10AX090U2F45I2LG - Arria 10 GX 900K LE FPGA | Intel / Altera
MPN： 10AX090U2F45I2LG ✓ 啟用中10AX090U2F45I2LG 概覽
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect fabric that an engineer can configure after manufacture using a hardware description language (HDL). The Arria 10 family specifically targets mid-range transceiver applications, balancing logic density, memory, transceivers, and I/O for power-aware designs; it sits below the high-end Stratix 10 family and above the lower-cost Cyclone 10 family in the Intel FPGA portfolio.
Key features of the 10AX090U2F45I2LG include 28nm process technology, a high-performance adaptive logic module (ALM) fabric, embedded hard IP for memory controllers and PCIe Gen3, and hard floating-point DSP blocks. The 1932-ball FCBGA package supports very high I/O count and multi-channel transceiver operation, while the F45 speed grade balances performance and power.
Architecturally, the device combines a fine-grained ALM fabric with hard PCIe Gen3 IP, hard memory controllers, and hardened floating-point DSP, enabling systems to offload compute-intensive functions without soft IP overhead. The industrial temperature grade and the high transceiver count make it well suited to communications infrastructure, broadcast video, and test equipment.
Typical applications include wireless baseband processing, 100G/400G networking line cards, broadcast video processing, ASIC prototyping, medical imaging, and high-performance industrial test equipment.
When designing with the 10AX090U2F45I2LG, plan thermal management for the 1932-ball FCBGA: top-side heatsink, high-CTR PCB stack-up, and proper via arrays under the thermal balls are required for sustained high utilization. Quartus Prime Pro is the recommended design toolchain.
This page synthesizes distributor pricing, drop-in alternatives within the Arria 10 family, and practical design notes that are not consolidated in the manufacturer datasheet alone.
直接替換替代品，適用於 10AX090U2F45I2LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX090U2F45I2LG （相同外形與佔位） — 差異在於 Speed Grade, Package, DSP Blocks, Logic Elements, Operating Temperature Grade.
10AX090U2F45I1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090U2F45E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090U2F45E2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090U2F45E1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090U1F45I1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090U1F45E1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090U2F45I2LG 最大額定值與電氣特性
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (Bits) | 59,234,304 |
| User I/O Count | 480 |
| Number of Terminals | 1932 |
| Package Type | 1932-BBGA, FCBGA |
| Package Code | BGA, FCBGA, square |
| Form of Terminal | Ball |
| Operating Temperature Grade | Industrial |
| Process Technology | 20 nm |
| Speed Grade | F45 |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
10AX090U2F45I2LG bga, fcbga, square 腳位配置指南
10AX090U2F45I2LG（bga, fcbga, square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX090U2F45I2LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX090U2F45I2LG 適用於 6 應用s: 100G/400G Networking Line Cards, Wireless Baseband Processing, Broadcast Video Processing, Medical Imaging Systems, ASIC Prototyping, High-Performance Industrial Test Equipment.
100G/400G Networking Line Cards
The 10AX090U2F45I2LG is well-suited for 100G/400G Ethernet line cards and switch fabrics because the Arria 10 GX architecture provides up to 28.3 Gbps transceivers (24 channels on this die), enabling multiple 100G ports with MAC and PCS hard IP offload. The 900K logic elements and 7.2 MB embedded memory handle packet headers, lookup tables, and traffic manager functions without external memory contention. The 480 user I/O support QSFP28 / QSFP-DD cage interfaces alongside board control logic. Industrial temperature grade ensures reliability in thermally-loaded switch chassis. Quartus Prime Pro provides hardened 100G MAC + PCS + FEC IP, accelerating time-to-market for telecom-grade designs.
推薦
Wireless Baseband Processing
The 10AX090U2F45I2LG serves wireless baseband and radio unit (RRU) baseband applications because the 900K LE fabric implements LTE and 5G NR physical-layer functions including channel coding, FFT/iFFT, and MIMO detection. The hardened floating-point DSP blocks deliver up to 1.5 TFLOPs compute density, offloading turbo decoder and LDPC functions from soft cores. High-speed transceivers connect directly to RF ADC/DAC via JESD204B/C interfaces, eliminating FPGA-to-converter glue logic. The 1932-ball FCBGA package supports the high I/O count required for multi-antenna radio designs. Industrial temperature grade supports outdoor and thermally-challenged base station installations.
推薦
Broadcast Video Processing
The 10AX090U2F45I2LG is widely deployed in broadcast video processing equipment, including contribution encoders, playout servers, and video routing switchers. The 7.2 MB embedded memory and 900K LE fabric implement multi-stream HEVC/H.264 encoding with motion estimation and rate control. High-speed transceivers handle uncompressed 12G-SDI / UHD-SDI interfaces for broadcast video routers, supporting SMPTE ST 2082 and ST 425 standards. The 480 user I/O support HDMI 2.0, DisplayPort 1.4, and SDI connectivity simultaneously. Industrial temperature grade and 1932-ball FCBGA package meet professional broadcast equipment thermal and reliability requirements for 24/7 operation.
推薦
Medical Imaging Systems
The 10AX090U2F45I2LG serves medical imaging systems such as CT, MRI, and ultrasound scanners because the 900K LE fabric implements real-time beamforming, image reconstruction (back-projection, FBP, iterative reconstruction), and DICOM preprocessing pipelines. The 7.2 MB embedded memory holds intermediate image slices, and the 24 transceiver channels connect to multi-element ultrasound transducer arrays at JESD204B rates. The industrial temperature grade supports continuous operation in medical equipment environments. PCI Express Gen3 hard IP enables direct attachment to host CPUs for image transfer. The 1932-ball FCBGA package provides the high I/O count required for parallel transducer interfaces.
