K4AAG085WA-BCWE vs K4AAG085WM-BCRC 比較

詳細並排比較 K4AAG085WA-BCWE 由 Samsung Electronics 與 K4AAG085WM-BCRC 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K4AAG085WA-BCWE K4AAG085WA-BCWE - 16Gb DDR4-3200 SDRAM 1.2V | Samsung

K4AAG085WA-BCWE - 16Gb DDR4-3200 SDRAM 1.2V | Samsung

K4AAG085WA-BCWE ✓ 啟用中
Samsung Electronics
K4AAG085WM-BCRC K4AAG085WM-BCRC - 32Gb DDR4 SDRAM x8 1.2V | Samsung

K4AAG085WM-BCRC - 32Gb DDR4 SDRAM x8 1.2V | Samsung

K4AAG085WM-BCRC ✓ 啟用中

規格比較

參數 K4AAG085WA-BCWE K4AAG085WM-BCRC
品牌 Samsung Electronics Samsung Electronics
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM DDR4 SDRAM
Density 16 Gbit [DATA_NEEDED: exact density in Gb]
組織 2G x 8 x8
資料速率 3200 Mbps (DDR4-3200) —
供應電壓 1.2 V —
Operating Voltage Range 1.14 V to 1.26 V —
工作溫度 0 C to 85 C [DATA_NEEDED: operating temperature range]
封裝 78-ball FBGA (9 x 11 mm, 0.8 mm pitch) 78-ball FBGA
安裝類型 Surface Mount Surface Mount
介面 JEDEC DDR4 SSTL12
Memory Width 8-bit —
Refresh Auto-refresh (per JEDEC DDR4) —
Application Class Main memory / embedded DRAM —
RoHS 狀態 Compliant (per JLCPCB listing) [DATA_NEEDED: RoHS status]
Manufacturer Samsung Electronics —
Supply Voltage (VDD) — 1.2 V
I/O Voltage (VDDQ) — 1.2 V
Max Data Rate — Up to 3200 Mbps/pin (family max per Samsung DDR4 page)
Architecture — Bank-group DDR4
Termination — On-Die Termination (ODT)
CAS 延遲 — [DATA_NEEDED: CL of -BCRC speed grade]
Clock — Differential clock CK/CK#
MSL 等級 — [DATA_NEEDED: moisture sensitivity level]

資料表與資源

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