K9PDG08U5M vs K9MDG08U5M 比較

詳細並排比較 K9PDG08U5M 由 Samsung Electronics 與 K9MDG08U5M 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K9PDG08U5M K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M ✗ 停產
Samsung Electronics
K9MDG08U5M K9MDG08U5M - 16Gb x8 MLC NAND Flash TSOP1-48 | Samsung

K9MDG08U5M - 16Gb x8 MLC NAND Flash TSOP1-48 | Samsung

K9MDG08U5M ✓ 啟用中

規格比較

參數 K9PDG08U5M K9MDG08U5M
品牌 Samsung Electronics Samsung Electronics
類別 EEPROM Memory ICs
生命週期狀態 停產終止 啟用中
記憶體類型 NAND Flash (SLC) MLC Large Block NAND Flash
Density 4 Gbit 16 Gbit (2 GB)
組織 x8 (multiplexed I/O) 16G x 8 bit
供應電壓 [DATA_NEEDED: supply voltage range] —
封裝 TSOP1-48 48-pin TSOP1 dual stacked, 12 mm x 20 mm
安裝類型 Surface Mount Surface Mount
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: block size] [DATA_NEEDED: block size]
Page Read Time [DATA_NEEDED: page read time] —
Page Program Time [DATA_NEEDED: page program time] —
Block Erase Time [DATA_NEEDED: block erase time] —
Access Interface Asynchronous multiplexed address/data, CLE/ALE control —
Ready/Busy Output Yes (R/B, open-drain) —
Write Protect Pin Yes (/WP) —
工作溫度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Endurance [DATA_NEEDED: program/erase cycles] —
RoHS 狀態 [DATA_NEEDED: RoHS status] unknown
Cell Type — MLC (2 bits per cell)
Supply Voltage Min — 2.7 V
Supply Voltage Max — 3.6 V
介面 — Asynchronous x8 multiplexed address/data
Terminals — 48
Circuits — 1
Die Configuration — Dual stacked
Page Read Time (tR) — [DATA_NEEDED: tR]
Program Time (tPROG) — [DATA_NEEDED: tPROG]

資料表與資源

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