推薦
ASIC Prototyping
The 10AX090U2F45I2LG is widely used as an ASIC prototyping platform because the 900K LE fabric maps medium-complexity ASIC RTL with reasonable timing closure on the F45 speed grade. The 7.2 MB embedded memory replaces SRAM macros, and the 480 user I/O support ASIC peripheral pinout emulation. Multiple Arria 10 devices can be partitioned on a single prototyping board using high-speed transceiver channels to bridge between FPGAs. Quartus Prime Pro supports ASIC-style synthesis flows and constraint entry. The 1932-ball FCBGA package provides a manufacturable form factor suitable for prototype bring-up labs and customer evaluation platforms before ASIC tape-out.
推薦
High-Performance Industrial Test Equipment
The 10AX090U2F45I2LG powers high-performance industrial test equipment including ATE, protocol analyzers, and high-speed digitizers. The 24 transceiver channels support multi-lane protocols such as PCIe Gen3, SATA, USB 3.0, and 10/40/100 Gigabit Ethernet in parallel, allowing a single device to exercise multiple DUT interfaces simultaneously. The 900K LE fabric implements protocol-aware test pattern generators and analyzers, while the 7.2 MB embedded memory buffers captured traces at line rate. Industrial temperature grade and the 1932-ball FCBGA package fit thermally-constrained PXI and LXI chassis. PCI Express Gen3 hard IP enables integration with host controller boards.
推薦
推薦產品摘要
工程參考資料，適用於 10AX090U2F45I2LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX090U2F45I1SG | 10AX090U2F45E2LG | 10AX090U2F45E2SG | 10AX090U2F45E1SG | 10AX090U1F45I1SG |
|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 900,000 | 900,000 - same | 900,000 - same | 900,000 - same | 900,000 - same | 900,000 - same |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 - same | 59,234,304 - same | 59,234,304 - same | 59,234,304 - same | 59,234,304 - same |
| User I/O | 480 | 480 - same | 480 - same | 480 - same | 480 - same | 480 - same |
| Speed Grade | F45 (U2) | F45 (U2) - same | F45 (U2) - same | F45 (U2) - same | F45 (U2) - same | F45 (U1, slower bin) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial - same range | Extended (E2) | Extended (E2) | Extended (E1) | Industrial - same range |
| Ball Finish | Lead-free (LG) | Tin-lead (SG) | Lead-free (LG) - same | Tin-lead (SG) | Tin-lead (SG) | Tin-lead (SG) |
主要差異化特點
- 900K LE fabric in midrange Arria 10 family with full 28.3 Gbps transceiver support (對比10AX090U1F45I1SG (same die, slower speed bin))
- Lead-free ball finish for RoHS-compliant production (對比10AX090U2F45I1SG (tin-lead ball finish))
- 1932-ball FCBGA exposes full 24-channel transceiver capability (對比10AX090S3F45I2LG (Arria 10 SX variant, 1932-ball FCBGA))
設計說明
Estimated: at full fabric utilization with all 24 transceivers active, the 10AX090U2F45I2LG can dissipate up to approximately 30W of total power in the 1932-ball FCBGA package. A top-side heatsink with thermal interface material is required, and the PCB stack-up should include a thermal via array under the package thermal balls to spread heat to internal copper planes. At sustained >85% utilization, forced-air cooling or a cold-plate is recommended for industrial temperature environments. Designers should refer to the Altera Arria 10 thermal management application note for case-to-ambient thermal resistance data.
The 1932-ball FCBGA package requires a high-layer-count PCB stack-up (typically 12 to 16 layers) with microvia-in-pad technology to fan out the dense ball grid. Impedance-controlled routing (100 ohm differential for transceivers, 50 ohm single-ended for general-purpose I/O) must be verified with a 3D EM field solver before tape-out. Length matching within transceiver channels must be within 5 mils per inch of trace length to meet 28.3 Gbps signal integrity. Power plane decoupling requires 0.1uF X7R capacitors at every FPGA power pin with short traces.
Do not confuse the Arria 10 GX (10AX090) variant with the Arria 10 SX (10AS090) variant - the SX has a dual-core ARM Cortex-A9 hard processor system with different HPS pin assignments and is NOT pin-compatible despite the similar part number. Similarly, do not substitute 10AX090 with 10AX115 (higher-density die) on the same PCB - the 115 has more transceivers and the same package footprint but additional power and ground pins may differ. Always verify the exact ball map against the Quartus Prime Pro Pin Planner before committing to a design.
Place the 10AX090U2F45I2LG close to the board edge nearest to external connectors (QSFP28 cages, SMA connectors for transceivers) to minimize high-speed trace lengths. Transceiver channels should be routed on inner stripline layers with reference planes on both sides to control impedance. The configuration flash memory (typically EPCQ-L or equivalent) should be placed within 6 inches of the FPGA configuration pins to ensure reliable AS configuration. JTAG chain components should be accessible for boundary-scan testing.
合規資訊
RoHS compliant per Altera product page (LG suffix = lead-free ball finish). Industrial temperature grade -40C to +100C. AEC-Q100 is not applicable for FPGAs in automotive grade; Altera offers automotive-qualified Cyclone V and Cyclone 10 devices for that segment.