K4AAG165WM-BCWE vs K4AAG165WA-BCWE 比較
詳細並排比較 K4AAG165WM-BCWE 由 Samsung Electronics 與 K4AAG165WA-BCWE 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4AAG165WM-BCWE | K4AAG165WA-BCWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | DRAM | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | — |
| 組織 | 256M x 16 (1G x 16) | — |
| 資料速率 | 3200 Mbps | 3200 Mbps (DDR4-3200) |
| 介面 | Parallel (DDR4) | — |
| Supply Voltage VDD | 1.2 V | — |
| Supply Voltage VDDQ | 1.2 V | — |
| Access Time (Clock Cycle Time) | [DATA_NEEDED: tCK for BCWE bin] | — |
| CAS 延遲 | [DATA_NEEDED: CL at 3200 Mbps] | — |
| Bank Groups | 4 (x16 configuration) | — |
| Burst Length | 8 | — |
| 封裝 | 78-ball FBGA | 96-ball FBGA |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | [DATA_NEEDED: temperature range for WM-BCWE] | -40C to +95C |
| Die Revision | W (WM suffix) | — |
| RoHS 狀態 | Compliant | Compliant |
| Operating Frequency | 1600 MHz (DDR, 3200 Mbps) | — |
| 記憶體容量 | — | 16 Gb (2 GB) |
| Memory Organization | — | 1G x 16 |
| 供應電壓 | — | 1.2 V |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| 介面類型 | — | Parallel, DDR4 |
| Memory Format | — | DRAM (Volatile) |
| Technology | — | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Packaging | — | Tray |
| Product Status | — | Active |