K4A8G165WC-BCPB vs K4A8G165WC-BCRC 比較
詳細並排比較 K4A8G165WC-BCPB 由 Samsung Electronics 與 K4A8G165WC-BCRC 由 Samsung Electro-Mechanics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electro-Mechanics
K4A8G165WC-BCRC - 8Gb DDR4 SDRAM 2400Mbps x16 | Samsung
K4A8G165WC-BCRC ✓ 啟用中規格比較
| 參數 | K4A8G165WC-BCPB | K4A8G165WC-BCRC |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electro-Mechanics |
| 類別 | Memory ICs | EEPROM |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 庫存狀態 | — | In Stock |
| 單價 (USD) | — | $19.69 |
| 記憶體類型 | DDR4 SDRAM (volatile DRAM) | DDR4 SDRAM |
| 記憶體容量 | 8 Gb | 8 Gbit |
| Memory Organization | 512M x 16 | — |
| 資料速率 | DDR4-2133 (2133 Mbps/pin) | 2400 Mbps |
| 供應電壓 | 1.2 V | 1.2 V (1.14 V to 1.26 V) |
| Operating Voltage Range | 1.14 V to 1.26 V | — |
| 介面 | DDR4 (16-bit data bus) | Parallel, 16-bit DDR |
| 封裝 | 96-ball FBGA (TFBGA) | 96-FBGA (TFBGA) |
| Die Generation | C-die (1Y nm class) | C-die |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | 0C to +95C | 0 C to +95 C |
| 功能特色 | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask |
| Termination | On-die termination (ODT), dynamic | — |
| MSL 等級 | [DATA_NEEDED: MSL Level] | — |
| RoHS 狀態 | Compliant | Compliant |
| Standard | JEDEC DDR4 SDRAM | — |
| 組織 | — | 512M x 16 |
| Clock Frequency | — | 1333 MHz |
| Standby Current (Idle) | — | 2 mA |
| Operating Current | — | 64 mA |
| Memory Format | — | DRAM |