10AS048E4F29I3LG - 480K LE Arria 10 SX SoC FPGA | Intel
MPN： 10AS048E4F29I3LG ✓ 啟用中10AS048E4F29I3LG 概覽
An SoC FPGA is a single silicon device that merges a general-purpose processor subsystem with programmable logic, allowing hardware accelerators and software tasks to share memory coherently. The Arria 10 SX family sits in the mid-range of Intel's FPGA portfolio, between Cyclone (low power) and Stratix (highest performance). It targets applications that need both DSP throughput and ARM application processing in one chip, reducing board space and simplifying data movement between CPU and fabric.
Key features of the 10AS048 include 480K logic elements (LEs), 28.4 Mbits of embedded memory, 1,560 DSP blocks (18x19 multipliers), and 24 transceivers operating up to 6.144 Gbps. The integrated HPS contains dual ARM Cortex-A9 MPCore CPUs with CoreSight debug, 32KB I-cache and 32KB D-cache per core, NEON media engine, and a rich set of peripherals including USB 2.0 OTG, Gigabit Ethernet, DDR3/4 controllers, and CAN. Four hard memory controllers support DDR4 up to 1,600 MHz.
The architecture pairs a serial fabric with variable-precision DSP blocks, allowing designers to implement wide data-path functions (FFT, FIR, modulation) while the ARM cores handle control-plane software, OS tasks, and high-level protocol stacks. PCIe Gen2 x4 hard IP blocks enable direct host attachment, and partial reconfiguration lets the FPGA re-load regions of logic on the fly. Industrial temperature range (-40C to +100C) supports harsh-environment deployments.
Typical applications include wireless baseband processing, radar and electronic-warfare signal chains, high-performance industrial imaging, software-defined radio, and test & measurement instruments. The SoC integration is particularly valuable when designers must run Linux or RTOS on the HPS while offloading latency-sensitive DSP into the fabric.
When designing with this device, plan the PCB layout around the 29x29 mm BGA with proper via-in-pad and microvia stack-ups; signal-integrity simulation is recommended for the 6.144 Gbps transceiver channels. The 0.9V core voltage requires multi-rail decoupling following Intel's pin-connection guidelines, and the HPS boot sequence must follow the Arria 10 SoC boot-from-flash reference flow to bring the Cortex-A9 cores out of reset cleanly.
This page synthesizes distributor pricing, drop-in alternatives drawn from the Arria 10 SX family, and practical design notes that go beyond the manufacturer datasheet to help engineers evaluate the 10AS048E4F29I3LG for new designs.
直接替換替代品，適用於 10AS048E4F29I3LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AS048E4F29I3LG （相同外形與佔位） — 差異在於 Package, Mounting Type, Operating Temperature, RoHS Status, Family.
10AS048E4F29E3LG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AS048E4F29E3SG
✅ 直接替換聯絡詢價
查看資料表 →10AS048E4F29I3SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AS048E3F29I3LG
✅ 直接替換📋 參考替代品（不在目錄中）
10AS048E2F29I3LG
✅ 直接替換📋 參考替代品（不在目錄中）
10AS048E4F29I3LG 最大額定值與電氣特性
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Embedded Memory | 28.4 Mbits |
| DSP Blocks | 1,560 (18x19 multipliers) |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Transceivers | 24 channels up to 6.144 Gbps |
| Hard Memory Controllers | 4 (DDR4 up to 1,600 MHz) |
| PCIe Hard IP | Gen2 x4 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz |
| 封裝 | 780-ball FC-FBGA (F29, 29x29 mm) |
| 工作溫度 | -40C to +100C (Industrial) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
10AS048E4F29I3LG 780-ball fc-fbga (f29, 29x29 mm) 腳位配置指南
10AS048E4F29I3LG（780-ball fc-fbga (f29, 29x29 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AS048E4F29I3LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AS048E4F29I3LG 適用於 6 應用s: Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Software-Defined Radio Platforms, High-Performance Industrial Imaging, Test & Measurement Instrumentation, Video Broadcast and Encoding.
Wireless Baseband Processing
The 10AS048E4F29I3LG's 1,560 DSP blocks and 28.4 Mbits embedded memory allow implementation of multi-antenna LTE/5G NR baseband receivers with up to 24x decimation chains running concurrently. Its 24 transceivers at 6.144 Gbps connect directly to ADC/DAC front-ends over CPRI or JESD204B/C links. The integrated ARM Cortex-A9 HPS runs the MAC layer and baseband control software in Linux or RTOS while deterministic DSP stays in the fabric. Compared with a discrete processor+FPGA solution, the SoC integration cuts latency between MAC and physical-layer accelerators by avoiding external memory round-trips.
推薦
Radar and Electronic Warfare Signal Processing
The 10AS048E4F29I3LG delivers up to 1.5 GMACs of DSP throughput via its 1,560 variable-precision DSP blocks, well-suited for phased-array radar beamforming, pulse compression, and FFT-based spectral analysis. Four hard memory controllers aggregate 25.6 GB/s of DDR4 bandwidth, feeding the multi-channel data path without fabric stalls. The 6.144 Gbps transceivers accept LVDS or serial ADC streams directly from RF front-ends, eliminating glue FPGAs. Industrial -40C to +100C operation supports ground-mobile and naval radar enclosures.
