MPC8343ECZQAGDB vs MPC8343ECVRAGDB 比較
詳細並排比較 MPC8343ECZQAGDB 由 NXP Semiconductors 與 MPC8343ECVRAGDB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8343ECVRAGDB - PowerQUICC II Pro MPU, e300, 400MHz, 620-HBGA | NXP
MPC8343ECVRAGDB ✗ 停產規格比較
| 參數 | MPC8343ECZQAGDB | MPC8343ECVRAGDB |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 最後購買 | 停產終止 |
| Core Architecture | Power Architecture (e300), 32-bit | PowerPC e300 (32-bit) |
| Core Frequency | 400 MHz | 400 MHz |
| Instruction Set | PowerPC compliant | — |
| Process Technology | 0.13 μm CMOS | 0.13 um CMOS |
| Operating Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Memory Controller | DDR1 / DDR2 with ECC | DDR1 / DDR2 (32-bit, with ECC) |
| Ethernet | 1 x 10/100/1000 MAC (GbE) | 1 Gbit (10/100/1000) |
| PCI Interface | 32-bit, 66 MHz | PCI 2.3, 32-bit, 66 MHz |
| USB | USB 2.0 full-speed host/device | USB 2.0 (Full/High Speed) |
| Security Engine | SEC 2.0 (IPsec/SSL acceleration) | SEC (DES/3DES/AES/SHA/RSA/RNG) |
| DMA Channels | 4 | — |
| 封裝 | 620-PBGA (29 x 29 mm) | 620-HBGA (29x29 mm) |
| 工作溫度 | -40 °C to +105 °C (industrial) | -40 C to +105 C |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 狀態 | Compliant per NXP product page | Compliant |
| Number of Cores | — | 1 |
| 供應電壓 | — | 1.8 V / 2.5 V / 3.3 V |
| L1 Cache | — | 16 KB instruction / 16 KB data |
| L2 Cache | — | External (cache controller integrated) |
| MSL 等級 | — | [DATA_NEEDED: MSL Level] |