MRF8S21200HSR6 vs MRF7S19120NR1 比較

詳細並排比較 MRF8S21200HSR6 由 NXP Semiconductors 與 MRF7S19120NR1 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MRF8S21200HSR6 MRF8S21200HSR6 - 48W RF Power LDMOS, 2110-2170 MHz | NXP

MRF8S21200HSR6 - 48W RF Power LDMOS, 2110-2170 MHz | NXP

MRF8S21200HSR6 ✓ 啟用中
NXP Semiconductors
MRF7S19120NR1 MRF7S19120NR1 - 36W RF Power LDMOS, 1930-1990 MHz | NXP

MRF7S19120NR1 - 36W RF Power LDMOS, 1930-1990 MHz | NXP

MRF7S19120NR1 ✓ 啟用中

規格比較

參數 MRF8S21200HSR6 MRF7S19120NR1
品牌 NXP Semiconductors NXP Semiconductors
類別 MOSFETs MOSFETs
生命週期狀態 啟用中 啟用中
電晶體類型 LDMOS, Dual N-Channel, Enhancement-Mode Lateral MOSFET LDMOS, N-Channel Enhancement-Mode Lateral
Frequency Band 2110 MHz to 2170 MHz —
Output Power (Avg, W-CDMA/LTE) 48 W at 28 V —
Power Gain 18.1 dB —
Test Voltage 28 V —
Test Current (Quiescent) 1.4 A —
Minimum Breakdown Voltage (Drain-Source) 65 V —
Maximum Junction Temperature 225 C —
Mounting Configuration Surface Mount (NI-1230HS ceramic package) —
Application Class Class AB, Class C (cellular base station modulation) —
Peak Reflow Temperature 260 C —
Number of Elements / Configuration Dual, Common Source, 2 Elements —
Lead Free Status Lead Free Lead Free per datasheet
Technology Silicon LDMOS (lateral double-diffused MOSFET) RF Power MOSFET (Gen7 HV8 LDMOS)
Target Modulation W-CDMA, LTE, TD-LTE W-CDMA, CDMA, multi-carrier GSM
Frequency Range — 1930 MHz to 1990 MHz
Output Power (Avg, W-CDMA) — 36 W
Drain-Source Voltage (Vds max) — 65 V (rated)
Test Supply Voltage (Vdd) — 28 V
Test Quiescent Current (Idq) — 1.2 A
Power Gain (typ) — 18 dB at 1.99 GHz
Operating Class — Class AB, Class C
封裝 — TO-270 WB-4 (overmolded plastic, 4-lead)
安裝方式 — Surface Mount / Flange Mount
腳位數 — 5 (per Freescale/NXP datasheet)
Application — CDMA / W-CDMA base station final-stage PA

資料表與資源

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