W9751G6KB-25 vs NT5CB256M16CP-DI 比較
詳細並排比較 W9751G6KB-25 由 Winbond 與 NT5CB256M16CP-DI 由 Nanya Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | W9751G6KB-25 | NT5CB256M16CP-DI |
|---|---|---|
| 品牌 | Winbond | Nanya Technology |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | Volatile DRAM (DDR2 SDRAM) | DDR3L SDRAM |
| 記憶體容量 | 512 Mbit (32M x 16) | — |
| 組織 | 32M words x 16 bits | 256M x 16 |
| Speed Grade | -25 (DDR2-800) | — |
| Clock Frequency | 400 MHz | — |
| 資料速率 | 800 MT/s | 1600 Mbps/pin (max) |
| Access Time | 57.5 ns (CAS latency timing window) | — |
| 供應電壓 | 1.8 V typical | 1.35 V (DDR3L) |
| 介面類型 | Parallel DDR2 (SSTL_18) | — |
| 封裝 | 84-ball WBGA / TFBGA, 8 x 12.5 mm | TFBGA-96 |
| Refresh Cycles | 8K (per JEDEC DDR2 standard) | — |
| Burst Length | 4 or 8 (programmable) | — |
| CAS 延遲 | Programmable (typically 3 to 6) | — |
| On-Die Termination | Yes (ODT) | — |
| Self Refresh | Yes | — |
| 工作溫度 | [DATA_NEEDED: operating temperature grade] | — |
| 安裝類型 | Surface Mount | — |
| RoHS 狀態 | Compliant | — |
| Density | — | 4 Gb |
| Number of Banks | — | 8 |
| CAS Latency (CL) | — | 5, 6, 7, 8, 9, 10, 11 |
| Write Latency (CWL) | — | 5, 6, 7, 8, 9 |
| Additive Latency | — | 0-13 |
| 工作溫度範圍 | — | -40°C to +95°C (industrial), -40°C to +105°C (automotive) |
| RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Differential Clock Input | — | Yes (CK, CK#) |
| On-Die Termination (ODT) | — | Yes |