10AS057H2F34E2SG - Arria 10 SX SoC FPGA 570K LE | Intel
MPN： 10AS057H2F34E2SG ✓ 啟用中10AS057H2F34E2SG 概覽
An SoC FPGA is a class of embedded device that combines a general-purpose microprocessor subsystem with a programmable logic fabric on the same die, eliminating the need for a separate processor companion chip. This integration reduces board area, lowers system power, and enables tighter coupling between software tasks and hardware accelerators. Within the broader hierarchy, the Arria 10 SX sits between Intel's Cyclone (low-cost) and Stratix (high-performance) SoC families, targeting mid- to high-bandwidth applications in communications, industrial vision, and defense.
Key features of 10AS057H2F34E2SG include 570K logic elements, dual ARM Cortex-A9 cores with NEON media engine and single/double-precision FPU, up to 24 transceivers supporting protocols up to 14.1 Gbps (E2 speed grade), 156 full-precision 27x27 multipliers in DSP blocks, embedded hard memory controllers (DDR3/DDR4/LPDDR2/LPDDR3) in the HPS, and 1.5 GHz maximum HPS clock. The HPS includes ARM CoreSight debug, trace, and a rich peripheral set including USB, Gigabit Ethernet, SATA, and UART.
Architecture-wise, the device uses a 20nm TSMC process for the FPGA fabric and a separate 28nm process for the HPS die, connected via a high-bandwidth coherent interconnect. The hard processor system runs independently and coherently with the FPGA, enabling software-driven control loops and hardware-accelerated compute kernels on a single die. Power management features include per-block clock gating, voltage scaling, and hot-socketing support.
Typical applications include software-defined radio (SDR) baseband processing, industrial machine vision and video pipelines, radar and lidar pre-processing, medical imaging accelerators, and aerospace/defense signal processing. The combination of an application processor with FPGA fabric suits workloads where parallel hardware pipelines must be tightly orchestrated by an OS-hosted application.
When designing with this device, plan power sequencing for the HPS and FPGA rails separately, allocate 1-2 A per transceiver for bias, and use the Quartus Prime software toolchain for synthesis, place-and-route, and HPS firmware integration. Ensure the FC-FBGA-1152 PCB footprint matches the 35x35 mm body and use microvia stack-ups to escape the 1.0 mm pitch BGA.
This page synthesizes distributor pricing, same-package drop-in alternatives from the Arria 10 SX family, and practical design considerations not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 10AS057H2F34E2SG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AS057H2F34E2SG （相同外形與佔位） — 差異在於 Package, Logic Elements, Speed Grade, Mounting Type, RoHS Status.
10AS057H2F34E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AS057H1F34E1HG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AS048H4F34E3SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AS032H4F34E3SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AS048H3F34E2SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AS048H2F34E2SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AS057H2F34E2SG 最大額定值與電氣特性
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm (FPGA fabric) / 28 nm (HPS) |
| 封裝 | 1152-FBGA, FC (35x35 mm) |
| Ball Pitch | 1.0 mm |
| Speed Grade | E2 (extended temperature) |
| Core Voltage | 0.9 V nominal |
| 工作溫度 | -40C to +100C (extended grade) |
| 安裝類型 | Surface Mount |
| Supply Type | Tray |
| Transceiver Data Rate (max) | 14.1 Gbps |
| DSP Blocks | Yes (variable-precision, 27x27 multipliers) |
| RoHS 狀態 | Compliant |
10AS057H2F34E2SG 1152-fbga, fc (35x35 mm) 腳位配置指南
10AS057H2F34E2SG（1152-fbga, fc (35x35 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AS057H2F34E2SG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AS057H2F34E2SG 適用於 6 應用s: Software-Defined Radio (SDR) Baseband, Industrial Machine Vision, Radar and Lidar Pre-Processing, Medical Imaging Accelerators, Aerospace and Defense Signal Processing, 5G Small-Cell Baseband.
Software-Defined Radio (SDR) Baseband
The 10AS057H2F34E2SG's 570K logic elements and dual ARM Cortex-A9 HPS running at 1.5 GHz make it ideal for software-defined radio baseband processing. The FPGA fabric handles parallel digital down-conversion (DDC), channelization filters, and FFT kernels, while the HPS runs a real-time Linux OS for protocol stack and packet processing. With 14.1 Gbps transceivers, the device interfaces directly to RF ADCs/DACs (e.g., AD9371) and supports CPRI and 10GbE backhaul links. The tight HPS-to-FPGA coherent interconnect (AXI bridges) eliminates the latency of external processor-to-FPGA links.
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Industrial Machine Vision
The 10AS057H2F34E2SG suits high-throughput industrial machine vision pipelines where the HPS runs image pre-processing (debayering, lens correction) and an OS for camera control, while the FPGA fabric accelerates parallel pixel-pipeline operations (Sobel, Canny edge detection, CNN inference). The HPS peripherals — Gigabit Ethernet for GigE Vision cameras, USB for 3D sensors, and SATA for high-speed storage — enable direct integration without external glue. At 1.5 GHz HPS, the device handles 4K@60fps pre-processing while offloading feature extraction to the FPGA fabric.
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Radar and Lidar Pre-Processing
The 10AS057H2F34E2SG is well-suited to automotive and industrial radar/lidar pre-processing. The FPGA fabric handles high-bandwidth ADC sample ingestion (LVDS or JESD204B), range-Doppler FFT computation, and CFAR detection, while the HPS runs object tracking and classification algorithms. Its variable-precision DSP blocks enable power-efficient fixed-point math for FFT sizes up to 65k points. With 1.5 GHz HPS, the device can process 8 simultaneous radar channels in real time at sub-1 ms latency, critical for autonomous driving decision loops.
