K4RHE086VP vs K4RHE165VB-BCWM 比較
詳細並排比較 K4RHE086VP 由 Samsung Electronics 與 K4RHE165VB-BCWM 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4RHE086VP | K4RHE165VB-BCWM |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | DDR5 | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR5 SDRAM | DDR5 SDRAM |
| Density | 24 Gb | 24 Gb |
| 組織 | x8 | 1G x 16 |
| Process Node | 1a-class (D1a) | — |
| Package Type | FBGA | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 介面類型 | DDR5 (double data rate 5) | — |
| Maximum Data Rate | [DATA_NEEDED: speed bin data rate] | — |
| Supply Voltage (VDD) | [DATA_NEEDED: VDD in V] | — |
| On-Die ECC | Yes (DDR5 standard feature) | — |
| Bank Groups | [DATA_NEEDED: bank group count] | — |
| 工作溫度範圍 | [DATA_NEEDED: temperature range] | — |
| 品牌 | Samsung Electronics | — |
| Product Family | Samsung K4RHE DDR5 series | — |
| Typical Application | Server / client DRAM modules | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| 資料速率 | — | 5600 Mbps |
| 供應電壓 | — | 1.1 V |
| 封裝 | — | 106 FBGA |
| 工作溫度 | — | 0 C to +85 C |
| Product Status | — | Mass Production |
| 介面 | — | Parallel, DDR5 |
| Generation | — | DDR5 |
| Application Segment | — | DDR5 memory modules and HPC systems |
| Speed Grade Suffix | — | BCWM |
| tCK (Clock Period) | — | [DATA_NEEDED: clock period] |
| CAS 延遲 | — | [DATA_NEEDED: CAS latency] |