MC9S08AW60CFGE vs MC9S08GT60CFD 比較

詳細並排比較 MC9S08AW60CFGE 由 NXP Semiconductors 與 MC9S08GT60CFD 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S08AW60CFGE MC9S08AW60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AW60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AW60CFGE Nrnd
NXP Semiconductors
MC9S08GT60CFD MC9S08GT60CFD - 8-bit 40MHz S08 MCU 60KB Flash QFN48 | NXP

MC9S08GT60CFD - 8-bit 40MHz S08 MCU 60KB Flash QFN48 | NXP

MC9S08GT60CFD ✓ 啟用中

規格比較

參數 MC9S08AW60CFGE MC9S08GT60CFD
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND 啟用中
Core Processor S08 (HCS08) 8-bit CISC —
Core Size 8-Bit —
Maximum CPU Frequency 40 MHz 40 MHz
Internal Bus Frequency 20 MHz —
Flash Memory 60 KB (60K x 8) —
RAM Size [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) 4 KB (4K x 8)
Supply Voltage Range 2.7 V to 5.5 V —
I/O Count 38 general-purpose I/O —
ADC Resolution 10-bit, 8-channel —
Instruction Set HC08 instruction set with added BGND instruction —
Debug Interface Single-wire background debug mode (BDM) —
封裝 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 —
安裝類型 Surface Mount Surface Mount
Supply Voltage Nominal 3.3 V / 5 V —
工作溫度 [DATA_NEEDED: operating temperature range] —
Packaging Tray —
生命週期狀態 NRND (Not Recommended for New Designs) per NXP —
Family MC9S08AW (S08AW series) —
Manufacturer — NXP Semiconductors (formerly Freescale)
Part Family — HCS08 S08GT Series
Core Architecture — HCS08 (8-bit CISC)
Program Memory Size — 60 KB (60K x 8) Flash
Number of I/O Pins — 39
封裝 / 外殼 — 48-VFQFN Exposed Pad (48-QFN 7x7 mm)
工作電源電壓 — 2.5V / 3.3V
Number of Interrupts/Reset Sources — Up to 32
Tray Packaging — Tray (per FindIC listing)
Background Debug Mode — Yes (BGND instruction)
Internal Pullup — Yes (RESET and IRQ pins)
RoHS 狀態 — [DATA_NEEDED: RoHS compliance status]

資料表與資源

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