MT40A512M8RH-083E vs H5AN4G8NBJR-RDC 比較

詳細並排比較 MT40A512M8RH-083E 由 Micron Technology 與 H5AN4G8NBJR-RDC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Micron Technology
MT40A512M8RH-083E MT40A512M8RH-083E - 4Gb DDR4 512Mx8 2400MHz | Micron

MT40A512M8RH-083E - 4Gb DDR4 512Mx8 2400MHz | Micron

MT40A512M8RH-083E ✓ 啟用中
SK hynix
H5AN4G8NBJR-RDC H5AN4G8NBJR-RDC - 4Gb DDR4 SDRAM x8 | SK hynix | Main Memory

H5AN4G8NBJR-RDC - 4Gb DDR4 SDRAM x8 | SK hynix | Main Memory

H5AN4G8NBJR-RDC ✓ 啟用中

規格比較

參數 MT40A512M8RH-083E H5AN4G8NBJR-RDC
品牌 Micron Technology SK hynix
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM DDR4 SDRAM
Density 4 Gbit 4 Gbit
組織 512M x 8 512M x 8
Industry Speed Grade DDR4-2400 —
Clock Rate 1.2 GHz —
Internal Banks 8 banks (2 groups of 4) —
Prefetch 8n-bit —
Refresh 64 ms, 8192-cycle refresh (to 95C) Auto-refresh and self-refresh
VDD / VDDQ 1.2 V +/-60 mV —
VPP 2.5 V, -125 mV/+250 mV —
I/O Structure 1.2 V pseudo open-drain —
VREFDQ On-die internal, adjustable generation —
工作溫度 0C to +95C —
封裝 78-ball FBGA (9 x 10.5 mm) 78-ball FBGA
FBGA Code D9TGG —
Marking Code D9TGG —
Data Strobe Preamble Programmable —
RoHS 狀態 Compliant Lead-Free & Halogen-Free (RoHS Compliant)
CAS 延遲 [DATA_NEEDED: CAS latency per speed bin table] —
介面 — DDR4 (Double Data Rate IV)
安裝類型 — Surface Mount
供應電壓 — [DATA_NEEDED: VDD supply voltage]
資料速率 — [DATA_NEEDED: speed grade Mbps]
Bank Architecture — 8 banks with 4 bank groups (x8)
Temperature Grade — [DATA_NEEDED: operating temperature range]
Termination — On-Die Termination (ODT)
Process Technology — CMOS
Manufacturer — SK hynix
Family Series — H5AN4G4/8/6NBJR

資料表與資源

瀏覽所有產品 建立 BOM 索取報價