10AX090U2F45E2LG - Arria 10 GX 900K LE FPGA | Intel | 1932-FCBGA
MPN： 10AX090U2F45E2LG ✓ 啟用中10AX090U2F45E2LG 概覽
A Field Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. FPGAs occupy the performance-and-flexibility tier between general-purpose microcontrollers and application-specific integrated circuits (ASICs), making them ideal for prototyping, low-volume production, and workloads requiring hardware-accelerated parallelism. The Arria 10 GX family is positioned in Intel's mid-range portfolio between Cyclone and Stratix devices, targeting transceiver-rich designs at lower power than equivalent Stratix 10 parts.
Key specifications include 900,000 logic elements, 59,234,304 bits of embedded memory, 480 user I/Os, transceivers up to 14.1 Gbps, and 20nm process technology. The -2 speed grade balances timing margin and Fmax, while the E2 extended temperature range spans 0C to 100C case temperature. The LG suffix indicates a lead-free, RoHS-compliant 1932-ball FCBGA package.
Architecturally, the device integrates hardened PCI Express Gen3 controllers, Gen2 hard memory controllers, partial reconfiguration support, and up to 96 transceiver channels. The transceiver fabric supports protocols including 10GbE, 40GbE, Interlaken, JESD204B, and CPRI, enabling single-chip implementation of wired communications, wireless baseband, and broadcast video pipelines.
Typical applications include high-throughput data acquisition systems, 4K video processing and broadcast, wireless baseband and remote radio heads, defense radar and signal intelligence, medical imaging accelerators, and ASIC prototyping. The combination of high logic density and embedded transceivers makes it well suited for systems that require parallel DSP combined with multi-gigabit serial I/O.
When designing with this part, allocate at least one full transceiver bank reference clock per quad, follow Intel's power-rail sequencing guidelines for the 0.9V core and 1.8V/2.5V/3.0V auxiliary rails, and respect the 1932-ball FCBGA PCB layout rules including microvia stackup, length-matched differential pairs, and thermal-via arrays under the lid for heat dissipation.
直接替換替代品，適用於 10AX090U2F45E2LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX090U2F45E2LG （相同外形與佔位） — 差異在於 Speed Grade, Operating Temperature Grade, Package, Process Technology, Embedded Memory.
10AX090U2F45E1SG
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✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
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查看資料表 →10AX090U2F45E2LG 最大額定值與電氣特性
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits |
| User I/O Pins | 480 |
| 封裝 | 1932-ball FCBGA |
| Process Technology | 20nm |
| Core Voltage | 0.9 V |
| Speed Grade | -2 |
| Temperature Range | 0C to 100C (E2 - extended) |
| Transceiver Data Rate | Up to 14.1 Gbps |
| PCI Express Hard IP | Gen3 (hardened) |
| Memory Controllers | Gen2 hard memory controllers |
| Configuration Method | Active serial, passive parallel, JTAG |
| RoHS 狀態 | Compliant |
| MSL 等級 | 4 (per JEDEC J-STD-020) |
10AX090U2F45E2LG 1932-ball fcbga 腳位配置指南
10AX090U2F45E2LG（1932-ball fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
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典型應用
10AX090U2F45E2LG 適用於 6 應用s: 4K Video Processing and Broadcast, Wireless Baseband and Remote Radio Head (RRH), Defense Radar and Signal Intelligence, Medical Imaging Accelerator, High-Throughput Data Acquisition, ASIC Prototyping.
4K Video Processing and Broadcast
The 10AX090U2F45E2LG is well suited for 4K video processing and broadcast applications. Its 900,000 logic elements deliver sufficient capacity for video scaling, deinterlacing, color space conversion, and HEVC preprocessing pipelines operating at 60 fps. The 14.1 Gbps transceivers support 12G-SDI and DisplayPort 1.4 interfaces commonly used in broadcast studio equipment. Hard memory controllers handle DDR4 frame buffers without consuming fabric resources, freeing the FPGA fabric for picture-quality algorithms. The -2 speed grade provides the timing margin required to close timing on 4K-wide datapaths at full frame rate.
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Wireless Baseband and Remote Radio Head (RRH)
The 10AX090U2F45E2LG serves wireless baseband and remote radio head designs with its 14.1 Gbps transceivers and high DSP block count. The device supports CPRI and OBSAI fronthaul links up to 12.5 Gbps per lane, enabling multi-sector 4G/5G RRH implementations. Hardened PCI Express Gen3 controllers connect to baseband processors, while the 900K logic elements implement channelization, FFT, and crest-factor reduction in a single chip. The 20nm process delivers the lowest power at the required performance, which is critical for outdoor RRH deployments with thermal constraints.
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Defense Radar and Signal Intelligence
The 10AX090U2F45E2LG is widely deployed in defense radar and signal intelligence systems. The 900K logic elements and 96 transceiver channels support multi-antenna phased-array radar with simultaneous receive paths. Embedded DSP blocks accelerate FFT and pulse compression at the high sample rates required for modern radar modes. The package's high pin count accommodates the multiple JESD204B ADC/DAC interfaces common in these designs. The -2 speed grade enables timing closure on 250 MHz+ datapaths that define modern EW and SAR systems.
