K6X0808C1D-BF70 vs K6X0808C1D-GF70T00 比較

詳細並排比較 K6X0808C1D-BF70 由 Samsung Electronics 與 K6X0808C1D-GF70T00 由 Samsung Electro-Mechanics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K6X0808C1D-BF70 K6X0808C1D-BF70 - 32Kx8 70ns Async SRAM | Samsung

K6X0808C1D-BF70 - 32Kx8 70ns Async SRAM | Samsung

K6X0808C1D-BF70 ✗ 停產
Samsung Electro-Mechanics
K6X0808C1D-GF70T00 K6X0808C1D-GF70T00 - 256Kbit 32Kx8 Async SRAM 70ns | Samsung

K6X0808C1D-GF70T00 - 256Kbit 32Kx8 Async SRAM 70ns | Samsung

K6X0808C1D-GF70T00 ✓ 啟用中

規格比較

參數 K6X0808C1D-BF70 K6X0808C1D-GF70T00
品牌 Samsung Electronics Samsung Electro-Mechanics
類別 Memory ICs DRAM
生命週期狀態 停產終止 啟用中
記憶體類型 Asynchronous SRAM (CMOS) SRAM - Asynchronous
Density 256 Kbit —
組織 32K x 8 32K x 8
Access Time 70 ns 70 ns
介面 Parallel Parallel
Technology CMOS CMOS
封裝 28-SOP (PDSO28) 28-SOP
安裝類型 Surface Mount Surface Mount
供應電壓 [DATA_NEEDED: Supply Voltage] 5 V
Operating Current (active) [DATA_NEEDED: Operating Current] —
Standby Current (CMOS) [DATA_NEEDED: Standby Current] —
工作溫度 0C to +70C (commercial grade, BF suffix) [DATA_NEEDED: operating temperature range]
Control Signals CE, OE, WE CE, OE, WE
Data Retention Volatile (battery-backup capable with CE control) —
I/O Type Tri-state, common I/O (DQ0-DQ7) Common Data I/O, TTL compatible
RoHS 狀態 [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
Address Bus A0-A14 (15 address lines) —
記憶體容量 — 256 Kbit
Standby Current — [DATA_NEEDED: standby current]
Active Current — [DATA_NEEDED: active current]
Clock / Refresh — Fully static, no clock or refresh required
Packaging — Tape & Reel (T00 suffix)

資料表與資源

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