K4AAG165WA-BCRC vs H5ANAG8NAMR-UHC 比較

詳細並排比較 K4AAG165WA-BCRC 由 Samsung Electronics 與 H5ANAG8NAMR-UHC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K4AAG165WA-BCRC K4AAG165WA-BCRC - 16Gb DDR4 SDRAM, FBGA-96 | Samsung | DRAM

K4AAG165WA-BCRC - 16Gb DDR4 SDRAM, FBGA-96 | Samsung | DRAM

K4AAG165WA-BCRC ✓ 啟用中
SK hynix
H5ANAG8NAMR-UHC H5ANAG8NAMR-UHC - 16Gb DDR4-2400 SDRAM 2Gx8 | SK Hynix

H5ANAG8NAMR-UHC - 16Gb DDR4-2400 SDRAM 2Gx8 | SK Hynix

H5ANAG8NAMR-UHC ✓ 啟用中

規格比較

參數 K4AAG165WA-BCRC H5ANAG8NAMR-UHC
品牌 Samsung Electronics SK hynix
類別 DRAM Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM (Volatile DRAM) DDR4 SDRAM
記憶體容量 16 Gb (2 GB) —
Memory Organization 1G x 16 —
Memory Interface DDR4 SDRAM Interface —
供應電壓 1.2 V 1.2 V
資料速率 up to 3200 Mbps per pin (family); [DATA_NEEDED: BCRC speed grade rating] DDR4-2400 (2400 MT/s)
Technology DDR4 —
封裝 FBGA-96 (96-ball Fine-Pitch Ball Grid Array) FBGA-78
安裝類型 Surface Mount Surface Mount
工作溫度 [DATA_NEEDED: BCRC temperature range; family BCWE rated -40C to +95C] [DATA_NEEDED: operating temperature range]
Speed Grade Suffix -BCRC —
Datasheet Samsung K4AAG165WA DDR4 SDRAM Memory, 23 pages —
Packaging Status [DATA_NEEDED: tray/reel standard quantity] —
Clock Frequency [DATA_NEEDED: BCRC clock frequency] —
Memory Format DRAM —
RoHS 狀態 unknown Compliant (lead-free FBGA package)
Manufacturer — SK Hynix
Density — 16 Gbit
組織 — 2G x 8
介面 — Parallel, DDR4
Bank Group Architecture — DDR4 bank-group architecture
On-Die Termination (ODT) — Yes
Refresh — Self-refresh and auto-refresh (DDR4)
MSL 等級 — [DATA_NEEDED: moisture sensitivity level]
Applications — Data storage, firmware boot, industrial controllers, computing modules

資料表與資源

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