MPXC2011DT1 vs MPX10DP 比較
詳細並排比較 MPXC2011DT1 由 NXP Semiconductors 與 MPX10DP 由 STMicroelectronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
STMicroelectronics
MPX10DP - 10kPa Differential Pressure Sensor 35mV | STMicroelectronics
MPX10DP ✓ 啟用中規格比較
| 參數 | MPXC2011DT1 | MPX10DP |
|---|---|---|
| 品牌 | NXP Semiconductors | STMicroelectronics |
| 類別 | Pressure Sensors | Pressure Sensors |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Full-Scale Output | 25 mV typical at 10 V excitation | — |
| Sensitivity | 2.5 mV/kPa typical | — |
| Excitation Voltage | 3 V DC to 10 V DC (10 V nominal) | — |
| 輸出類型 | Analog Wheatstone bridge (ratiometric) | Analog Wheatstone bridge (uncompensated) |
| 封裝 | 4-SSIP Chip Pak module, side port | — |
| Port Style | Female, 3.25 mm (0.128 in) barbed side port | — |
| Termination Style | Through-hole PCB, 4 leads | — |
| 工作溫度 | 0 °C to +85 °C | [DATA_NEEDED: operating temperature range] |
| Compensation | On-chip temperature compensated and calibrated | — |
| Technology | Piezoresistive silicon strain gauge | — |
| Module Dimensions | 7.6 mm x 12.8 mm nominal | — |
| 安裝類型 | Through-hole (PCB mount with side-port tubing) | Through-Hole |
| RoHS 狀態 | [DATA_NEEDED: RoHS status not in web data] | [DATA_NEEDED: RoHS status] |
| Maximum Overload Pressure | — | [DATA_NEEDED: maximum overload pressure] |
| Output Voltage Span | — | 0 mV to 35 mV at 3 V excitation |
| Supply Voltage (Excitation) | — | 3 V DC typical |
| Port Configuration | — | Dual male 0.19 in (4.93 mm) tube, axial |
| 封裝 / 外殼 | — | 4-SIP Module |
| Bridge Impedance | — | [DATA_NEEDED: input/output bridge resistance] |
| Linearity | — | [DATA_NEEDED: linearity %FS] |
| Temperature Compensation | — | None (uncompensated) |
| Media Compatibility | — | Dry gases (non-corrosive) |