MRF8S21200HSR6 vs MRF8S21200HR6 比較

詳細並排比較 MRF8S21200HSR6 由 NXP Semiconductors 與 MRF8S21200HR6 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MRF8S21200HSR6 MRF8S21200HSR6 - 48W RF Power LDMOS, 2110-2170 MHz | NXP

MRF8S21200HSR6 - 48W RF Power LDMOS, 2110-2170 MHz | NXP

MRF8S21200HSR6 ✓ 啟用中
NXP Semiconductors
MRF8S21200HR6 MRF8S21200HR6 - 48W RF Power LDMOS MOSFET | NXP | LTE Base Station

MRF8S21200HR6 - 48W RF Power LDMOS MOSFET | NXP | LTE Base Station

MRF8S21200HR6 ✓ 啟用中

規格比較

參數 MRF8S21200HSR6 MRF8S21200HR6
品牌 NXP Semiconductors NXP Semiconductors
類別 MOSFETs MOSFETs
生命週期狀態 啟用中 啟用中
電晶體類型 LDMOS, Dual N-Channel, Enhancement-Mode Lateral MOSFET LDMOS (Dual), N-Channel Enhancement-Mode Lateral MOSFET
Frequency Band 2110 MHz to 2170 MHz —
Output Power (Avg, W-CDMA/LTE) 48 W at 28 V —
Power Gain 18.1 dB 18.1 dB
Test Voltage 28 V 28 V
Test Current (Quiescent) 1.4 A —
Minimum Breakdown Voltage (Drain-Source) 65 V —
Maximum Junction Temperature 225 C —
Mounting Configuration Surface Mount (NI-1230HS ceramic package) —
Application Class Class AB, Class C (cellular base station modulation) —
Peak Reflow Temperature 260 C —
Number of Elements / Configuration Dual, Common Source, 2 Elements —
Lead Free Status Lead Free —
Technology Silicon LDMOS (lateral double-diffused MOSFET) —
Target Modulation W-CDMA, LTE, TD-LTE —
Frequency — 2.11 GHz to 2.17 GHz (2110-2170 MHz)
Test Current — 1.4 A
Output Power (Average) — 48 W
Drain-Source Voltage (Max) — 65 V
Configuration — Common Source, 2 elements
Case Connection — Source
安裝類型 — Surface Mount (NI-1230 ceramic flange)
封裝 — NI-1230
Application — W-CDMA, LTE base station power amplifiers
Class of Operation — Class AB, Class C
Surface Mount — Yes
RoHS 狀態 — Compliant

資料表與資源

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