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Medical Imaging Accelerators
The 10AS057H2F34E2SG accelerates medical imaging workloads such as ultrasound beamforming, CT reconstruction, and MRI pre-processing. The FPGA fabric's parallel architecture handles thousands of ultrasound channel data streams simultaneously, while the HPS orchestrates image reconstruction and display. The device's medical-grade reliability and CoSight debug enable deterministic real-time performance required for diagnostic imaging. DDR3/DDR4 HPS controllers support high-bandwidth image data buffering for 3D/4D medical imaging modalities.
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Aerospace and Defense Signal Processing
The 10AS057H2F34E2SG serves aerospace and defense applications such as electronic warfare (EW), SIGINT, and secure communications. The extended temperature grade (-40C to +100C) and 14.1 Gbps transceivers support ruggedized, high-bandwidth processing platforms. The HPS runs a secure OS for crypto key management and protocol handling, while the FPGA fabric accelerates high-rate signal processing kernels. The device's wide operating temperature range and high-reliability BGA package suit airborne and ground-mobile deployments.
推薦
5G Small-Cell Baseband
The 10AS057H2F34E2SG is deployed in 5G small-cell baseband units where mid-density FPGA logic and HPS integration enable cost-effective PHY-layer processing. The FPGA fabric handles CPRI/JESD204B front-haul interface, channel coding (LDPC, Polar), and FFT/iFFT for OFDM, while the HPS runs a real-time OS for MAC scheduling and management-plane protocols. With 14.1 Gbps transceivers, the device supports 4T4R small-cell configurations at sub-6 GHz with low power envelope.
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推薦產品摘要
工程參考資料，適用於 10AS057H2F34E2SG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AS057H2F34E2LG | 10AS057H1F34E1HG | 10AS048H4F34E3SG | 10AS032H4F34E3SG |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 480,000 | 320,000 |
| HPS Maximum Frequency | 1.5 GHz | 1.5 GHz | 1.0 GHz | 1.5 GHz | 1.5 GHz |
| Speed Grade | E2 | E2 | E1 | E3 | E3 |
| Operating Temperature | -40C to +100C (extended) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Transceiver Max Data Rate | 14.1 Gbps | 14.1 Gbps | 17.4 Gbps | 12.5 Gbps | 12.5 Gbps |
| Process Technology | 20nm | 20nm | 20nm | 20nm | 20nm |
主要差異化特點
- 570K LE and dual ARM Cortex-A9 HPS in single package (對比10AX032E3F29E2SG)
- Higher logic density at the same E2 speed grade (對比10AS048H4F34E3SG)
- Mid-range Arria 10 SX with extended temperature grade (對比10AS032H4F34E3SG)
設計說明
The 1152-FBGA package requires a heatsink or cold-plate for sustained operation above 5W of total device power. Estimated: at typical HPS+FPGA utilization (40% logic toggle rate, 50% DSP utilization, 1.5 GHz HPS), junction power dissipation is approximately 8-12W. Use the Arria 10 thermal model (AN-786) to compute junction temperature from measured case temperature. A thermal interface material (TIM) with thermal conductivity >= 3.0 W/mK is recommended between the lid and heatsink.
The 35x35 mm FC-FBGA with 1.0 mm ball pitch requires a high-density PCB stack-up with microvia-in-pad (VIPPO) processing on the BGA breakout layer. Use a 12-layer or 14-layer PCB with 4-6 routing layers dedicated to BGA escape. Per Arria 10 AN-789 PCB design guide, route signal traces on the top layer under the BGA using escape vias to inner layers; keep reference planes continuous under the BGA for power integrity. Add 10uF X7R bypass capacitors at each power pin group within 50 mils of the pin.
The Arria 10 SX device requires multiple power rails: 0.9V core (VCC), 0.95V HPS core, 1.8V/2.5V/3.0V I/O banks (VCCIO), 1.8V PLL analog (VCCPLL), and transceiver supplies (VCCR/VCCP/VCCT). Each rail has a strict sequencing requirement; the Power Management Controller (PMC) manages hot-socketing and power sequencing per the Arria 10 Power Management User Guide. Use Intel-recommended PMICs such as the Enpirion EN6363QI for efficiency and sequencing compliance.
Do not omit the configuration source selection — Arria 10 SX supports JTAG, EPCQ flash, SD card, and HPS bootloader. Boot order is software-configurable but must be set via Quartus Prime pin assignments and the BootROM. Ensure the configuration flash (e.g., EPCQL1024) is sized for the FPGA bitstream plus any HPS preloader and bootloader images, which can total 32-64 MB for Linux systems.
For 14.1 Gbps transceiver operation (E2 speed grade), controlled impedance routing (100 ohm differential) with length matching within 5 mils per pair is required. Use Arria 10 transceiver channel simulation models (IBIS-AMI) with your stack-up to validate pre-emphasis and equalization settings. Reference Arria 10 Transceiver PHY User Guide for detailed channel loss budget and crosstalk analysis procedures.
合規資訊
RoHS and lead-free status per Intel/ALTERA product page. AEC-Q100 not applicable — this is an FPGA, not a discrete automotive-grade IC. See Intel's Conflict Minerals Report for CFSI compliance.
