGA |
| Terminal Pitch | 0.8 mm | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | 0C to +95C | 0 C to +85 C |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| Dynamic On-Die Termination | Yes | — |
| Data Mask Function | Yes | — |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS status] |
| Refresh | Auto/Self refresh | [DATA_NEEDED: refresh rate 1x/2x] |
| Number of Terminals | — | 78 |
| Maximum Seated Height | — | 1.2 mm |
| Speed Grade | — | DDR4-2133 |
| 功能特色 | — | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask |
| CAS 延遲 | — | [DATA_NEEDED: CAS latency] |
| Die Revision | — | [DATA_NEEDED: die revision] |
| Standard Package Quantity | — | [DATA_NEEDED: standard package quantity] |