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Medical Imaging Accelerator
The 10AX090U2F45E2LG accelerates medical imaging workloads including CT, MRI, and ultrasound reconstruction. The 900K logic elements implement back-projection, iterative reconstruction, and AI-assisted denoising in hardware, offloading compute from host processors. PCI Express Gen3 hard IP enables direct attachment to imaging server PCIe slots. The 59 Mbits of embedded memory provides low-latency scratchpad storage for reconstruction kernels, while DDR3/DDR4 controllers manage the multi-gigabyte image datasets typical of CT volumes. Low-power 20nm silicon is essential for clinic-side deployment.
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High-Throughput Data Acquisition
The 10AX090U2F45E2LG excels in high-throughput data acquisition systems used in scientific instrumentation and test equipment. The 14.1 Gbps transceivers interface to high-speed ADCs and DACs over JESD204B/C, aggregating multiple converter channels at sample rates exceeding 5 GSPS. The 900K logic elements implement real-time FFTs, channelization, and trigger logic on the streaming data. Embedded 59 Mbits of block memory buffers data between acquisition and processing stages, reducing external memory pressure. The -2 speed grade is essential for timing closure on the wide parallel datapaths.
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ASIC Prototyping
The 10AX090U2F45E2LG is frequently used as an ASIC prototyping platform. The 900K logic elements map the equivalent of 8-12 million ASIC gates, sufficient for mid-complexity SoC prototypes. Hardened PCI Express Gen3 and memory controllers allow validation of real-world I/O paths alongside the prototype logic. The 480 user I/Os and 14.1 Gbps transceivers replicate most ASIC interfaces at near-production speed. Quartus Prime supports ASIC-style partitioning and incremental compilation to shorten bring-up time, making the Arria 10 GX a productive prototyping vehicle.
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推薦產品摘要
工程參考資料，適用於 10AX090U2F45E2LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX090U2F45E1SG | 10AX090U2F45E2SG | 10AX090U1F45E1SG | 10AX090U1F45I1SG | 10AX090U3F45E2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| Speed Grade | -2 | -1 (slower) | -2 (same) | -1 (slower) | -1 (slower) | -3 (faster) |
| Temperature Range | 0C to 100C (E2) | 0C to 100C (E1) | 0C to 100C (E2) | 0C to 100C (E1) | -40C to 100C (I1 industrial) | 0C to 100C (E2) |
| Transceiver Rate (max) | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps |
| Process Technology | 20nm | 20nm | 20nm | 20nm | 20nm | 20nm |
主要差異化特點
- Highest speed grade in the LG finish option (對比10AX090U2F45E1LG / 10AX090U2F45E1SG)
- Lead-free LG package finish suitable for global RoHS markets (對比Older non-LG finishes (where available))
- Drop-in compatible with broader 10AX090U2F45 family (對比10AX090U1F45E1SG (U1 trim))
設計說明
Estimated: At 100% logic utilization with typical 0.85 core voltage and 70% toggle rate, the 10AX090U2F45E2LG dissipates approximately 25-35W. The 1932-ball FCBGA package requires a thermal-via array under the lid with at least 0.4 C/W board thermal resistance to ambient. Use a heatsink with 0.5 C/W or attach to a cold plate in forced-air systems. Without active cooling the junction temperature will exceed 100C in most realistic workloads.
The 1932-ball FCBGA demands a high-density PCB stackup: at minimum 1+6+1 with microvias on the top and bottom layers, 0.2mm ball pitch requires 0.4mm laser-drilled microvias. Reference Intel's Arria 10 hardware design guidelines for stackup recommendations. Maintain 100-ohm differential impedance for transceiver pairs and 50-ohm single-ended for general-purpose I/O. Length-match within 150 microns across transceiver lanes to meet 14.1 Gbps eye margins.
Sequence power rails in the order: 3.3V auxiliary, 1.8V/2.5V/3.0V I/O banks, then 0.9V core. The Intel Arria 10 Device Datasheet specifies the minimum ramp time and monotonicity requirements for each rail. Use a dedicated power management IC such as the LTC3615 or LTM4677 family with the Power Management feature in Quartus Prime. Decoupling capacitors must be placed within 100 mils of each power pin with 100 nF + 4.7 uF + 22 uF combinations.
Do not assume the 10AX090U2F45E2LG and 10AX090U2F45E2SG are interchangeable without verifying lead-free and RoHS requirements - the LG suffix denotes a specific lead-free finish. Configuration mode (AS, PS, JTAG) must be selected via MSEL pins with the exact resistor values in the datasheet. Mixed transceiver protocol and PCI Express configurations require careful Quartus Prime pin assignment to avoid lane conflicts in the same bank.
合規資訊
RoHS compliance per LG suffix in the part number. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade discrete. Halogen-free status not stated in verified web data.