推薦
Software-Defined Radio Platforms
The 10AS048E4F29I3LG provides 480K logic elements for wideband channelizers and 24 transceivers up to 6.144 Gbps for multi-band RF front-ends, fitting tactical and commercial SDR form-factors. The HPS runs GNU Radio or custom DSP frameworks while fabric handles the latency-critical demodulation/decoding pipeline. PCIe Gen2 x4 links to host processors for high-volume offload when deployed as an accelerator card. Compared with discrete DSP+FPGA boards, the integrated HPS eliminates a processor chip and simplifies thermal design.
推薦
High-Performance Industrial Imaging
The 10AS048E4F29I3LG ingests multi-stream MIPI-CSI-2 or sub-LVDS image data through its 1.5 GHz fabric while the HPS runs Linux for ISP pipeline orchestration, defect detection, and machine-learning inference. 24 transceivers support CoaXPress or 10GigE Vision cameras directly. The 28.4 Mbits embedded memory serves as line/frame buffers with deterministic latency, and the ARM cores accelerate pre-processing stages otherwise offloaded to external processors. Compared with discrete processor + FPGA designs, this single-chip approach reduces PCB area and BOM cost.
推薦
Test & Measurement Instrumentation
The 10AS048E4F29I3LG suits modular oscilloscopes, BERTs, and protocol analyzers where 1,560 DSP blocks deliver real-time FFT, jitter decomposition, and signal conditioning on gigabit waveforms. The HPS runs the user-interface stack, instrument drivers, and LXI/SCPI command parsing over Gigabit Ethernet. Four hard DDR4 controllers feed waveform memory up to 25.6 GB/s, eliminating the need for external memory controllers. Industrial temperature range supports bench and field-deployed instruments.
推薦
Video Broadcast and Encoding
The 10AS048E4F29I3LG supports real-time HEVC/H.265 4K encode/decode at 60 fps using the 1,560 DSP blocks for motion estimation and transform pipelines. The HPS runs the broadcast control plane, while fabric handles deterministic encoder stages. Transceivers connect to 12G-SDI or SMPTE 2110 IP-based broadcast fabrics. Industrial temperature grade enables 24/7 broadcast equipment operation. Compared with ASIC encoders, the SoC FPGA allows in-field protocol upgrades as broadcast standards evolve.
推薦
推薦產品摘要
工程參考資料，適用於 10AS048E4F29I3LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AS048E4F29E3LG | 10AS048E4F29E3SG | 10AS048E4F29I3SG | 10AS048E3F29I3LG | 10AS048E2F29I3LG |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (F29, 29x29 mm) | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | -3 (fastest) | -3 | -3 | -3 | -2 (slower) | -1 (slowest) |
| Temperature Grade | Industrial (-40C to +100C) | Extended | Extended | Industrial | Industrial | Industrial |
| DSP Blocks | 1,560 | 1,560 | 1,560 | 1,560 | 1,560 | 1,560 |
| Transceivers | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
主要差異化特點
- Highest speed grade (-3) in F29 footprint (對比10AS048E2F29I3LG (-1 speed grade))
- Industrial temperature range in -3 speed grade (對比10AS048E4F29E3LG (extended temperature))
- Full Arria 10 SX resource complement (對比10AS032 variant (320K LEs))
設計說明
Estimated: The 10AS048E4F29I3LG dissipates up to approximately 40W in worst-case workloads at 1.5 GHz fabric + HPS utilization. With the FC-FBGA 29x29 mm package, attach a high-performance thermal interface material (TIM, e.g., 1.0 mm Indium foil or Shin-Etsu X-23-8032) and a heatsink with thermal resistance below 0.5 C/W to keep the junction below 100C. Forced-air cooling at 1-2 m/s is recommended for chassis-mounted applications.
The 780-ball FC-FBGA uses 1.0 mm ball pitch; route with HDI microvia stack-up (4-6-4 or better). Via-in-pad with filled/capped vias is recommended for signal balls, while ground balls benefit from short stitching vias to inner ground planes. Maintain 50 ohm controlled impedance on 6.144 Gbps transceiver channels and apply length matching within the limits specified in the Arria 10 SX transceiver user guide.
Estimated: Provide 0.9V core with at least 60A peak capability using a multi-phase buck controller (such as the LTC3887 or Renesas ISL8277M). Use 22uF/10V X7R ceramic capacitors in parallel with bulk polymer caps on each core rail; follow Intel's pin connection guidelines for VCC/VCCPT/VCCA/VCCP decoupling to avoid in-rush voltage droops during HPS boot.
Avoid using the 780-ball F29 footprint in a 1.05 mm-pitch assembly unless your contract manufacturer can handle BGA rework - mis-aligned BGA reballs frequently damage HPS core logic. For prototype development, request the 10AS048 development kit (Arria 10 SoC FPGA dev kit) to validate fabric+HPS boot flow before committing to PCB.
合規資訊
RoHS and REACH compliant per Intel material declaration. Industrial temperature grade; not AEC-Q100 qualified (no -Q1 automotive suffix).
